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    • 4. 发明专利
    • CUTTER BIT
    • JPH07269293A
    • 1995-10-17
    • JP5860394
    • 1994-03-29
    • MITSUBISHI HEAVY IND LTDSUTAAROI SANGYO KK
    • YAMAMOTO YUTAKAHYODO KAZUYAOKAMOTO KAZUYUKIMOTONAMI SHIGERU
    • E21D9/087B23B27/14E21D9/08
    • PURPOSE:To enhance durability by defining the material of a cemented carbide tip for both ends of cutter bits as low hardness and high toughness out of cemented carbide tips installed in parallel to cutter bits and the material of a cemented carbide tip in the central part as high hardness and high toughness. CONSTITUTION:A tip mounting recessed part 14 is formed on the tip of a sheet- like base metal 13 which constitutes a mounting part of the base end. A plurality of cemented carbide tips 15, 16, 17 and 18 are fixed with the tip mounting recessed part 14 by brazing 16 in such a state that they may line up breadthwise. To braze with the tips 15 ad 18 on both ends, there is adopted a material having a low hardness and high toughness out of the cemented carbide tips 15, 16, 17 and 18. Then, when excavating a hard ground or the like by mounting a cutter bit 11 to a cutter head of a shield driving machine, a face pressure exerting on the chips 15 and 18 on both ends is reduced, thereby protecting the chips 15 and 18 from being damaged. Although the tips 15 and 18 are subjected to wear out during excavation work, the properties of the hardness and high toughness tips 16 and 17 prevents a drop in their wearing properties.
    • 8. 发明专利
    • FORMATION OF P-N JUNCTION
    • JPH03136235A
    • 1991-06-11
    • JP27428089
    • 1989-10-21
    • AGENCY IND SCIENCE TECHNSUTAAROI SANGYO KK
    • SATO MAMORUTOKUMARU YOZOSHIMOIYA YOSHINOBU
    • C01B21/076C01B21/072C23C14/48H01L21/203H01L21/265
    • PURPOSE:To form a uniform mixing layer on the surface of an Si wafer or the like and to form an electrically stable and superior thin film type N-type semiconductor to form a P-N junction by a method wherein a thin film type N-type semiconductor layer is formed on the surface of the P-type semiconductor by performing simultaneous ly an ion implantation and a vacuum deposition. CONSTITUTION:A thin film type N-type semiconductor layer is formed on the surface of a P-type semiconductor 7 by performing simultaneously an ion implantation and a vacuum, deposition. For example, an ionimplantation device is used as shown in the diagram, the P-type Si wafer single crystal 7 subjected to an ultrasonic cleaning is placed on a sample stand 17 toward the direction of an ion implantation and after the interior of the device is hermetically sealed, the interior is evacuated by a turbo- molecular pump up to reach 5X10 Torr or thereabouts. Then, in order to remove gaseous molecules being occluded in Al which is a deposition substance, Al placed on a deposition device 11 is preheated as a shutter is put up on the substrate 7. After that, while the amount of deposition of Al and the amount of N ions are respectively adjusted by a film thickness meter 12 and a current integrating meter 19, the shutter is opened to execute a mixing treatment and an AIN thin film is formed on the wafer 7.