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1. 发明授权

US09081167B2 Lens compression molded over LED die 有权
标题翻译：透镜压缩成型在LED模具上
公开(公告)号：US09081167B2
公开(公告)日：2015-07-14
申请号：US12049239
申请日：2008-03-14
申请人： Grigoriy Basin , Robert Scott West , Paul S. Martin , Gerard Harbers , Willem H. Smits , Robert F. M. Hendriks , Frans H. Konijn
发明人： Grigoriy Basin , Robert Scott West , Paul S. Martin , Gerard Harbers , Willem H. Smits , Robert F. M. Hendriks , Frans H. Konijn
IPC分类号： H01L33/00 , G02B19/00 , H01L23/00 , H01L33/54 , H05K3/28 , H01L33/46 , H01L33/50 , H01L33/58
CPC分类号： G02B19/0066 , G02B19/0028 , G02B19/0071 , H01L24/73 , H01L24/97 , H01L33/46 , H01L33/507 , H01L33/54 , H01L33/58 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/12041 , H01L2924/15787 , H01L2924/1815 , H01L2924/19107 , H05K3/284 , H05K2201/10106 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).
摘要翻译：一个或多个LED骰子安装在支撑结构上。支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。模具中的凹槽对应于支撑结构上的LED骰子的位置。凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。压痕的形状将是镜片的形状。模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。然后将模具加热以固化（硬化）硅树脂。然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。可以用不同的模具重复该过模制过程以产生透镜的同心壳。每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

2. 发明申请

US20110108865A1 SILICONE BASED REFLECTIVE UNDERFILL AND THERMAL COUPLER 有权
标题翻译：基于硅胶的反射底座和热耦合器
公开(公告)号：US20110108865A1
公开(公告)日：2011-05-12
申请号：US12613924
申请日：2009-11-06
申请人： Rafael I. ALDAZ , Grigoriy BASIN , Paul S. MARTIN , Michael KRAMES
发明人： Rafael I. ALDAZ , Grigoriy BASIN , Paul S. MARTIN , Michael KRAMES
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/382 , H01L33/60 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.
摘要翻译：在一个实施例中，倒装芯片LED形成有从其n层和p层的底表面延伸的高密度金柱。金柱结合到底座电极。然后将底部填充材料模制以填充LED底部和底座之间的空隙。底部填充物包含硅氧烷模塑料基料和约70-80重量％的氧化铝（或其它合适的材料）。氧化铝的导热系数比典型的硅胶底部填充物的热导率高出约25倍，这主要是二氧化硅。氧化铝是白色粉末。底部填充剂还可以含有约5-10重量％的TiO 2以增加反射率。 LED灯由反射底层填充物向上反射，底部填充物有效地将热量传导到底座。底部填充物也随机化光散射，改善光提取。分布式金柱和底层填料在生长衬底剥离过程中支持LED层。

3. 发明申请

US20110084301A1 PACKAGE-INTEGRATED THIN FILM LED 有权
标题翻译：封装集成薄膜LED
公开(公告)号：US20110084301A1
公开(公告)日：2011-04-14
申请号：US12969709
申请日：2010-12-16
申请人： John Epler , Paul S. Martin , Michael R. Krames
发明人： John Epler , Paul S. Martin , Michael R. Krames
IPC分类号： H01L33/48 , H01L33/36
CPC分类号： H01L33/48 , H01L24/73 , H01L33/0079 , H01L33/22 , H01L33/32 , H01L33/486 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features. There is very little absorption of light by the thinned epitaxial layer, there is high thermal conductivity to the package because the LED layers are directly bonded to the package substrate without any support substrate therebetween, and there is little electrical resistance between the package and the LED layers so efficiency (light output vs. power input) is high. The light extraction features of the LED layer further improves efficiency.
摘要翻译：在衬底上生长LED外延层（n型，p型和有源层）。对于每个管芯，n和p层电连接到延伸超过LED管芯边界的封装衬底，使得LED层位于封装衬底和生长衬底之间。封装衬底提供电触头和导体，导致可焊接的封装连接。然后除去生长底物。因为精细的LED层在附着于生长衬底的同时与封装衬底结合，所以不需要用于LED层的中间支撑衬底。然后将与去除的生长衬底相邻的较厚的LED外延层变薄，并将其顶表面加工成掺入光提取特征。通过减薄的外延层对光的吸收非常小，因为LED层直接接合到封装基板上而没有任何支撑基板，因此封装和LED之间的电阻很小，因此封装的导热性很高层效率（光输出与功率输入）高。 LED层的光提取特性进一步提高了效率。

