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1. 发明专利

JP2011071471A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2011071471A
公开(公告)日：2011-04-07
申请号：JP2010094493
申请日：2010-04-15
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , SUEMATSU JIN , NISHIMURA MASAYASU
IPC分类号： H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED equipped with a reflection film maintaining a high reflection factor for a long period, to be stably and easily formed. SOLUTION: The lead frame 10 for an LED is constituted of laminating an Ni plating film 12a having a film thickness of ≥0.4 μm, an Ag plating film 12b having a film thickness of ≥0.2 μm and an Ag alloy film 13 containing 0.06-0.5 at% Ge and 0.02-0.2 at% Bi and having a film thickness of 20-500 nm on a substrate 11 composed of copper or copper alloy. By forming the Ni plating film 12a on the surface of the substrate 11, occurrence of discoloration due to thermal expansion of Cu from the inside of the substrate 11 to the surface is prevented. By forming the Ag alloy film 13 by a sputtering method, Ge and Bi are concentrated into the surface and heat resistance, halogenation resistance and sulfidation resistance are given. Further by forming the Ag plating film 12b having a comparatively large crystal grain size on a ground, the crystal grain size of the Ag alloy film 13 is increased, and Ag aggregation by heat is suppressed. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了能够稳定且容易地形成用于为配备有反射膜的反射膜的LED提供长期保持高反射率的引线框架。解决方案：LED的引线框架10由层压厚度≥0.4μm的Ni镀膜12a，膜厚度≥0.2μm的Ag镀膜12b和含有 0.06-0.5at％Ge和0.02-0.2at％Bi，并且在由铜或铜合金构成的基板11上具有20-500nm的膜厚度。通过在基板11的表面上形成Ni镀膜12a，可以防止由于基板11的内部向表面的Cu的热膨胀而发生变色。通过溅射法形成Ag合金膜13，将Ge和Bi浓缩成表面，得到耐热性，耐卤化性和耐硫化性。此外，通过在地面上形成具有比较大的晶粒尺寸的Ag镀膜12b，Ag合金膜13的晶粒尺寸增加，并且抑制了Ag的聚集。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2013128076A Led lead frame and manufacturing method of the same 有权
标题翻译： LED引线框架及其制造方法
公开(公告)号：JP2013128076A
公开(公告)日：2013-06-27
申请号：JP2011277610
申请日：2011-12-19
申请人： Kobe Steel Ltd , 株式会社神戸製鋼所 , Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： SUZUKI JUN , KATSURA SHOO , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED lead frame which includes a reflection film that can be easily formed and does not change a color and like due to a sulfur component thereby to maintain high reflectance for a long periods of time, and which is suitable for mounting by wire bonding and suitable for soldering.SOLUTION: A lead frame 1 comprises: an Ag plating film 12 having a film thickness of 0.6-8 μm; a metal intermediate film 13 composed of Ti, Zr, a Ti-base alloy or Zr-base alloy and having a film thickness of 1-15 nm; and a noble metal film 14 composed of Pd or Pt and having a film thickness of 2-50 nm, which are laminated on a substrate 11 composed of Cu or a Cu alloy. By coating the Ag plating film 12 with the metal intermediate film 13, contact of a halogen ion or sulfur with the Ag plating film 12 from outside is prevented, thereby achieving a reflection film having excellent durability. By providing the noble metal film 14 on an outermost surface, wire bondability and solderability are added.
摘要翻译：要解决的问题：提供一种LED引线框架，其包括能够容易地形成并且不会由于硫成分而改变颜色的反射膜，从而长期保持高反射率，并且适用于通过引线接合安装并适合焊接。引线框架1包括：具有0.6-8μm的膜厚度的Ag镀膜12; 由Ti，Zr，Ti基合金或Zr基合金构成的膜厚为1-15nm的金属中间膜13; 和由Pd或Pt构成的膜厚度为2-50nm的贵金属膜14层压在由Cu或Cu合金构成的基板11上。通过用金属中间膜13涂布Ag镀膜12，防止了卤素离子或硫与Ag镀膜12从外部的接触，从而实现了耐久性优异的反射膜。通过在最外表面上设置贵金属膜14，添加线接合性和可焊性。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012028139A Terminal for connection 有权
标题翻译：终端连接
公开(公告)号：JP2012028139A
公开(公告)日：2012-02-09
申请号：JP2010165145
申请日：2010-07-22
申请人： Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： MITSUI TOSHIYUKI , IZEKI SHIGERU , NISHIMURA MASAYASU
IPC分类号： H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a terminal for connection that reduces total inserting force and further has stable electric connection reliability.SOLUTION: The terminal 10 for connection can reduce the total insertion force and further has the stable electric connection reliability since a surface plating layer 14 made of In or alloy principally consisting of In is provided on a surface of a base material 11 made of Cu or Cu alloy, and a hard plating layer 13 which is harder than the surface plating layer 14 is formed as a primer of the surface plating layer 14.
