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2. 发明申请

US20020067985A1 Work piece wand and method for processing work pieces using a work piece handling wand 失效
标题翻译：工件棒和使用工件处理棒加工工件的方法
公开(公告)号：US20020067985A1
公开(公告)日：2002-06-06
申请号：US09948836
申请日：2001-09-07
申请人： SpeedFam-IPEC Corporation
发明人： Daniel S. Mallery , Doug Kreager , Chris E. Barns
IPC分类号： B65H001/00
CPC分类号： H01L21/68707 , G11B23/00
摘要： A wafer handling wand allows the efficient loading and unloading of semiconductor wafers to and from a CMP apparatus. The wand includes identical work piece gripping, alignment, and loading/unloading mechanisms on the top and bottom sides. A processed wafer can be unloaded from the apparatus onto one side of the wand and an unprocessed wafer can be loaded into the apparatus from the second side. The gripping mechanism includes a support area and a spaced apart moveable gripping finger. Wafer loading is facilitated by a cam attached to the support area that rotates when the cam contacts the apparatus. Upon rotation, the cam provides a surface for directing the work piece into the apparatus. The surface of the cam also includes an alignment aid that can be brought into contact with a reference surface on the apparatus to insure proper alignment between the wand and the apparatus.
摘要翻译：晶片处理棒允许将半导体晶片有效地装载和从CMP装置卸载。魔杖包括顶部和底部上相同的工件夹紧，对准和装载/卸载机构。经处理的晶片可以从设备卸载到棒的一侧，并且未处理的晶片可以从第二侧装载到设备中。夹持机构包括支撑区域和间隔开的可移动夹持指状物。通过安装在凸轮接触设备时旋转的支撑区域的凸轮来促进晶片加载。在旋转时，凸轮提供用于将工件引导到设备中的表面。凸轮的表面还包括可与装置上的参考表面接触的对准辅助件，以确保魔杖和装置之间的适当对准。

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