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1. 发明专利

JP2006257018A Antiobestic agent, medicine and beverage or food 审中-公开
标题翻译：抗菌药物，药物和饮料或食品
公开(公告)号：JP2006257018A
公开(公告)日：2006-09-28
申请号：JP2005076302
申请日：2005-03-17
申请人： Asahi Breweries Ltd , Niigata Prefecture , Shinji Sato , Taimatsu Shokuhin Kk , アサヒビール株式会社 , たいまつ食品株式会社 , 佐藤眞治 , 新潟県
发明人： YASUE MASAAKI , IKEDA MITSUO , NAKAJIMA MASAHARU , SATO KAZUTO , SATO SHINJI , HIGUCHI MOTOTAKE
IPC分类号： A61K36/60 , A23L1/30 , A61K31/352 , A61P3/04
摘要： PROBLEM TO BE SOLVED: To provide an antiobestic agent, a medicine and a beverage or a food, each effective for prophylaxis and treatment of obesity. SOLUTION: (1) The antiobestic agent comprises a mulberry leaf or its extract and isoflavone as active ingredients. (2) The medicine comprises the antiobestic agent containing the mulberry leaf or its extract and isoflavone as active ingredients. (3) The beverage or the food comprises the antiobestic agent containing the mulberry leaf or its extract and isoflavone as active ingredients. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：待解决的问题：提供有效预防和治疗肥胖症的抗生物剂，药物和饮料或食品。解决方案：（1）抗生物剂包括桑叶或其提取物和异黄酮作为活性成分。（2）药物含有含有桑叶或其提取物和异黄酮作为活性成分的抗生素。（3）饮料或食品包含含有桑叶或其提取物和异黄酮作为活性成分的抗生物剂。版权所有（C）2006，JPO＆NCIPI

2. 发明授权

US09329496B2 Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium 有权
标题翻译：曝光装置，曝光方法，制造装置，程序和存储介质的方法
公开(公告)号：US09329496B2
公开(公告)日：2016-05-03
申请号：US13552140
申请日：2012-07-18
申请人： Shinji Sato
发明人： Shinji Sato
IPC分类号： G03B27/32 , G03B27/52 , G03B27/58 , H02K41/02 , G03F7/20 , H01L21/68
CPC分类号： G03F7/70716 , G03F7/70341 , H01L21/682
摘要： An exposure apparatus exposing a substrate with exposure light through liquid, including: an optical member having an emitting surface from which exposure light is emitted; a substrate holding apparatus that includes: a first holding portion holding a lower surface of substrate so that lower surface of substrate can be released, and a first member that defines an opening where substrate can be arranged, and that has an upper surface which is arranged at a vicinity of an upper surface of the substrate in a state which the substrate is held by the first holding portion; and a porous member of which at least a part is arranged at a gap between the substrate and the first member, and which has an upper surface liquid-repellent with respect to the liquid, wherein at least a part of the liquid which flows into the gap is recovered through the porous member.
摘要翻译：一种曝光装置，其中曝光光通过液体曝光，包括：具有发射曝光光的发射表面的光学构件; 一种基板保持装置，包括：第一保持部，其保持基板的下表面，使得可以释放基板的下表面;以及第一构件，其限定可以布置基板的开口，并且具有布置的上表面在所述基板被所述第一保持部保持的状态下，在所述基板的上表面的附近; 以及多孔部件，其至少一部分配置在所述基板和所述第一部件之间的间隙处，并且具有相对于所述液体的上表面防水性，其中流入所述液体的至少一部分液体间隙通过多孔构件回收。

