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    • 4. 发明授权
    • Photodiode device including window defined in passivation layer for removing electrostatic charge
    • 光电二极管器件包括在钝化层中定义的窗口,用于去除静电电荷
    • US06873025B2
    • 2005-03-29
    • US09984657
    • 2001-10-30
    • Hideo WadaIsamu OhkuboKazuhiro NatsuakiNaoki FukunagaShigeki Hayashida
    • Hideo WadaIsamu OhkuboKazuhiro NatsuakiNaoki FukunagaShigeki Hayashida
    • H01L27/14H01L29/40H01L29/88H01L31/0216H01L31/06H01L31/10
    • H01L31/02161
    • A photodiode includes a first conductivity type semiconductor substrate or a first conductivity type semiconductor layer; a second conductivity type semiconductor layer provided on the first conductivity type semiconductor substrate or the first conductivity type semiconductor layer; an anti-reflection film provided on a surface of a portion of the second conductivity type semiconductor layer which is in a light receiving area; a first conductive layer provided in an area in the vicinity of the light receiving area; and a passivation layer provided on the first conductive layer. Light incident on the photodiode is detected by a junction of the one of the first conductivity type semiconductor substrate and the first conductivity type semiconductor layer, and the second conductivity type semiconductor layer. The area in the vicinity of the light receiving area includes a window area having an opening in the passivation layer for partially exposing the first conductive layer.
    • 光电二极管包括第一导电类型半导体衬底或第一导电类型半导体层; 设置在所述第一导电型半导体基板或所述第一导电型半导体层上的第二导电型半导体层; 设置在所述第二导电型半导体层的位于光接收区域的部分的表面上的防反射膜; 设置在所述光接收区域附近的区域中的第一导电层; 以及设置在第一导电层上的钝化层。 通过第一导电类型半导体衬底和第一导电类型半导体层之一以及第二导电类型半导体层的接合来检测入射在光电二极管上的光。 光接收区域附近的区域包括在钝化层中具有用于部分地暴露第一导电层的开口的窗口区域。
    • 7. 发明授权
    • Circuit-incorporating light receiving device
    • 电路结合光接收装置
    • US06492702B2
    • 2002-12-10
    • US09820341
    • 2001-03-29
    • Toshihiko FukushimaMasaru KuboShigeki Hayashida
    • Toshihiko FukushimaMasaru KuboShigeki Hayashida
    • H01L31075
    • H01L31/103H01L27/1443
    • A circuit-incorporating light receiving device comprises a first semiconductor substrate of a first conductivity type, a first semiconductor layer of the first conductivity type, a second semiconductor layer of the first conductivity type, a diffusion region of the second conductivity type, provided in a first portion of the second semiconductor layer of the first conductivity type, a circuit element provided in the first portion of the first semiconductor layer of the first conductivity type and a second portion of the second semiconductor layer of the first conductivity type. The second semiconductor layer of the first conductivity type and the diffusion region of the second conductivity type form a light detection photodiode portion, and the diffusion region of the second conductivity type has a diffusion depth less than or equal to a penetration depth of short-wavelength signal light.
    • 电路结合光接收装置包括第一导电类型的第一半导体衬底,第一导电类型的第一半导体层,第一导电类型的第二半导体层,第二导电类型的扩散区,设置在 第一导电类型的第二半导体层的第一部分,设置在第一导电类型的第一半导体层的第一部分中的电路元件和第一导电类型的第二半导体层的第二部分。 第一导电类型的第二半导体层和第二导电类型的扩散区域形成光检测光电二极管部分,并且第二导电类型的扩散区域具有小于或等于短波长穿透深度的漫射深度 信号灯。
    • 9. 发明授权
    • Method for controlling gate size for semiconduction process
    • 控制半导体栅极尺寸的方法
    • US5342796A
    • 1994-08-30
    • US887753
    • 1992-05-27
    • Sung T. AhnShigeki Hayashida
    • Sung T. AhnShigeki Hayashida
    • H01L21/336H01L21/265
    • H01L29/66613
    • A method for preparing a semiconductor device comprises the following steps: (I) depositing at least nitride film on the whole surface of a semiconductor substrate having a field oxide film, (II) removing a portion of the nitride film from a gate-formation region to form an opening at the nitride film up to the substrate, (III) thereafter forming by selective oxidation a vertically projecting oxide film on the substrate at the opening portion, (IV) then removing all the films including the oxide film and the nitride film each covering the substrate to form a dug part of the substrate at the gate formation region, (V) providing on the dug part a gate oxide film and a gate electrode in the order, (VI) doping an impurity ion into the substrate in a manner of self-alignment using the gate electrode as a mask, and (VII) applying heat treatment to the substrate to form an impurity-diffused region.
    • 一种制备半导体器件的方法包括以下步骤:(I)在具有场氧化膜的半导体衬底的整个表面上至少沉积氮化物膜,(II)从栅极形成区域去除一部分氮化物膜 在氮化膜上形成直到基板的开口,(III)然后通过选择性氧化在开口部分的基板上形成垂直突出的氧化膜,(IV),然后除去包括氧化物膜和氮化物膜的所有膜 每个覆盖衬底以在栅极形成区域形成衬底的挖出部分,(V)按顺序在栅极氧化膜和栅电极上提供栅极氧化物膜和栅电极;(VI)以杂质离子掺杂到衬底中 使用栅电极作为掩模的自对准方式,(VII)对基板进行热处理以形成杂质扩散区域。