4. 发明申请

US20110049545A1 LED PACKAGE WITH PHOSPHOR PLATE AND REFLECTIVE SUBSTRATE 审中-公开
标题翻译： LED包装与磷酸盐和反射基板
公开(公告)号：US20110049545A1
公开(公告)日：2011-03-03
申请号：US12552328
申请日：2009-09-02
申请人： Grigoriy Basin , Jeffrey Kmetec , Paul S. Martin
发明人： Grigoriy Basin , Jeffrey Kmetec , Paul S. Martin
IPC分类号： H01L33/00
CPC分类号： H01L24/97 , H01L33/005 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2224/73204 , H01L2924/12041 , H01L2924/181 , H01L2933/0091 , H01L2924/00
摘要： After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO2 powder, by weight, is then spun over or molded over the wafer to cover the phosphor plates and the sides of the LEDs. The top surface of the reflective material is then etched using microbead blasting to expose the top of the phosphor plates and create a substantially planar reflective layer over the wafer surface. Lenses may then be formed over the LEDs. The wafer is then singulated. The reflective material reflects all side light back into the LED and phosphor plate so that virtually all light exits the top of the phosphor plate to improve the light emission characteristics.
摘要翻译：在将倒装芯片LED安装在底座晶片上并且移除其生长衬底之后，将磷光体板固定到每个LED的暴露的顶表面。然后将反射材料，例如含有至少5重量％TiO 2的硅氧烷的硅酮在晶片上旋转或模制，以覆盖荧光体板和LED的侧面。然后使用微珠喷射来蚀刻反射材料的顶表面以暴露荧光体板的顶部并在晶片表面上形成基本上平面的反射层。然后可以在LED上形成透镜。然后将晶片切片。反射材料将所有侧光反射回LED和磷光体板，使得几乎所有的光离开荧光体板的顶部以改善发光特性。

5. 发明授权

US07491565B2 III-nitride light emitting devices fabricated by substrate removal 有权
标题翻译：通过衬底去除制造的III族氮化物发光器件
公开(公告)号：US07491565B2
公开(公告)日：2009-02-17
申请号：US11330209
申请日：2006-01-10
申请人： Carrie Carter Coman , Fred A. Kish, Jr. , Michael R Krames , Paul S Martin
发明人： Carrie Carter Coman , Fred A. Kish, Jr. , Michael R Krames , Paul S Martin
IPC分类号： H01L21/00
CPC分类号： H01L33/40 , H01L33/32 , H01S5/0216 , H01S5/0421 , H01S5/18341 , H01S5/32341
摘要： Devices and techniques for fabricating InAlGaN light-emitting devices are described that result from the removal of light-emitting layers from the sapphire growth substrate. In several embodiments, techniques for fabricating a vertical InAlGaN light-emitting diode structure that result in improved performance and or cost-effectiveness are described. Furthermore, metal bonding, substrate liftoff, and a novel RIE device separation technique are employed to efficiently produce vertical GaN LEDs on a substrate chosen for its thermal conductivity and ease of fabrication.
摘要翻译：描述了从蓝宝石生长衬底去除发光层所产生的用于制造InAlGaN发光器件的器件和技术。在几个实施例中，描述了用于制造导致改进的性能和/或成本效益的垂直InAlGaN发光二极管结构的技术。此外，采用金属结合，衬底剥离和新颖的RIE器件分离技术来有效地在选择用于其导热性和易于制造的衬底上生产垂直GaN LED。

