专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20030073381A1 Workpiece carrier with adjustable pressure zones and barriers 有权
标题翻译：工件载体具有可调的压力区和屏障
公开(公告)号：US20030073381A1
公开(公告)日：2003-04-17
申请号：US09975450
申请日：2001-10-11
申请人： SpeedFam-IPEC Corporation
发明人： Daniel S. Mallery , Sean S. Logan , James F. Lee
IPC分类号： B24B049/00 , B24B051/00 , B24B005/00
CPC分类号： H01L21/6838 , B24B37/30 , B24B37/32 , B24B49/16 , H01L21/67253
摘要： A carrier with adjustable pressure zones and adjustable barriers between zones for distributing the pressure on the backside of a wafer. The pressure zones may be created using an elastic web diaphragm. One or more grooves are formed in the surface of the diaphragm to relieve vacuum formed between the diaphragm and wafer.
摘要翻译：具有可调节压力区域和区域之间可调节隔板的载体，用于在晶片的背面分配压力。可以使用弹性腹板隔膜来产生压力区域。在隔膜的表面中形成一个或多个凹槽以减轻隔膜和晶片之间形成的真空。

2. 发明申请

US20030020909A1 Method and apparatus for optical endpoint calibration in CMP 失效
标题翻译： CMP中光学端点校准的方法和装置
公开(公告)号：US20030020909A1
公开(公告)日：2003-01-30
申请号：US09829493
申请日：2001-04-09
申请人： SpeedFam-IPEC Corporation
发明人： John A. Adams , Robert A. Eaton , Charles Chen
IPC分类号： G01N021/00
CPC分类号： G01J3/28 , G01J2003/2866 , G01N21/274
摘要： The invention provides calibrated spectrometers in a multi-spectrometer system, where chemical mechanical polishing endpoint detection is an issue. In one aspect of the invention, a spectrometer is calibrated by selecting a filter slide having a predetermined light transmittance or reflectance variation with location (e.g. angular or linear displacement) on the slide. Light is incident on locations on the filter slide, and this incident light is either transmitted or reflected. Transmitted or reflected light is received by a spectrometer, and the wavelength measured is compared with the known wavelength that corresponds to its location on the slide. The spectrometer is calibrated by normalizing the wavelength readings obtained at various locations on the slide with the known readings dictated by the reference slide. The spectrometers are also calibrated to a standard light source for intensity of light. During polishing of workpieces, each spectrometer monitors surface spectral data, and converts these via its unique normalization factors to normalized values that are then compared with the normalized stored spectral data from the test piece. Once measured data (after normalization) approaches the endpoint set for the test piece within a predetermined degree of difference the endpoint of CMP has been reached and polishing may be manually or automatically terminated.
摘要翻译：本发明在多光谱仪系统中提供校准的光谱仪，其中化学机械抛光终点检测是一个问题。在本发明的一个方面中，通过选择具有预定光透射率或反射率变化与滤光片上的位置（例如角度或线性位移）的滤光片来校准光谱仪。光线入射到过滤器滑块上的位置，并且该入射光被传送或反射。通过光谱仪接收发射或反射的光，将测量的波长与对应于其在载玻片上的位置的已知波长进行比较。通过用参考幻灯片指定的已知读数对滑块上各个位置处获得的波长读数进行归一化来校准光谱仪。光谱仪也被校准为光强度的标准光源。在抛光工件期间，每个光谱仪监测表面光谱数据，并通过其独特的归一化因子将其转换成归一化值，然后将其与来自测试片的归一化存储的光谱数据进行比较。一旦测量数据（归一化后）在预定差异度内接近测试件的端点设置，则CMP的终点已经达到，抛光可以手动或自动终止。

3. 发明申请

US20020132561A1 Low amplitude, high speed polisher and method 失效
标题翻译：低振幅，高速抛光机和方法
公开(公告)号：US20020132561A1
公开(公告)日：2002-09-19
申请号：US09812655
申请日：2001-03-19
申请人： SpeedFam-IPEC Corporation
发明人： Stephen C. Schulz , John D. Herb
IPC分类号： B24B001/00
CPC分类号： B24B37/12 , B24B37/30 , H01L21/68764
摘要： A method and apparatus for improving uniformity of the rate of removal of material from the surface of a workpiece, such as semiconductor substrate, by polishing. In accordance with the invention, the workpiece is subjected to a vibratory polishing method, and optionally at least one additional polishing motion selected from rotational, oscillating, sweeping, orbital and linear polishing motions. As a result, polished workpieces, such as semiconductor wafers, have reduced surface defects, improved planarity, and are polished more uniformly over a wider area.
摘要翻译：一种用于通过抛光改善材料从诸如半导体衬底的工件的表面去除速率的均匀性的方法和装置。根据本发明，工件经历振动抛光方法，并且可选地，选择至少一种选自旋转，振荡，扫掠，轨道和线性抛光运动的另外的抛光运动。结果，诸如半导体晶片的抛光工件具有减少的表面缺陷，改善的平面性，并且在更广泛的区域上被更均匀地抛光。