摘要翻译：要解决的问题：提供一种降低总插入力的连接用端子，并且还具有稳定的电连接可靠性。解决方案：由于由In制成的表面镀层14或主要由In组成的表面镀层14设置在制成的基材11的表面上，所以用于连接的端子10可以减小总插入力并且还具有稳定的电连接可靠性的Cu或Cu合金，并且形成比表面镀层14硬的硬镀层13作为表面镀层14的底漆。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012212850A Lead frame for led and manufacturing method therefor 有权
标题翻译： LED框架及其制造方法
公开(公告)号：JP2012212850A
公开(公告)日：2012-11-01
申请号：JP2011245984
申请日：2011-11-09
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： KATSURA SHOO , SUZUKI JUN , SATO TOSHIKI , MITSUI TOSHIYUKI , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for LED including a reflection film that can accommodate wire bonding of an LED chip, can maintain high reflectance for a long term by applying a material of low cost in place of silver, and can be formed stably and easily.SOLUTION: The lead frame 1 includes a reflection film 13 having a thickness of 50 nm or more composed of aluminum or an aluminum alloy and formed on a substrate 11 composed of copper or a copper alloy, and a noble metal film 14 having a thickness of 5-50 nm consisting of one kind or more selected from Pd, Au, Pt and formed on the reflection film 13.
摘要翻译：要解决的问题：为了提供一种包括能够适应LED芯片的引线键合的反射膜的LED引线框架，通过应用低成本的材料代替银，可以长期保持高反射率，以及可以稳定且容易地形成。解决方案：引线框架1包括由铝或铝合金构成的厚度为50nm以上的反射膜13，形成在由铜或铜合金构成的基板11上，贵金属膜14具有厚度为5-50nm，由选自Pd，Au，Pt中的一种或多种构成并形成在反射膜13上。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012123953A Pcb terminal and method of manufacturing the same 有权
标题翻译： PCB端子及其制造方法
公开(公告)号：JP2012123953A
公开(公告)日：2012-06-28
申请号：JP2010272088
申请日：2010-12-07
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： MASAGO YASUSHI , TAIRA KOICHI , MITSUI TOSHIYUKI , KAKUMOTO JUNICHI , NISHIMURA MASAYASU
IPC分类号： H01R13/04 , H01R13/03
CPC分类号： H01R12/55 , C25D5/10 , H01R13/03 , Y10T29/49224
摘要： PROBLEM TO BE SOLVED: To provide an Sn coating layer and a Cu-Sn alloy coating layer having a proper controllable plan view in a PCB terminal where the Cu-Sn alloy coating layer and the Sn coating layer are formed in this order, as a surface coating layer, on the outermost surface of a fitting part to a female terminal, the Sn coating layer is smoothed by reflow treatment, and a part of the Cu-Sn alloy coating layer is exposed to the outermost surface.SOLUTION: An Sn coating layer group X observed as a plurality of parallel lines is formed as a surface coating layer, and a Cu-Sn alloy coating layer 2 is exposed to the outermost surface on both sides of individual Sn coating layers 1a-1d constituting the Sn coating layer group X. The width of the Sn coating layers 1a-1d is 1-500 μm, the interval of adjoining Sn coating layers is 1-2000 μm, and the maximum height roughness Rz of the outermost surface in the terminal insertion direction is 10 μm or less.