6. 发明授权

US07144135B2 LED lamp heat sink 有权
标题翻译： LED灯泡散热器
公开(公告)号：US07144135B2
公开(公告)日：2006-12-05
申请号：US10723711
申请日：2003-11-26
申请人： Paul S. Martin , Franklin J. Wall, Jr.
发明人： Paul S. Martin , Franklin J. Wall, Jr.
IPC分类号： F21V29/00
CPC分类号： F21V29/74 , F21K9/233 , F21S6/003 , F21S8/026 , F21V7/0091 , F21V17/101 , F21V17/164 , F21V29/004 , F21V29/505 , F21V29/67 , F21V29/673 , F21V29/75 , F21V29/77 , F21V29/773 , F21V29/83 , F21Y2115/10
摘要： An LED lamp includes an exterior shell that has the same form factor as a conventional incandescent light bulb, such as a PAR type bulb. The LED lamp includes an optical reflector that is disposed within the shell and that directs the light emitted from one or more LEDs. The optical reflector and shell define a space that is used to channel air to cool the device. The LED is mounted on a heat sink that is disposed within the shell. A fan moves air over the heat sink and through the spaced defined by the optical reflector and the shell. The shell includes one or more apertures that serve as air inlet or exhaust apertures. One or more apertures defined by the optical reflector and shell at the opening of the shell can also be used as air exhaust or inlet apertures.
摘要翻译： LED灯包括具有与常规白炽灯泡（例如PAR型灯泡）相同形状因数的外壳。 LED灯包括设置在外壳内并引导从一个或多个LED发出的光的光学反射器。光学反射器和壳体限定了用于引导空气冷却设备的空间。 LED安装在设置在外壳内的散热器上。风扇将空气移动到散热器上方并通过光学反射器和外壳限定的间隔。壳体包括用作空气入口或排气孔的一个或多个孔。由光学反射器和壳体在壳体的开口处限定的一个或多个孔也可以用作排气孔或入口孔。

7. 发明授权

US06603258B1 Light emitting diode device that emits white light 有权
标题翻译：发出白光的发光二极管装置
公开(公告)号：US06603258B1
公开(公告)日：2003-08-05
申请号：US09556770
申请日：2000-04-24
申请人： Regina Mueller-Mach , Gerd O. Mueller , Paul S. Martin
发明人： Regina Mueller-Mach , Gerd O. Mueller , Paul S. Martin
IPC分类号： H01J154
CPC分类号： H01L33/50 , H01L33/08
摘要： A white-light emitting diode (LED) is provided that emits primary light at a wavelength that is in the range of 485 to 515 nanometers (nm), which corresponds to a bluish-green color. A portion of the primary light is converted into a reddish-colored light that ranges in wavelength from approximately 600 to approximately 620 nm. At least a portion of the converted light combines with the unconverted portion of the primary light to produce white light. A number of phosphor-converting elements are suitable for use with the LED, including a resin admixed with a phosphor powder, epoxies admixed with a phosphor powder, organic luminescent dyes, phosphor-converting thin films and phosphor-converting substrates. Preferably, the phosphor-converting element is a resin admixed with a phosphor powder in such a manner that a portion of the primary light impinging on the resin is converted into the reddish-colored light and a portion of the primary light passes through the resin without being converted. The unconverted primary light and the phosphor-converted reddish-colored light combine to produce white light. The LED is mounted in a reflector cup that is filled with the phosphor-converting resin. The LED may be mounted in either a normal or flip-chip configuration within the reflector cup.
摘要翻译：提供一种白光发光二极管（LED），其发射波长在485至515纳米（nm）范围内的初级光，其对应于蓝绿色。初级光的一部分被转换成波长从大约600nm到大约620nm的红色光。转换的光的至少一部分与初级光的未转换部分组合以产生白光。许多荧光体转换元件适用于LED，包括与荧光体粉末混合的树脂，与荧光体粉末混合的环氧树脂，有机发光染料，磷光体转换薄膜和磷光体转换基板。优选地，磷光体转换元件是与荧光体粉末混合的树脂，使得入射到树脂上的初级光的一部分被转换成红色的光，并且一部分一次光通过树脂而没有被转换。未转换的初级光和磷光体转换的红色光结合产生白光。 LED安装在填充有磷光体转换树脂的反射杯中。 LED可以以反射杯内的正常或倒装芯片配置安装。