3. 发明授权

US09290670B2 Conductive metallic coating material, method of corrosion prevention with conductive metallic coating material, and method of corrosion-preventive repair therewith 有权
标题翻译：导电金属涂层材料，导电金属涂层材料的防腐蚀方法及其防腐修补方法
公开(公告)号：US09290670B2
公开(公告)日：2016-03-22
申请号：US13266032
申请日：2010-04-21
申请人： Fabinia H. Romero , Yoshiko Nishijima , Haruo Hamaki , Shinji Sato , Taro Niki , Yasunori Motegi
发明人： Fabinia H. Romero , Yoshiko Nishijima , Haruo Hamaki , Shinji Sato , Taro Niki , Yasunori Motegi
IPC分类号： C09D5/24 , H01B1/22 , C09D5/10
CPC分类号： C09D5/24 , C09D5/103 , H01B1/22
摘要： Provided is a highly versatile conductive metallic coating material which is free from the limitation related to a facility without handling complication, and which can maintain its anticorrosive action for a long period. Specifically provided is a conductive metallic coating material which has an organic resin component and a metal component containing aluminum and magnesium and which exhibits a sacrificial anticorrosive reaction on iron. A content ratio of the metal component and the organic resin component is desirably 98:2 to 80:20 in terms of weight ratio. The conductive metallic coating material according to the present invention is usable for preventing corrosion of a building structure or a civil engineering structure and for repairing a corrosion proof treated surface of an existing building structure or a civil engineering structure.
摘要翻译：提供了一种高度通用的导电金属涂层材料，其不受处理并不适用于设备的限制，并且可长期保持其防腐蚀作用。具体地提供了一种导电金属涂层材料，其具有有机树脂组分和含有铝和镁的金属组分，并且在铁上表现出牺牲性防腐蚀反应。金属成分和有机树脂成分的含有比优选为98:2〜80:20（重量比）。根据本发明的导电金属涂层材料可用于防止建筑结构或土木工程结构的腐蚀，以及用于修复现有建筑结构或土木工程结构的防腐处理表面。

4. 外观设计

USD736440S1 Combination lamp for an automobile 有权
公开(公告)号：USD736440S1
公开(公告)日：2015-08-11
申请号：US29482956
申请日：2014-02-24
申请人： Shinji Sato , Shin Miyata , Yuri Kim
设计人： Shinji Sato , Shin Miyata , Yuri Kim

5. 发明授权

US09036438B2 Non-volatile storage with temperature compensation based on neighbor state information 有权
标题翻译：基于邻居状态信息的具有温度补偿的非易失性存储
公开(公告)号：US09036438B2
公开(公告)日：2015-05-19
申请号：US13486305
申请日：2012-06-01
申请人： Gerrit Jan Hemink , Shinji Sato
发明人： Gerrit Jan Hemink , Shinji Sato
IPC分类号： G11C7/04 , G11C11/56
CPC分类号： G11C16/26 , G11C7/04 , G11C11/5642
摘要： Data is programmed into and read from a set of target memory cells. When reading the data, temperature compensation is provided. The temperature compensation is based on temperature information and the state of one or more neighbor memory cells. In one embodiment, when data is read from set of target memory cells, the system senses the current temperature and determines the differences in temperature between the current temperature and the temperature at the time the data was programmed. If the difference in temperature is greater than a threshold, then the process of reading the data includes providing temperature compensation based on temperature information and neighbor state information. In one alternative, the decision to provide the temperature compensation can be triggered by conditions other than a temperature differential.
摘要翻译：数据被编程到一组目标存储器单元中并从其读取。读取数据时，提供温度补偿。温度补偿基于温度信息和一个或多个相邻存储单元的状态。在一个实施例中，当从目标存储器单元的集合读取数据时，系统感测当前温度并确定当前温度与数据编程时的温度之间的温度差。如果温度差大于阈值，则读取数据的过程包括基于温度信息和邻近状态信息提供温度补偿。在一个替代方案中，提供温度补偿的决定可以由温差以外的条件触发。

6. 发明授权

US08953143B2 Liquid immersion member 有权
标题翻译：液浸件
公开(公告)号：US08953143B2
公开(公告)日：2015-02-10
申请号：US12765410
申请日：2010-04-22
申请人： Shinji Sato
发明人： Shinji Sato
IPC分类号： G03B27/52 , G03F7/20
CPC分类号： G03F7/70341
摘要： A liquid immersion member is disposed around an optical member having an emergent surface from at least part of which exposure light is emitted and which holds a liquid between itself and an object opposing the emergent surface so that an optical path of exposure light between the emergent surface and the object is filled with a liquid to form an immersion space. The liquid immersion member comprises: an opening that recovers a liquid on the object with a gas; a space into which the liquid and the gas from the opening are entered; a recovery passageway into which only a liquid in the space is entered; an inner side surface that opposes at least part of a side surface of the optical member with a gap therebetween; and a recovery port that recovers at least part of a liquid in the gap.
摘要翻译：液浸部件设置在具有从出射表面的至少一部分的出射表面的光学部件的周围，其中，至少部分曝光光被发射并且在其自身与与出射表面相对的物体之间保持液体，使得在出射表面并且物体充满液体以形成浸没空间。液浸部件包括：用气体回收物体上的液体的开口; 从开口进入液体和气体的空间; 一个进入该空间的液体的回收通道; 与所述光学构件的侧面的至少一部分相对的内侧面，其间具有间隙; 以及恢复所述间隙中的液体的至少一部分的回收口。

