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1. 发明授权

US08310667B2 Wafer surface inspection apparatus and wafer surface inspection method 有权
标题翻译：晶圆表面检查仪和晶圆表面检测方法
公开(公告)号：US08310667B2
公开(公告)日：2012-11-13
申请号：US12187041
申请日：2008-08-06
申请人： Kazuhiro Zama , Masayuki Hachiya
发明人： Kazuhiro Zama , Masayuki Hachiya
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/94 , G01N2021/151
摘要： A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.
摘要翻译：高灵敏度的晶片表面检查方法和装置，并且在清洁度方面没有性能下降，外来颗粒的坐标重复性等。将用于冷却的气体喷射到晶片表面上的激光照射位置，以防止异物的温度升高并且抑制异物的分解。

2. 发明申请

US20120182547A1 OPTICAL DEFECT INSPECTION APPARATUS 失效
标题翻译：光学缺陷检测装置
公开(公告)号：US20120182547A1
公开(公告)日：2012-07-19
申请号：US13433035
申请日：2012-03-28
申请人： Noriyuki Aizawa , Hiroyuki Kawakami , Kazuhiro Zama , Kazuo Takashi , Yusuke Miyazaki , Shingo Tanaka , Yuuichiro Iijima , Masayuki Hachiya , Rieko Hachiya , Koichi Asami
发明人： Noriyuki Aizawa , Hiroyuki Kawakami , Kazuhiro Zama , Kazuo Takashi , Yusuke Miyazaki , Shingo Tanaka , Yuuichiro Iijima , Masayuki Hachiya , Rieko Hachiya , Koichi Asami
IPC分类号： G01N21/89 , B66C1/42
CPC分类号： G01N21/9501 , G01N21/94 , G01N2021/9513 , G01N2021/95676 , H01L22/12
摘要： A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.
摘要翻译：从激光源振荡的激光束在其路径中被第一和第二平面镜折叠并进入光束扩展器。每个平面镜的表面由激光照射而劣化，反射率降低。为了避免进入光束扩展器的激光束的光量减小到低于参考值，当在一定时间内照射激光束时，激光束被照亮的第一和第二平面镜中的每一个上的位置通过用于在包括平面镜的平面上旋转和/或平移每个平面镜的反射表面的结构改变，同时光轴保持相同。因此，可以延长每个平面镜的使用寿命而不移动光轴。

3. 发明申请

US20110141461A1 Surface Inspection Method and Surface Inspection Apparatus 失效
标题翻译：表面检查方法和表面检查装置
公开(公告)号：US20110141461A1
公开(公告)日：2011-06-16
申请号：US13032165
申请日：2011-02-22
申请人： Shigeru MATSUI , Masayuki Hachiya
发明人： Shigeru MATSUI , Masayuki Hachiya
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.
摘要翻译：来自光源的光由分束器变成两个照明光束。光束从具有基本相等的仰角的两个相互基本正交的方位角照射到半导体晶片上，以形成照明点。当检测到由于照明光束引起的散射，衍射和反射光的总和时，可以消除晶片本身或其上存在的污染颗粒和缺陷相对于照明方向的各向异性的影响。

4. 发明申请

US20100188656A1 Surface Inspection Method and Surface Inspection Apparatus 有权
标题翻译：表面检查方法和表面检查装置
公开(公告)号：US20100188656A1
公开(公告)日：2010-07-29
申请号：US12754634
申请日：2010-04-06
申请人： Shigeru MATSUI , Masayuki Hachiya
发明人： Shigeru MATSUI , Masayuki Hachiya
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.
摘要翻译：来自光源的光由分束器变成两个照明光束。光束从具有基本相等的仰角的两个相互基本正交的方位角照射到半导体晶片上，以形成照明点。当检测到由于照明光束引起的散射，衍射和反射光的总和时，可以消除晶片本身或其上存在的污染颗粒和缺陷相对于照明方向的各向异性的影响。

