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1. 发明授权

US5491319A Laser ablation apparatus and method 失效
标题翻译：激光消融装置及方法
公开(公告)号：US5491319A
公开(公告)日：1996-02-13
申请号：US359228
申请日：1994-12-19
申请人： Laertis Economikos , Robert Hannon , Richard P. Surprenant
发明人： Laertis Economikos , Robert Hannon , Richard P. Surprenant
IPC分类号： B23K26/06
CPC分类号： B23K26/066
摘要： A laser ablation apparatus and method removes undesired portions of a workpiece. An industrial laser generates a beam of optical energy and directs the beam at the workpiece. A mechanism in the path of the beam for shapes the cross-section of the beam and includes first and second linear actuators on opposite sides of the beam path. Each of the actuators includes a plurality of linear members, with each linear member being adjacent to and in contact with another linear member, and means for individually inserting and retracting each of said members into and out of said beam path a desired distance to thereby shape the beam so as to ablate only undesired portions of the workpiece.
摘要翻译：激光烧蚀装置和方法去除工件的不期望的部分。工业激光产生光束并将光束引导到工件处。梁的路径中的机构，用于使梁的横截面成形，并且包括在光束路径的相对侧上的第一和第二线性致动器。每个致动器包括多个线性构件，每个线性构件与另一直线构件相邻并与其接触;以及用于将每个所述构件单独地插入和退出所述梁路径并使其离开所需距离的装置，从而形成梁，以便仅烧蚀工件的不期望的部分。

2. 发明授权

US5384953A Structure and a method for repairing electrical lines 失效
标题翻译：电线修复的结构和方法
公开(公告)号：US5384953A
公开(公告)日：1995-01-31
申请号：US94633
申请日：1993-07-21
申请人： Laertis Economikos , Richard P. Surprenant
发明人： Laertis Economikos , Richard P. Surprenant
IPC分类号： H01L23/12 , H01L21/48 , H05K1/09 , H05K3/00 , H05K3/22 , H05K3/02
CPC分类号： H01L21/485 , H05K3/225 , H01L2924/0002 , H05K1/095 , H05K2201/09063 , H05K2201/10234 , H05K2203/0769 , H05K2203/107 , H05K2203/121 , H05K2203/1338 , H05K2203/173 , H05K3/0017 , Y10T29/49155 , Y10T29/49718 , Y10T29/49746
摘要： The present invention relates generally to a new structure and a method for repairing electrical lines, and more particularly, the invention encompasses a structure and a method for repairing electrical lines on a ceramic or a semiconductor substrate. On a substrate that has an open or an electrical discontinuity, one or more trenches or grooves are made next to the open, or discontinuity and using standard deposition process one or more metals are deposited in the open to provide or restore electrical continuity while the excess deposition material is allowed to drain or propagate into the trench.
摘要翻译：本发明一般涉及一种用于修复电线的新结构和方法，更具体地，本发明包括用于修复陶瓷或半导体衬底上的电线的结构和方法。在具有开放或电气不连续性的基板上，在开放或不连续的旁边制造一个或多个沟槽或凹槽，并且使用标准沉积工艺，一个或多个金属沉积在开口中以提供或恢复电连续性，同时过量允许沉积材料排出或传播到沟槽中。

3. 发明授权

US4438039A Titanium chelate catalyst for silicone compositions 失效
标题翻译：用于硅酮组合物的钛螯合催化剂
公开(公告)号：US4438039A
公开(公告)日：1984-03-20
申请号：US165327
申请日：1980-07-02
申请人： Melvin D. Beers , Richard P. Surprenant
发明人： Melvin D. Beers , Richard P. Surprenant
IPC分类号： C08L83/00 , B01J31/22 , C07C49/92 , C08G77/00 , C08G77/08 , C08K5/00 , C08K5/05 , C08K5/07 , C08L83/04 , C07F7/28
CPC分类号： C07C49/92 , C08K5/0091
摘要： A titanium chelate catalyst for a room temperature vulcanizable silicone rubber compositions which does not form nodules upon storage where the catalyst has the formula, ##STR1## where s varies from 0.7 to 1.3 and t varies from 0.7 to 1.3. Preferably s varies from 0.8 to 1.2 and t varies from 0.8 to 1.2.
摘要翻译：一种用于室温可硫化硅橡胶组合物的钛螯合催化剂，其在储存时不形成结节，其中催化剂具有下式，其中s从0.7变化到1.3，t从0.7变化到1.3。优选地，s从0.8变化到1.2，t从0.8变化到1.2。