7. 发明授权

US08937703B2 Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium 有权
标题翻译：液浸部件，浸渍曝光装置，液体回收方法，装置制造方法，程序和存储介质
公开(公告)号：US08937703B2
公开(公告)日：2015-01-20
申请号：US13180978
申请日：2011-07-12
申请人： Shinji Sato
发明人： Shinji Sato
IPC分类号： G03F7/20
CPC分类号： G03F7/709 , G03F7/70341
摘要： A liquid immersion member is disposed inside an immersion exposure apparatus and at least partly around an optical member and around an optical path of exposure light that passes through a liquid between the optical member and an object. The liquid immersion member comprises: a first member, which has a first surface, a second surface that faces a direction other than that faced by the first surface, and a plurality of holes that connects the first surface and the second surface, that recovers at least some of the liquid from the space above the object opposing the first surface via the holes; a recovery passageway, wherethrough the liquid recovered via the holes of the first member flows; and a discharge part, which separately discharges a liquid and a gas from the recovery passageway. The first member comprises a first portion and a second portion. The second portion hinders a gas flowing from a space between the object and the first surface into the recovery passageway via the holes more than the first portion does.
摘要翻译：浸液构件设置在浸没曝光装置的内部，并且至少部分地围绕光学构件并围绕通过光学构件和物体之间的液体的曝光光的光路。液浸构件包括：第一构件，其具有第一表面，面向除了由第一表面面对的方向的第二表面;以及多个孔，其连接第一表面和第二表面，其在通过所述孔从所述物体上方的与所述第一表面相对的空间中的至少一些液体; 回收通道，通过第一构件的孔回收的液体流过; 以及排出部，其从回收通路分别排出液体和气体。第一构件包括第一部分和第二部分。第二部分阻止气体从物体和第一表面之间的空间经由多于第一部分的孔流入回收通道。

8. 发明授权

US08921998B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US08921998B2
公开(公告)日：2014-12-30
申请号：US14236236
申请日：2012-08-24
申请人： Yusuke Zushi , Yoshinori Murakami , Satoshi Tanimoto , Shinji Sato , Kohei Matsui
发明人： Yusuke Zushi , Yoshinori Murakami , Satoshi Tanimoto , Shinji Sato , Kohei Matsui
IPC分类号： H01L23/10 , H01L23/34 , H01L23/538 , H01L23/373 , H01L23/00 , H01L25/07 , H01L23/498 , H01L25/18
CPC分类号： H01L23/5384 , H01L23/3735 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/18 , H01L2224/48091 , H01L2224/48132 , H01L2224/48227 , H01L2224/48235 , H01L2224/4846 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor module has a pair of semiconductor devices, a heat sink, a first electrode, an output electrode and a second electrode. The semiconductor devices are connected in series with each other and have first terminals that are electrically connected to a first power system and a second terminal that is electrically connected to a second power system. The first electrode is electrically connected both to one of the first terminal and to an electrode of one of the semiconductor devices. The output electrode is electrically connected both to the second terminal and to an electrode of the other of the semiconductor device. The second electrode is electrically connected to the other of the first terminals. The second electrode is connected to the heat sink via a first insulating member. The output electrode is connected to the second electrode via a second insulating member.
摘要翻译：半导体模块具有一对半导体器件，散热器，第一电极，输出电极和第二电极。半导体器件彼此串联连接并且具有电连接到第一电力系统的第一端子和电连接到第二电力系统的第二端子。第一电极电连接到第一端子中的一个和半导体器件中的一个的电极。输出电极与第二端子和半导体器件的另一个的电极电连接。第二电极与第一端子中的另一个电连接。第二电极通过第一绝缘构件连接到散热器。输出电极经由第二绝缘构件与第二电极连接。