5. 发明申请

US20080013084A1 Surface Inspection Method and Surface Inspection Apparatus 有权
标题翻译：表面检查方法和表面检查装置
公开(公告)号：US20080013084A1
公开(公告)日：2008-01-17
申请号：US11776912
申请日：2007-07-12
申请人： Shigeru MATSUI , Masayuki HACHIYA
发明人： Shigeru MATSUI , Masayuki HACHIYA
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： In order to realize a surface inspection apparatus capable of inspecting a contaminant particle and a defect with a uniform sensitivity without depending on a rotation angle in a primary scan direction even in the case where intensity of scattered light, which is generated derived from the contaminant particle and the defect existing on the surface of a semiconductor wafer or adjacent to the surface, has anisotropy which depends on an illumination direction; light from a light source 11 becomes two illumination beams 21 and 22 by a beam splitter 12, the beams being irradiated onto a semiconductor wafer 100 from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots 3 and 4. When the sum of scattered, diffracted, and reflected lights due to the illumination beams 21 and 22 is detected; influence of the anisotropy which a contaminant particle and a defect existing in the wafer 100 itself or thereon have with respect to an illumination direction, can be eliminated. This makes it possible to inspect a contaminant particle, defect, and the like with a uniform sensitivity without depending on a rotation angle in a primary scan direction even in the case where intensity of the scattered light generated derived from the contaminant particle, defect, and the like depends on the illumination direction.
摘要翻译：为了实现能够在不影响初级扫描方向的旋转角度的情况下检测污染物质和缺陷的表面检查装置，即使在从污染物粒子产生的散射光强度的情况下，并且存在于半导体晶片的表面上或与表面相邻的缺陷具有取决于照明方向的各向异性; 来自光源11的光通过分束器12变成两个照明光束21和22，这些光束从具有基本相等的仰角的两个相互基本上正交的方位角照射到半导体晶片100上，以形成照明点3和4.当检测由于照明光束21和22引起的散射，衍射和反射光的总和; 可以消除晶片100本身或其上存在的污染颗粒和缺陷相对于照明方向的各向异性的影响。这使得可以在不依赖于主扫描方向上的旋转角度的情况下以均匀的灵敏度检查污染物颗粒，缺陷等，即使在由污染物颗粒产生的散射光的强度，缺陷和这取决于照明方向。

6. 发明申请

US20070182957A1 Wafer surface inspection apparatus and wafer surface inspection method 有权
标题翻译：晶圆表面检查仪和晶圆表面检测方法
公开(公告)号：US20070182957A1
公开(公告)日：2007-08-09
申请号：US11501922
申请日：2006-08-10
申请人： Kazuhiro Zama , Masayuki Hachiya
发明人： Kazuhiro Zama , Masayuki Hachiya
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/94 , G01N2021/151
摘要： A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.
摘要翻译：高灵敏度的晶片表面检查方法和装置，并且在清洁度方面没有性能下降，外来颗粒的坐标重复性等。将用于冷却的气体喷射到晶片表面上的激光照射位置，以防止异物的温度升高并且抑制异物的分解。

