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    • 1. 发明申请
    • METHOD AND APPARATUS FOR INSPECTING TARGET DEFECTS ON A WAFER
    • 用于检测波峰的目标缺陷的方法和装置
    • US20070030478A1
    • 2007-02-08
    • US11461726
    • 2006-08-01
    • Moon-Kyung KIMChung-Sam JUNYu-Sin YANG
    • Moon-Kyung KIMChung-Sam JUNYu-Sin YANG
    • G01N21/88
    • G01N21/9501
    • A defect inspecting apparatus includes a first support unit supporting a standard sample having standard defects, a second support unit supporting a wafer having target defects, a light source irradiating an incident light to the standard sample or the wafer, a light receiving part collecting reflection light reflected from the standard sample and the wafer, a detection part detecting the standard defects and the target defects by using the reflection light, a comparing part comparing information obtained using the reflection light reflected from the standard sample with a predetermined standard information of the standard defects to confirm a reliability of a step for detecting the target defects and a determination portion determining whether the step is allowed to be performed or not.
    • 缺陷检查装置包括支撑具有标准缺陷的标准样品的第一支撑单元,支撑具有目标缺陷的晶片的第二支撑单元,向标准样品或晶片照射入射光的光源,收集反射光的光接收部 从标准样品和晶片反射的检测部分,通过使用反射光检测标准缺陷和目标缺陷的检测部分,将使用从标准样品反射的反射光获得的信息与标准缺陷的预定标准信息进行比较的比较部分 以确认用于检测目标缺陷的步骤的可靠性,并且确定部分确定是否允许执行该步骤。
    • 9. 发明申请
    • APPARATUS AND METHOD TO INSPECT DEFECT OF SEMICONDUCTOR DEVICE
    • 检测半导体器件缺陷的装置和方法
    • US20100136717A1
    • 2010-06-03
    • US12627222
    • 2009-11-30
    • Ji-Young SHINYoung-Nam KimJong-An KIMHyung-Suk CHOYu-Sin YANG
    • Ji-Young SHINYoung-Nam KimJong-An KIMHyung-Suk CHOYu-Sin YANG
    • H01L21/66G01N23/00G06F19/00
    • H01J37/241H01J37/265H01J37/28H01L22/12
    • An apparatus and method to inspect a defect of a semiconductor device. The amount of secondary electrons generated due to a scanning electron microscope (SEM) may depend on the topology of a pattern of a semiconductor substrate. The amount of secondary electrons emitted from a recess of an under layer is far smaller than that of secondary electrons emitted from a projection of a top layer. Since the recess is darker than the projection, a ratio of a value of a secondary electron signal of the under layer to a value of a secondary electron signal of the top layer may be increased in order to improve a pattern image used to inspect a defect in the under layer. To do this, a plurality of conditions under which electron beams (e-beams) are irradiated may be set, at least two may be selected out of the set conditions, and the pattern may be scanned under the selected conditions. Thus, secondary electron signals may be generated according to the respective conditions and converted into image data so that various pattern images may be displayed on a monitor. Scan information on the pattern images may be automatically stored in a computer storage along with positional information on a predetermined portion of the semiconductor substrate. When calculation conditions are input to a computer, each of scan information on the pattern images may be calculated to generate a new integrated pattern image.
    • 一种用于检查半导体器件的缺陷的装置和方法。 由扫描电子显微镜(SEM)产生的二次电子量可能取决于半导体衬底图案的拓扑结构。 从下层的凹部发射的二次电子的量远远小于从顶层的投影发射的二次电子的量。 由于凹部比投影更暗,所以可以增加下层的二次电子信号的值与顶层的二次电子信号的值的比例,以便改善用于检查缺陷的图案图像 在下层。 为此,可以设置照射电子束(电子束)的多个条件,可以从设定条件中选择至少两个,并且可以在所选择的条件下扫描图案。 因此,可以根据各自的条件生成二次电子信号,并将其转换为图像数据,从而可以在监视器上显示各种图案图像。 关于图案图像的扫描信息可以与位于半导体基板的预定部分上的位置信息一起自动存储在计算机存储器中。 当将计算条件输入到计算机时,可以计算每个关于图案图像的扫描信息,以生成新的集成图案图像。