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1. 发明申请

US20030020909A1 Method and apparatus for optical endpoint calibration in CMP 失效
标题翻译： CMP中光学端点校准的方法和装置
公开(公告)号：US20030020909A1
公开(公告)日：2003-01-30
申请号：US09829493
申请日：2001-04-09
申请人： SpeedFam-IPEC Corporation
发明人： John A. Adams , Robert A. Eaton , Charles Chen
IPC分类号： G01N021/00
CPC分类号： G01J3/28 , G01J2003/2866 , G01N21/274
摘要： The invention provides calibrated spectrometers in a multi-spectrometer system, where chemical mechanical polishing endpoint detection is an issue. In one aspect of the invention, a spectrometer is calibrated by selecting a filter slide having a predetermined light transmittance or reflectance variation with location (e.g. angular or linear displacement) on the slide. Light is incident on locations on the filter slide, and this incident light is either transmitted or reflected. Transmitted or reflected light is received by a spectrometer, and the wavelength measured is compared with the known wavelength that corresponds to its location on the slide. The spectrometer is calibrated by normalizing the wavelength readings obtained at various locations on the slide with the known readings dictated by the reference slide. The spectrometers are also calibrated to a standard light source for intensity of light. During polishing of workpieces, each spectrometer monitors surface spectral data, and converts these via its unique normalization factors to normalized values that are then compared with the normalized stored spectral data from the test piece. Once measured data (after normalization) approaches the endpoint set for the test piece within a predetermined degree of difference the endpoint of CMP has been reached and polishing may be manually or automatically terminated.
摘要翻译：本发明在多光谱仪系统中提供校准的光谱仪，其中化学机械抛光终点检测是一个问题。在本发明的一个方面中，通过选择具有预定光透射率或反射率变化与滤光片上的位置（例如角度或线性位移）的滤光片来校准光谱仪。光线入射到过滤器滑块上的位置，并且该入射光被传送或反射。通过光谱仪接收发射或反射的光，将测量的波长与对应于其在载玻片上的位置的已知波长进行比较。通过用参考幻灯片指定的已知读数对滑块上各个位置处获得的波长读数进行归一化来校准光谱仪。光谱仪也被校准为光强度的标准光源。在抛光工件期间，每个光谱仪监测表面光谱数据，并通过其独特的归一化因子将其转换成归一化值，然后将其与来自测试片的归一化存储的光谱数据进行比较。一旦测量数据（归一化后）在预定差异度内接近测试件的端点设置，则CMP的终点已经达到，抛光可以手动或自动终止。

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