7. 发明授权

US08203705B2 Inspection apparatus and inspection method 有权
标题翻译：检验仪器和检验方法
公开(公告)号：US08203705B2
公开(公告)日：2012-06-19
申请号：US12350581
申请日：2009-01-08
申请人： Masami Ooyama , Masayuki Hachiya , Rieko Hachiya, legal representative , Kimiko Hachiya, legal representative , Kazuhiro Zama , Keiichi Nagasaki
发明人： Masami Ooyama , Masayuki Hachiya , Kazuhiro Zama , Keiichi Nagasaki
IPC分类号： G01N21/00
CPC分类号： G01N21/01 , G01B11/306 , G01N21/9501 , H01L21/68721 , H01L21/68735
摘要： The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection. An inspection apparatus includes: a first light irradiating unit for irradiating an object to be inspected with light; a first detector for detecting scattered light from the object to be inspected; a second light irradiating unit for irradiating the object to be inspected with light; a second detector for detecting light reflected from the object to be inspected, of light of the second light irradiating unit; a stage for moving an object to be inspected, which moves the object to be inspected so as to change irradiation positions on the object to be inspected, of the light of the first light irradiating unit and the light of the second light irradiating unit; an inspection coordinate detector for outputting information of coordinates of a position irradiated with light; an elevation control circuit for outputting height information of the object to be inspected on the basis of a detection signal from the second detector; and a data processing unit for calculating a warp amount of the object to be inspected on the basis of the information of the position coordinates from the inspection coordinate detector and the height information from the elevation control circuit.
摘要翻译：本发明涉及在检查中以高速旋转的晶片中实时检测翘曲量。检查装置包括：第一光照射单元，用于用光照射被检查物体; 用于检测来自被检查物体的散射光的第一检测器; 第二光照射单元，用于用光照射被检查物体; 第二检测器，用于检测来自被检查物体的光的第二光照射单元的光; 用于使被检查物体移动以移动要检查的物体，以便改变第一光照射单元的光和第二光照射单元的光的待检查对象的照射位置的台阶; 用于输出用光照射的位置的坐标信息的检查坐标检测器; 高度控制电路，用于根据来自第二检测器的检测信号输出待检查物体的高度信息; 以及数据处理单元，用于根据来自检查坐标检测器的位置坐标的信息和来自仰角控制电路的高度信息来计算被检查物体的弯曲量。

8. 发明授权

US08184283B2 Optical defect inspection apparatus 有权
标题翻译：光学缺陷检查装置
公开(公告)号：US08184283B2
公开(公告)日：2012-05-22
申请号：US12785065
申请日：2010-05-21
申请人： Yuuichiro Iijima , Masayuki Hachiya , Rieko Hachiya, legal representative , Koichi Asami , Yusuke Miyazaki , Kazuhiro Zama
发明人： Yuuichiro Iijima , Masayuki Hachiya , Koichi Asami , Yusuke Miyazaki , Kazuhiro Zama
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/94 , G01N2021/9513 , G01N2021/95676 , H01L22/12
摘要： A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.
摘要翻译：从激光源振荡的激光束在其路径中被第一和第二平面镜折叠并进入光束扩展器。每个平面镜的表面由激光照射而劣化，反射率降低。为了避免进入光束扩展器的激光束的光量减小到低于参考值，当在一定时间内照射激光束时，激光束被照亮的第一和第二平面镜中的每一个上的位置通过用于在包括平面镜的平面上旋转和/或平移每个平面镜的反射表面的结构改变，同时光轴保持相同。因此，可以延长每个平面镜的使用寿命而不移动光轴。

9. 发明授权

US07719669B2 Surface inspection method and surface inspection apparatus 有权
标题翻译：表面检查方法和表面检查装置
公开(公告)号：US07719669B2
公开(公告)日：2010-05-18
申请号：US11776912
申请日：2007-07-12
申请人： Shigeru Matsui , Masayuki Hachiya
发明人： Shigeru Matsui , Masayuki Hachiya
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.
摘要翻译：来自光源的光由分束器变成两个照明光束。光束从具有基本相等的仰角的两个相互基本正交的方位角照射到半导体晶片上，以形成照明点。当检测到由于照明光束引起的散射，衍射和反射光的总和时，可以消除晶片本身或其上存在的污染颗粒和缺陷相对于照明方向的各向异性的影响。

10. 发明申请

US20080297781A1 WAFER SURFACE INSPECTION APPARATUS AND WAFER SURFACE INSPECTION METHOD 有权
公开(公告)号：US20080297781A1
公开(公告)日：2008-12-04
申请号：US12187041
申请日：2008-08-06
申请人： Kazuhiro Zama , Masayuki Hachiya
发明人： Kazuhiro Zama , Masayuki Hachiya
IPC分类号： G01N21/896
CPC分类号： G01N21/9501 , G01N21/94 , G01N2021/151
摘要： A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.

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