9. 发明授权

US08916882B2 Switching circuit and semiconductor module 有权
标题翻译：开关电路和半导体模块
公开(公告)号：US08916882B2
公开(公告)日：2014-12-23
申请号：US14116890
申请日：2012-05-11
申请人： Yusuke Zushi , Yoshinori Murakami , Satoshi Tanimoto , Shinji Sato , Kohei Matsui
发明人： Yusuke Zushi , Yoshinori Murakami , Satoshi Tanimoto , Shinji Sato , Kohei Matsui
IPC分类号： H03K17/16 , H01L27/06 , H02M1/08
CPC分类号： H01L27/0629 , H01L27/0682 , H01L2224/48091 , H01L2224/48137 , H01L2224/49111 , H01L2924/19105 , H02M1/08 , H03K17/04123 , H03K17/166 , H01L2924/00014
摘要： A switching circuit includes: a first switching element (Q1); a resistor (11) inserted between a control electrode (G) of the first switching element (Q1) and a control circuit (13) switching the first switching element (Q1); and a first capacitor (15) and a second switching element (14) connected in series between the control electrode (G) of the first switching element (Q1) and a low potential-side electrode (S) of the first switching element (Q1). A high potential-side electrode of the second switching element (14) is connected to the control electrode (G) of the first switching element (Q1). An electrode of the first capacitor (15) is connected to the low potential-side electrode (S) of the first switching element (Q1). A control electrode of the second switching element (14) is connected to an electrode of the resistor (11) connected to the control circuit (13).
摘要翻译：开关电路包括：第一开关元件（Q1）; 插入在第一开关元件（Q1）的控制电极（G）和切换第一开关元件（Q1）的控制电路（13）之间的电阻器（11）; 以及串联连接在第一开关元件（Q1）的控制电极（G）和第一开关元件（Q1）的低电位侧电极（S）之间的第一电容器（15）和第二开关元件（14））。第二开关元件（14）的高电位侧电极连接到第一开关元件（Q1）的控制电极（G）。第一电容器（15）的电极与第一开关元件（Q1）的低电位侧电极（S）连接。第二开关元件（14）的控制电极连接到与控制电路（13）连接的电阻器（11）的电极。

10. 发明申请

US20140191250A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法和半导体器件
公开(公告)号：US20140191250A1
公开(公告)日：2014-07-10
申请号：US14234476
申请日：2012-07-27
申请人： Satoshi Tanimoto , Yusuke Zushi , Yoshinori Murakami , Takashi Iseki , Masato Takamori , Shinji Sato , Kohei Matsui
发明人： Satoshi Tanimoto , Yusuke Zushi , Yoshinori Murakami , Takashi Iseki , Masato Takamori , Shinji Sato , Kohei Matsui
IPC分类号： H01L23/00 , H01L29/16 , H01L29/20
CPC分类号： H01L29/1602 , B23K1/0016 , B23K1/008 , B23K1/19 , B23K1/206 , B23K35/007 , B23K35/025 , B23K35/282 , B23K35/286 , B23K2101/34 , B23K2101/40 , B23K2101/42 , C22C18/04 , H01L24/29 , H01L24/32 , H01L24/83 , H01L29/1608 , H01L29/2003 , H01L2224/29118 , H01L2224/32225 , H01L2224/83001 , H01L2224/83203 , H01L2224/83447 , H01L2224/83815 , H01L2924/01322 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/15747 , H01L2924/15787 , H01L2924/01013 , H01L2924/0103 , H01L2924/00
摘要： A method for manufacturing a semiconductor device is carried out by readying each of a semiconductor element, a substrate having Cu as a principal element at least on a surface, and a ZnAl solder chip having a smaller shape than that of the semiconductor element; disposing the semiconductor element and the substrate so that respective bonding surfaces face each other, and sandwiching the ZnAl eutectic solder chip between the substrate and the semiconductor element; increasing the temperature of the ZnAl solder chip sandwiched between the substrate and the semiconductor element while applying a load to the ZnAl solder chip such that the ZnAl solder chip melts to form a ZnAl solder layer; and reducing the temperature of the ZnAl solder layer while applying a load to the ZnAl solder layer.
摘要翻译：半导体器件的制造方法是通过将半导体元件，至少具有表面的Cu作为主要元素的基板和比半导体元件的形状小的ZnAl焊料芯片进行准位来进行的。将所述半导体元件和所述基板配置为使得各个接合面彼此面对，并将所述ZnAl共晶焊料夹在所述基板和所述半导体元件之间; 在向ZnAl焊料芯片施加负载的同时，增加夹在基板和半导体元件之间的ZnAl焊料芯片的温度，使得ZnAl焊料芯片熔化形成ZnAl焊料层; 并且在向ZnAl焊料层施加负载的同时降低ZnAl焊料层的温度。

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