4. 发明申请

US20020086617A1 ROTARY UNION FOR SEMICONDUCTOR WAFER APPLICATIONS 失效
标题翻译：用于半导体滤波器应用的旋转联系
公开(公告)号：US20020086617A1
公开(公告)日：2002-07-04
申请号：US09754510
申请日：2001-01-04
申请人： SPEEDFAM-IPEC CORPORATION
发明人： John Garcia , Andrew Yednak, III
IPC分类号： B24B001/00 , B24B007/19 , B24B007/30
CPC分类号： B24B57/02 , B24B37/04 , B24B41/047
摘要： A rotary union is provided for chemical/mechanical polishing of silicon wafers, especially silicon wafers containing chemically sensitive integrated circuit structures. A rotary union is provided with a union rotor and union stator, coupled at the free end of a support spindle carrying a CMP polishing table. In the preferred embodiment the rotary union is joined to a coolant union forming the lower end of the support spindle. A passageway through the union rotor extends past the bottom end of the coolant union rotating part to avoid contact of fluid transmitted through the passageway formed in the union rotor, with the rotating part of the coolant union.
摘要翻译：提供了一种旋转接头，用于硅晶片的化学/机械抛光，特别是含有化学敏感集成电路结构的硅晶片。旋转联接器设置有联接转子和联接定子，联接在承载CMP抛光台的支撑主轴的自由端。在优选实施例中，旋转接头连接到形成支撑心轴的下端的冷却剂接头。通过联合转子的通道延伸穿过冷却剂联合转动部分的底端，以避免与通过形成在联合转子中的通道传输的流体与冷却剂联合的旋转部分接触。

5. 发明申请

US20020067985A1 Work piece wand and method for processing work pieces using a work piece handling wand 失效
标题翻译：工件棒和使用工件处理棒加工工件的方法
公开(公告)号：US20020067985A1
公开(公告)日：2002-06-06
申请号：US09948836
申请日：2001-09-07
申请人： SpeedFam-IPEC Corporation
发明人： Daniel S. Mallery , Doug Kreager , Chris E. Barns
IPC分类号： B65H001/00
CPC分类号： H01L21/68707 , G11B23/00
摘要： A wafer handling wand allows the efficient loading and unloading of semiconductor wafers to and from a CMP apparatus. The wand includes identical work piece gripping, alignment, and loading/unloading mechanisms on the top and bottom sides. A processed wafer can be unloaded from the apparatus onto one side of the wand and an unprocessed wafer can be loaded into the apparatus from the second side. The gripping mechanism includes a support area and a spaced apart moveable gripping finger. Wafer loading is facilitated by a cam attached to the support area that rotates when the cam contacts the apparatus. Upon rotation, the cam provides a surface for directing the work piece into the apparatus. The surface of the cam also includes an alignment aid that can be brought into contact with a reference surface on the apparatus to insure proper alignment between the wand and the apparatus.
摘要翻译：晶片处理棒允许将半导体晶片有效地装载和从CMP装置卸载。魔杖包括顶部和底部上相同的工件夹紧，对准和装载/卸载机构。经处理的晶片可以从设备卸载到棒的一侧，并且未处理的晶片可以从第二侧装载到设备中。夹持机构包括支撑区域和间隔开的可移动夹持指状物。通过安装在凸轮接触设备时旋转的支撑区域的凸轮来促进晶片加载。在旋转时，凸轮提供用于将工件引导到设备中的表面。凸轮的表面还包括可与装置上的参考表面接触的对准辅助件，以确保魔杖和装置之间的适当对准。

6. 发明申请

US20020023719A1 Method and apparatus for removing a material layer from a substrate 审中-公开
公开(公告)号：US20020023719A1
公开(公告)日：2002-02-28
申请号：US09943487
申请日：2001-08-30
申请人： SpeedFam-IPEC Corporation
发明人： Yakov Epshteyn , Sumit Guha , Yehiel Gotkis , William J. Bellamak
IPC分类号： H01L021/302
CPC分类号： H01L21/02024 , B24B37/013 , B24B37/20 , B24B37/26
摘要： An improvement to chemical-mechanical polishing. The improvement includes using a buffing pad having a geometrically optimized shape along with optimizing the buff head diameter, offset O and overlay L. In one embodiment, the buffing pad is smaller than the buff head and is mounted eccentrically. In another embodiment, the buffing pad has a generally square outer shape. In another embodiment, the buff pad is circular and is the same size as the circular buff head. In another embodiment, the buffing pad has at least three radially extending arms. The optimal configuration is determined iteratively for a selected process by changing the buffing pad shape, buff head diameter, the offset and the overlay. For example, increasing the offset generally tends to increase the removal rate toward the edge of the wafer. Increasing the overlap generally tends to increase the removal rate toward the center of the wafer. Removing portions of the buffing pad near the pad's edge tends to decrease the removal rate over the entire wafer radius but more so near the center and the edge of the wafer. By empirically testing various configurations, the optimal configuration can be found for a particular application. The invention further provides a method of chemical-mechanical polishing of a semiconductor device utilizing a combination of polishing steps, including a first polishing step on a primary polish station using a first slurry and a second polishing step on a buff station using a second slurry. The method may be used on a material layer, such as copper or tungsten, deposited over a barrier layer covering a dielectric layer. The first polishing step is stopped after the material layer has been substantially removed and the second polishing step is stopped after the barrier layer has been substantially removed. An end-point detection system may be used to determine when the material and barrier layers have been substantially removed.