4. 发明授权

US08645875B2 Method for quantifying the manufacturing complexity of electrical designs 有权
标题翻译：量化电气设计制造复杂度的方法
公开(公告)号：US08645875B2
公开(公告)日：2014-02-04
申请号：US12914367
申请日：2010-10-28
申请人： Michael S. Cranmer , Richard P. Surprenant
发明人： Michael S. Cranmer , Richard P. Surprenant
IPC分类号： G06F17/50 , G06K9/00
CPC分类号： G01R31/2848 , G06T7/0006 , G06T2207/30141
摘要： A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.
摘要翻译：用于量化电气设计的制造复杂性的方法和系统随机地将模拟缺陷放置在表示电气接线设计的图像数据上。确定了没有模拟缺陷的图像数据中不同特征的数量和具有模拟缺陷的图像数据中不同特征的数量，并且得到两者之间的差异。差值用作短路电位的指示或在电气布线设计中可能发生布线短路的概率。可以重复对图像数据中的缺陷的模拟，并且可以使用来自每个模拟或运行的差值来获得设计的统计平均值或代表性的短路电位或概率。

5. 发明授权

US06235544B1 Seed metal delete process for thin film repair solutions using direct UV laser 失效
标题翻译：种子金属删除工艺用于使用直接UV激光的薄膜修复解决方案
公开(公告)号：US06235544B1
公开(公告)日：2001-05-22
申请号：US09295131
申请日：1999-04-20
申请人： Peter A. Franklin , Charles J. Hendricks , Richard P. Surprenant , Stephen J. Tirch, III , Thomas A. Wassick , James P. Wood
发明人： Peter A. Franklin , Charles J. Hendricks , Richard P. Surprenant , Stephen J. Tirch, III , Thomas A. Wassick , James P. Wood
IPC分类号： G01R3126
CPC分类号： H01L21/485
摘要： A multilayer thin film structure (MLTF) is provided having no extraneous via-pad connection strap plated metallurgy for defective vias needing removal. The method for making or repairing the MLTF comprises determining interconnection defects in the MLTF at a thin film layer adjacent to the top metal layer of the structure, applying a top surface dielectric layer and forming vias in the layer, applying a metal conducting layer and removing the metal conducting layer for via-pad connection straps of defective vias and at the intersection of XY lines used in the repair, defining the top surface metallization including a series of orthogonal X conductor repair lines and Y conductor repair lines using a photoresist and lithography and then using a phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization using additive or subtractive metallization techniques.
摘要翻译：提供了一种多层薄膜结构（MLTF），其中没有外部通孔焊盘连接带电镀冶金用于需要去除的缺陷通孔。用于制造或修复MLTF的方法包括：在与该结构的顶部金属层相邻的薄膜层处确定MLTF中的互连缺陷，施加顶表面介电层并在该层中形成通孔，施加金属导电层并除去用于通孔焊盘连接带的金属导电层和用于修复的XY线的相交处，限定包括一系列正交X导体修复线的顶表面金属化和使用光致抗蚀剂和光刻的Y导体修复线，然后使用光学工具选择性地暴露光致抗蚀剂以限定修复互连和/或制造EC所需的顶表面带连接，以及使用添加或减色金属化技术形成顶表面金属化。

6. 发明申请

US20110038525A1 METHOD FOR QUANTIFYING THE MANUFACTURING COMPLEXITY OF ELECTRICAL DESIGNS 有权
标题翻译：用于定量电气设计的制造复杂度的方法
公开(公告)号：US20110038525A1
公开(公告)日：2011-02-17
申请号：US12914367
申请日：2010-10-28
申请人： Michael S. Cranmer , Richard P. Surprenant
发明人： Michael S. Cranmer , Richard P. Surprenant
IPC分类号： G06K9/00
CPC分类号： G01R31/2848 , G06T7/0006 , G06T2207/30141
摘要： A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.
摘要翻译：用于量化电气设计的制造复杂性的方法和系统随机地将模拟缺陷放置在表示电气接线设计的图像数据上。确定了没有模拟缺陷的图像数据中不同特征的数量和具有模拟缺陷的图像数据中不同特征的数量，并且得到两者之间的差异。差值用作短路电位的指示或在电气布线设计中可能发生布线短路的概率。可以重复对图像数据中的缺陷的模拟，并且可以使用来自每个模拟或运行的差值来获得设计的统计平均值或代表性的短路电位或概率。