摘要翻译：要解决的问题：为了提供在PCB端子中具有适当可控平面图的Sn涂层和Cu-Sn合金涂层，其中Cu-Sn合金涂层和Sn涂层按此顺序形成作为表面被覆层，在与阴端子的嵌合部的最外表面上，通过回流处理使Sn被覆层平坦化，并且将Cu-Sn合金被覆层的一部分露出到最外表面。解决方案：形成作为多个平行线观察的Sn涂层组X作为表面涂层，并且将Cu-Sn合金涂层2暴露于各个Sn涂层1a两侧的最外表面 -1d。Sn涂层1a-1d的宽度为1-500μm，邻接的Sn涂层的间隔为1-2000μm，最外表面的最大高度粗糙度Rz 端子插入方向为10μm以下。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012089821A Electronic part material 有权
标题翻译：电子部件材料
公开(公告)号：JP2012089821A
公开(公告)日：2012-05-10
申请号：JP2011127581
申请日：2011-06-07
申请人： Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： MITSUI TOSHIYUKI , IZEKI SHIGERU , KATAYAMA SATORU , NISHIMURA MASAYASU , MATSUDA HIDEHARU
IPC分类号： H01L23/50
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic part material, usable in replace of Cu alloy, and capable of saving weight and reducing raw material cost.SOLUTION: The electronic part material includes a first plating layer 13, which is composed of any one or two or more kinds of Ni or Ni alloy, Cu or Cu alloy, Ag or Ag alloy, Sn or Sn alloy, Pd or Pd alloy, or Au or Au alloy, formed on a surface of an Al alloy substrate 10 to which an annealing treatment is performed to have tensile strength of 200 to 300 MPa and Vickers hardness Hv of 65 to 100.
摘要翻译：要解决的问题：提供可用于替代Cu合金的电子部件材料，并且能够节省重量并降低原材料成本。电解部件材料包括由Ni或Ni合金，Cu或Cu合金，Ag或Ag合金，Sn或Sn合金，Pd或Sn合金中的任何一种或两种以上组成的第一镀层13 Pd合金或Au或Au合金，形成在进行退火处理的Al合金基板10的表面上，其拉伸强度为200〜300MPa，维氏硬度Hv为65〜100。 C）2012，JPO＆INPIT

7. 发明专利

JP2011023704A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2011023704A
公开(公告)日：2011-02-03
申请号：JP2010094492
申请日：2010-04-15
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , OKAMOTO HIDEHITO , MITSUI TOSHIYUKI , SUEMATSU JIN , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L33/60
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an LED, the lead frame having a reflective film that maintains high reflectivity for a long period and is stably and easily formed. SOLUTION: The lead frame 10 for LED is formed by stacking a substrate 11 made of copper or copper alloy and an Ag alloy film 13 containing 0.06-0.5 at.% Ge and 0.02-0.2 at.% Bi across an Ag plating film 12 formed on a surface of the substrate, and the Ag alloy film 13 is formed by a sputtering method to concentrate Ge and Bi on a surface, thereby imparting heat resistance, resistance to halogenation, and resistance to sulfidization. Further, the film thickness of the Ag alloy film 13 which is not easily made thick is limited to 20-500 nm, and the total thickness including the Ag plating film 12 is set to ≥0.6 μm, thereby preventing discoloration due to diffusion of Cu from the substrate 11 to the surface. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于LED的引线框架，引线框架具有能够长期保持高反射率且稳定且容易地形成的反射膜。解决方案：用于LED的引线框架10通过将由铜或铜合金制成的基板11和含有0.06-0.5原子％Ge和0.02-0.2原子％Bi的Ag合金膜13堆叠在Ag镀层上而形成形成在基板表面上的膜12，通过溅射法形成Ag合金膜13，以将Ge和Bi集中在表面上，从而赋予耐热性，耐卤化性和耐硫化性。此外，不容易制成厚度的Ag合金膜13的膜厚度限制在20〜500nm，并且包括Ag镀膜12的总厚度设定为≥0.6μm，从而防止由于Cu的扩散而引起的变色从基板11到表面。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2012089638A Lead frame for led 有权
标题翻译： LED框架
公开(公告)号：JP2012089638A
公开(公告)日：2012-05-10
申请号：JP2010234227
申请日：2010-10-19
申请人： Kobe Steel Ltd , Shinko Leadmikk Kk , 株式会社神戸製鋼所 , 神鋼リードミック株式会社
发明人： SUZUKI JUN , SATO TOSHIKI , MITSUI TOSHIYUKI , NISHIMURA MASAYASU
IPC分类号： H01L33/62 , H01L23/48 , H01L33/60
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for LED having a reflective film which can keep a high reflectance for a long term, and which can be formed with stability and ease.SOLUTION: A lead frame 1 comprises: a substrate 11 made of copper or copper alloy; an Ag plating film 13 provided on the substrate 11 and having a thickness of 0.6 to 8 μm inclusive; and a metal oxide film 15 made of one metal or an alloy of two or more metals selected from a group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, and W, and formed on the Ag plating film 13 to have a thickness of 0.5 to 15 nm inclusive. The root mean square roughness of the surface of the lead frame on the side where the metal oxide film 15 is located is 30 nm or smaller. The metal oxide film 15 covering the Ag plating film 13 prevents the Ag plating film 13 from touching a halogen ion or sulfur coming from the outside, and thus the Ag plating film 13 makes a reflective film having an excellent durability.