8. 发明授权

US06280523B1 Thickness tailoring of wafer bonded AlxGayInzN structures by laser melting 有权
标题翻译：通过激光熔化对晶片接合AlxGayInzN结构进行厚度裁剪
公开(公告)号：US06280523B1
公开(公告)日：2001-08-28
申请号：US09245448
申请日：1999-02-05
申请人： Carrie Carter Coman , Fred A. Kish, Jr. , R. Scott Kern , Michael R. Krames , Paul S. Martin
发明人： Carrie Carter Coman , Fred A. Kish, Jr. , R. Scott Kern , Michael R. Krames , Paul S. Martin
IPC分类号： C30B2512
CPC分类号： H01L33/465 , H01L33/007 , H01L33/0075 , H01L33/0079 , H01L33/105 , H01S5/0216 , H01S5/0217 , H01S5/18341 , H01S5/18361 , H01S5/1838 , H01S5/32341 , Y10S117/915
摘要： Light emitting devices having a vertical optical path, e.g. a vertical cavity surface emitting laser or a resonant cavity light emitting or detecting device, having high quality mirrors may be achieved using wafer bonding or metallic soldering techniques. The light emitting region interposes one or two reflector stacks containing dielectric distributed Bragg reflectors (DBRs). The dielectric DBRs may be deposited or attached to the light emitting device. A host substrate of GaP, GaAs, InP, or Si is attached to one of the dielectric DBRs. Electrical contacts are added to the light emitting device.
摘要翻译：具有垂直光路的发光器件，例如可以使用晶片接合或金属焊接技术实现具有高质量反射镜的垂直腔表面发射激光器或谐振腔发光或检测装置。发光区域包含一个或两个包含介质分布布拉格反射器（DBR）的反射器堆叠。电介质DBR可以沉积或附着到发光器件。 GaP，GaAs，InP或Si的主衬底连接到电介质DBR之一。电触点被添加到发光器件中。

9. 发明授权

US08471280B2 Silicone based reflective underfill and thermal coupler 有权
标题翻译：硅基反射底部填充和热耦合器
公开(公告)号：US08471280B2
公开(公告)日：2013-06-25
申请号：US12613924
申请日：2009-11-06
申请人： Rafael I. Aldaz , Grigoriy Basin , Paul S. Martin , Michael Krames
发明人： Rafael I. Aldaz , Grigoriy Basin , Paul S. Martin , Michael Krames
IPC分类号： H01L23/29
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/382 , H01L33/60 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.
摘要翻译：在一个实施例中，倒装芯片LED形成有从其n层和p层的底表面延伸的高密度的金柱。金柱结合到底座电极。然后将底部填充材料模制以填充LED底部和底座之间的空隙。底部填充物包含硅氧烷模塑料基料和约70-80重量％的氧化铝（或其它合适的材料）。氧化铝的导热系数比典型的硅胶底部填充物的热导率高出约25倍，这主要是二氧化硅。氧化铝是白色粉末。底部填充剂还可以含有约5-10重量％的TiO 2以增加反射率。 LED灯由反射底层填充物向上反射，底部填充物有效地将热量传导到底座。底部填充物也随机化光散射，改善光提取。分布式金柱和底层填料在生长衬底剥离过程中支持LED层。

10. 发明授权

US08232117B2 LED wafer with laminated phosphor layer 有权
标题翻译： LED晶圆与叠层荧光粉层
公开(公告)号：US08232117B2
公开(公告)日：2012-07-31
申请号：US12771809
申请日：2010-04-30
申请人： Grigoriy Basin , Paul S. Martin
发明人： Grigoriy Basin , Paul S. Martin
IPC分类号： H01L21/00
CPC分类号： H01L33/0079 , H01L24/97 , H01L33/0095 , H01L33/22 , H01L33/50 , H01L2224/14 , H01L2224/81 , H01L2924/181 , H01L2933/0041 , H01L2924/00012
摘要： An LED wafer with a growth substrate is attached to a carrier substrate by, for example, a heat-releasable adhesive so that the LED layers are sandwiched between the two substrates. The growth substrate is then removed, such as by laser lift-off. The exposed surface of the LED layers is then etched to improve light extraction. A preformed phosphor sheet, matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet, LED layers, and, optionally, the carrier substrate are then diced to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.
摘要翻译：具有生长衬底的LED晶片通过例如可热剥离的粘合剂附接到载体衬底，使得LED层夹在两个衬底之间。然后去除生长衬底，例如通过激光剥离。然后蚀刻LED层的暴露表面以改善光提取。然后将与LED相匹配的预成型荧光体片固定到暴露的LED层。然后对磷光体片，LED层和任选的载体衬底进行切割以分离LED。 LED芯片通过加热或其他方式从载体基板释放，并且使用拾放机将各个LED芯片安装在底座晶片上。然后将底座晶片切割以产生单独的LED。有源层可以产生蓝光，并且蓝光和荧光光可以产生具有预定白点的白光。

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