7. 发明授权

US07873936B2 Method for quantifying the manufactoring complexity of electrical designs 有权
标题翻译：量化电气设计制造复杂度的方法
公开(公告)号：US07873936B2
公开(公告)日：2011-01-18
申请号：US11969495
申请日：2008-01-04
申请人： Michael S. Cranmer , Richard P. Surprenant
发明人： Michael S. Cranmer , Richard P. Surprenant
IPC分类号： G06F17/50 , G06K9/00
CPC分类号： G01R31/2848 , G06T7/0006 , G06T2207/30141
摘要： A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.
摘要翻译：用于量化电气设计的制造复杂性的方法和系统随机地将模拟缺陷放置在表示电气接线设计的图像数据上。确定了没有模拟缺陷的图像数据中不同特征的数量和具有模拟缺陷的图像数据中不同特征的数量，并且得到两者之间的差异。差值用作短路电位的指示或在电气布线设计中可能发生布线短路的概率。可以重复对图像数据中的缺陷的模拟，并且可以使用来自每个模拟或运行的差值来获得设计的统计平均值或代表性的短路电位或概率。

8. 发明授权

US06916670B2 Electronic package repair process 失效
标题翻译：电子封装修复过程
公开(公告)号：US06916670B2
公开(公告)日：2005-07-12
申请号：US10358431
申请日：2003-02-04
申请人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
发明人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
IPC分类号： H05K3/46 , H01L21/48 , H01L23/12 , H01L23/498 , H05K1/03 , H05K3/00 , H05K3/22 , H01L21/00
CPC分类号： H05K3/225 , H01L21/4846 , H01L23/49811 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K3/0029 , H05K3/4629 , H05K2203/173 , Y10T29/49124 , Y10T29/49135 , H01L2924/00
摘要： A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.
摘要翻译：一种多层陶瓷修复工艺，提供了一种新的电气修复路径，以连接顶部表面通孔。修复路径是建立在有缺陷的网和包含在多层陶瓷基片内的冗余修复网之间。有缺陷的网和修复网各自终止在基板的表面通孔处。使用激光器在基板上和基板上形成点火电路。之后是有缺陷的网络与电气修复结构的电气隔离和电气修复线路的钝化。

9. 发明授权

US5742021A High thermal conductivity substrate and the method of brazing a cap thereto 失效
标题翻译：高导热性基材和将盖帽钎焊的方法
公开(公告)号：US5742021A
公开(公告)日：1998-04-21
申请号：US695433
申请日：1996-08-12
申请人： Laertis Economikos , Robert Hannon , Richard P. Surprenant , Thomas VanDuynhoven
发明人： Laertis Economikos , Robert Hannon , Richard P. Surprenant , Thomas VanDuynhoven
IPC分类号： H01L21/50 , B23K9/10
CPC分类号： H01L21/50
摘要： Temperature gradients between a ceramic substrate of high thermal conductivity and the braze materials used to attach a metallic device such as a cap are reduced by using an embedded internal heat source in the substrate to minimize the thermal gradient, thereby minimizing the stresses that can result in substrate cracking when a cap is brazed onto the substrate.
摘要翻译：通过在衬底中使用嵌入的内部热源来减少热导率高的陶瓷衬底与用于附接金属器件（例如盖子）的钎焊材料之间的温度梯度，以使热梯度最小化，从而最小化可导致的当盖子钎焊到基底上时，基底开裂。

10. 发明授权

US07294909B2 Electronic package repair process 有权
标题翻译：电子封装修复过程
公开(公告)号：US07294909B2
公开(公告)日：2007-11-13
申请号：US11099161
申请日：2005-04-05
申请人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
发明人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
IPC分类号： H01L27/148 , H01L29/768
CPC分类号： H05K3/225 , H01L21/4846 , H01L23/49811 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K3/0029 , H05K3/4629 , H05K2203/173 , Y10T29/49124 , Y10T29/49135 , H01L2924/00
摘要： A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.
摘要翻译：一种多层陶瓷修复工艺，提供了一个新的电气修复路径，以连接顶面通孔。修复路径是建立在有缺陷的网和包含在多层陶瓷基板内的冗余修复网之间。有缺陷的网和修复网各自终止在基板的表面通孔处。使用激光器在基板上和基板上形成点火电路。之后是有缺陷的网络与电气修复结构的电气隔离和电气修复线路的钝化。

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