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    • 5. 发明申请
    • Substrate processing apparatus and method of controlling substrate processing apparatus
    • 基板处理装置及其控制方法
    • US20090110824A1
    • 2009-04-30
    • US12289463
    • 2008-10-28
    • Yuichi TakenagaTakahito KasaiMinoru ObataYoshihiro TakezawaKazuo Yabe
    • Yuichi TakenagaTakahito KasaiMinoru ObataYoshihiro TakezawaKazuo Yabe
    • C23C16/44C23C16/54
    • C23C16/481C23C16/52
    • In accordance with a set temperature profile including: a first step in which a temperature is varied from a first temperature to a second temperature during a first time period; a second step in which the temperature is maintained at the second temperature during a second time period; and a third step in which the temperature is varied from the second temperature to a third temperature; a substrate is subjected to a film deposition process. The first temperature, the second temperature, and the third temperature are determined based on the first relationship between temperature and film thickness, the measured film thicknesses at the plurality of positions, and a predetermined target film thickness. There are calculated expected film thicknesses at a plurality of positions on a substrate to be actually processed in accordance with the set temperature profile corresponding to the determined first temperature, the determined second temperature, and the determined third temperature. When the expected film thicknesses at the plurality of positions are not within a predetermined allowable range with respect to the predetermined target film thickness, at least one of the first time period, the second time period, and the third time period is varied.
    • 根据设定温度曲线图,包括:第一步骤,其中温度在第一时间段内从第一温度变化到第二温度; 在第二时间段内将温度保持在第二温度的第二步骤; 以及第三步骤,其中温度从第二温度变化到第三温度; 对基板进行成膜处理。 基于温度和膜厚度之间的第一关系,多个位置处测量的膜厚度和预定的目标膜厚度来确定第一温度,第二温度和第三温度。 根据对应于所确定的第一温度,确定的第二温度和确定的第三温度的设定温度曲线,计算待实际处理的基板上的多个位置处的预期膜厚度。 当多个位置处的预期膜厚度相对于预定目标膜厚度不在预定的允许范围内时,第一时间段,第二时间段和第三时间段中的至少一个是变化的。
    • 9. 发明授权
    • Information processing apparatus, semiconductor manufacturing system, information processing method, and storage medium
    • 信息处理装置,半导体制造系统,信息处理方法和存储介质
    • US07869888B2
    • 2011-01-11
    • US11754643
    • 2007-05-29
    • Noriaki KoyamaMinoru ObataWenling Wang
    • Noriaki KoyamaMinoru ObataWenling Wang
    • G05B13/02G06F19/00
    • G05B23/0221G05B2219/32184G05B2219/32192G05B2219/45031Y02P90/22
    • A information processing apparatus 100 for processing an acquired value, which is a value acquired in regard to a state during a treatment, performed by a semiconductor manufacturing apparatus 200 for performing a treatment on a treatment target containing a semiconductor according to a set value, which is a value for setting a condition of a treatment, includes: a set value receiving portion 101 for receiving the set value; a state value receiving portion 102 for receiving the acquired value; a correction amount calculating portion 103 for calculating a correction amount of the acquired value, using a correction function indicating a relationship between the set value and the acquired value; a correcting portion 104 for correcting the acquired value received by the state value receiving portion 102, using the correction amount calculated by the correction amount calculating portion 103; and an output portion 105 for outputting a result of correction performed by the correcting portion 104.
    • 一种信息处理设备100,用于处理获取值,该获取值是由处理期间的状态获取的值,由半导体制造设备200执行,用于根据设定值对包含半导体的处理对象进行处理, 是用于设定治疗条件的值,包括:用于接收设定值的设定值接收部101; 用于接收所获取的值的状态值接收部分102; 校正量计算部分103,用于使用指示设定值和获取值之间的关系的校正函数来计算获取值的校正量; 校正部分104,用于使用由校正量计算部分103计算的校正量来校正由状态值接收部分102接收到的获取值; 以及输出部分105,用于输出校正部分104执行的校正结果。
    • 10. 发明申请
    • SERVER DEVICE AND PROGRAM
    • 服务器设备和程序
    • US20090276076A1
    • 2009-11-05
    • US12375590
    • 2007-07-09
    • Masashi TakahashiMinoru ObataNoriaki Koyama
    • Masashi TakahashiMinoru ObataNoriaki Koyama
    • G06F17/00
    • G05B23/0213H01L21/67276
    • A server device is provided with a measurement information storage unit 1201 which can store plural measurement information, i.e., information having a measurement value and time information indicating time; an instruction receiving unit for receiving an output instruction of the measurement information; a measurement information acquisition unit for acquiring, from the measurement information storage unit, the measurement information designated by the output instruction; an output information composing unit for composing output information by using the acquired measurement information; and an output unit for outputting the output information composed by the output information composing unit. The output instruction includes an instruction for designating one or more desired number of times of execution of a sub-recipe among plural number of times of execution of the sub-recipe in the recipe and the measurement information acquisition unit acquires measurement information corresponding to the sub-recipe designated by the output instruction.
    • 服务器装置设置有可以存储多个测量信息的测量信息存储单元1201,即具有测量值的信息和指示时间的时间信息; 指令接收单元,用于接收测量信息的输出指令; 测量信息获取单元,用于从测量信息存储单元获取由输出指令指定的测量信息; 输出信息组合单元,用于通过使用获取的测量信息来组合输出信息; 以及输出单元,用于输出由输出信息组合单元组成的输出信息。 输出指令包括用于在食谱中指定子数据的多次执行中的一个或多个期望次数的执行次数的指令,并且测量信息获取单元获取与子配方相对应的测量信息 由输出指令指定的-recipe。