7. 发明申请

US20040195110A1 METHOD AND APPARATUS FOR ELECTROCHEMICAL PLANARIZATION OF A WORKPIECE 有权
标题翻译：工业电化学平面化方法与装置
公开(公告)号：US20040195110A1
公开(公告)日：2004-10-07
申请号：US10709598
申请日：2004-05-17
申请人： SPEEDFAM-IPEC CORPORATION
发明人： Ismail Emesh , Saket Chadda , Nikolay N. Korovin , Brian L. Mueller
IPC分类号： B23H005/00
CPC分类号： B24B37/20 , B23H5/08 , B24B37/12 , C25F3/02 , C25F7/00 , H01L21/32125 , H01L21/7684
摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
摘要翻译：用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。至少一个电导体位于压板内。电导体具有连接到电源的第一端。工件载体构造成承载工件并将工件压靠在抛光垫上。电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

8. 发明申请

US20020170574A1 Differential Cleaning for semiconductor wafers with copper circuitry 审中-公开
标题翻译：具有铜电路的半导体晶圆的差分清洁
公开(公告)号：US20020170574A1
公开(公告)日：2002-11-21
申请号：US09862657
申请日：2001-05-21
申请人： SpeedFam-IPEC Corporation
发明人： Justin M. Quarantello
IPC分类号： B08B003/02
CPC分类号： H01L21/0209 , B08B1/00 , B08B3/02 , H01L21/02063 , H01L21/02065 , H01L21/02074 , H01L21/6708
摘要： The invention provides a method for differentially applying cleaning chemistries to a silicon wafer that has undergone a polishing process whether chemical mechanical polishing or polishing with a fixed abrasive material. In accordance with the invention, cleaning fluid with a specific chemistry designed for cleaning the front side of the wafer is applied to the front side; while different chemistry specifically selected for more effectively cleaning the rear side of the wafer is applied to that side. This application of different chemistries to the two sides of the wafer is referred to as nulldifferential cleaningnull.
摘要翻译：本发明提供了一种用于将清洁化学品差异化地应用于已经经历抛光工艺的硅晶片的方法，所述抛光工艺是用化学机械抛光或用固定的研磨材料抛光。根据本发明，将设计用于清洁晶片正面的特定化学品的清洗液施加到前侧; 特别选择用于更有效地清洁晶片背面的不同化学物质被应用于该侧。不同化学物质对晶片两侧的这种应用被称为“差速清洗”。

9. 发明申请

US20020094759A1 Multi-zone pressure control carrier 有权
标题翻译：多区域压力控制载体
公开(公告)号：US20020094759A1
公开(公告)日：2002-07-18
申请号：US09761336
申请日：2001-01-16
申请人： SpeedFam-IPEC Corporation
发明人： Nikolay Korovin
IPC分类号： B24B001/00
CPC分类号： B24B37/30
摘要： A multi-zoned carrier for a chemical-mechanical planarization (CMP) polishing device includes a center cell, a middle cell, and an outer cell. Each of the cells are in fluid communication with each other through multiple conduits equipped with flow restrictors. The combination of cells and conduits allows more uniformity and planarity to be achieved during the chemical-mechanical planarization (CMP) polishing process.
摘要翻译：用于化学机械平面化（CMP）抛光装置的多区域载体包括中心单元，中间单元和外部单元。每个细胞通过配备有限流器的多个管道彼此流体连通。细胞和管道的组合允许在化学 - 机械平面化（CMP）抛光工艺期间实现更均匀性和平坦度。

10. 发明申请

US20020077049A1 Reinforced CMP carrier bladders 审中-公开
标题翻译：强化CMP载体气囊
公开(公告)号：US20020077049A1
公开(公告)日：2002-06-20
申请号：US09741489
申请日：2000-12-15
申请人： SpeedFam-IPEC Corporation
发明人： Clinton O. Fruitman , Timothy S. Dyer , Periya Gopalan , Wayne Lougher , Hatsuyuki Arai
IPC分类号： B24B005/00 , B24B047/02
CPC分类号： B24B37/30 , B24B41/061
摘要： A reinforced bladder for a chemical-mechanical planarization (CMP) polishing device includes an elastomer infused with a reinforcing material. The elastomer can be a rubber such as EPDM. The reinforcing material can be a chopped fiber such as aramid. Alternatively, the reinforcing material can be a sheet (such as a triaxial or hexaxial weave of aramid) embedded in and infused with the elastomer.
摘要翻译：用于化学机械平面化（CMP）抛光装置的加强气囊包括注入增强材料的弹性体。弹性体可以是EPDM等橡胶。增强材料可以是诸如芳族聚酰胺的短切纤维。或者，增强材料可以是嵌入并注入弹性体的片材（例如芳族聚酰胺的三轴或六边形编织物）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式