摘要翻译：要解决的问题：提供一种具有能够长期保持高反射率并且可以稳定且容易地形成的具有反射膜的LED的引线框架。引线框架1包括：由铜或铜合金制成的基板11; 设置在基板11上并具有0.6〜8μm厚度的Ag镀膜13; 和由选自Ti，V，Cr，Zr，Nb，Mo，Hf，Ta和W中的两种或更多种金属的合金制成的金属氧化物膜15，并且在Ag镀膜上形成 13，其厚度为0.5〜15nm。引线框架在金属氧化物膜15所在一侧的表面的均方根粗糙度为30nm以下。覆盖Ag镀膜13的金属氧化物膜15防止Ag镀膜13接触来自外部的卤素离子或硫，因此Ag镀膜13形成具有优异耐久性的反射膜。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2012087411A Electronic component material 有权
标题翻译：电子元件材料
公开(公告)号：JP2012087411A
公开(公告)日：2012-05-10
申请号：JP2011239168
申请日：2011-10-31
申请人： Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： MITSUI TOSHIYUKI , ISEKI SHIGERU , KATAYAMA SATORU , NISHIMURA MASAYASU , MATSUDA HIDEHARU
IPC分类号： C25D7/00 , C22C21/00
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic component material which can be used as a substitute for Cu alloy, has light weight and can reduce raw material cost.SOLUTION: A first plating layer 13 is formed on the surface of a substrate 10 of Al alloy having a tensile strength of 90-700 MPa and a Vickers hardness of 30-230 Hv. The first plating layer 13 is composed of one or more of Ni, Ni alloy, Cu, Cu alloy, Ag, Ag alloy, Sn, Sn alloy, Pd, Pd alloy, Au and Au alloy. The Al alloy substrate 10 contains, for example, 13.0 mass% or less of Si, 1.5 mass% or less of Fe, 6.8 mass% or less of Cu, 1.5 mass% or less of Mn, 5.6 mass% or less of Mg, 0.5 mass% or less of Cr, 8.4 mass% or less of Zn, 0.2 mass% or less of Ti, and inevitable impurities.
摘要翻译：要解决的问题：提供可用作Cu合金的替代物的电子部件材料，重量轻并且可以降低原材料成本。解决方案：第一镀层13形成在拉伸强度为90-700MPa，维氏硬度为30-230Hv的Al合金的基材10的表面上。第一镀层13由Ni，Ni合金，Cu，Cu合金，Ag，Ag合金，Sn，Sn合金，Pd，Pd合金，Au和Au合金中的一种或多种组成。 Al合金基板10例如含有Si为13.0质量％以下，Fe为1.5质量％以下，Cu为6.8质量％以下，Mn为1.5质量％以下，Mg为5.6质量％以下， 0.5质量％以下的Cr，8.4质量％以下的Zn，0.2质量％以下的Ti和不可避免的杂质。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2011256415A Electronic part material 有权
标题翻译：电子部件材料
公开(公告)号：JP2011256415A
公开(公告)日：2011-12-22
申请号：JP2010130173
申请日：2010-06-07
申请人： Shinko Leadmikk Kk , 神鋼リードミック株式会社
发明人： MITSUI TOSHIYUKI , ISEKI SHIGERU , NISHIMURA MASAYASU
IPC分类号： C25D7/00 , C22C5/06 , C25D7/08 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide an electronic part material, in which an Ag-Bi alloy coating film layer having stable quality is formed to a target thickness inexpensively and moreover in high productivity.SOLUTION: In the electronic part material 10, an Ag-Bi alloy plating layer 12 containing Bi14 in a content of 0.01-3 atom% is provided on the surface of a base material 11. Thereby, the Ag-Bi alloy coating film layer having stable quality is formed to a target thickness inexpensively and moreover in high productivity. Also, the average thickness of the Ag-Bi alloy plating layer 12 is 0.2-10 μm.

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