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    • 5. 发明授权
    • Apparatus for liquid-phase epitaxial growth
    • 液相外延生长装置
    • US5366552A
    • 1994-11-22
    • US897169
    • 1992-06-11
    • Masato YamadaTakao TakenakaMasahisa Endo
    • Masato YamadaTakao TakenakaMasahisa Endo
    • C30B19/06H01L21/208
    • C30B19/061
    • A method and an apparatus capable of efficiently producing an epitaxial layer grown at one time on a multiplicity of substrates with uniform thickness and quality are disclosed, in which a sealable growth chamber filled in a solution used to achieve liquid-phase epitaxial growth and holding therein at least one row of thin plate-like substrate is turned about the horizontal axis. The growth chamber is tilted or overturned so that the solution in the growth chamber is stirred homogeneously and the effect of gravity on the solution is excluded. A solution chamber for holding therein the solution is connected with the growth chamber via a gate valve. After the liquid-phase epitaxial growth, the growth chamber is overturned and then the gate valve is opened so that the solution in the growth chamber returns to the solution chamber. Thus, reuse of the solution is possible.
    • 公开了一种能够有效地制造在多个均匀厚度和质量的基板上一次生长的外延层的方法和装置,其中填充有用于实现液相外延生长和保持在其中的溶液的可密封的生长室 至少一排薄板状基板围绕水平轴转动。 生长室倾斜或翻转,使得生长室中的溶液均匀搅拌,排除重力对溶液的影响。 用于保持溶液的溶液室通过闸阀与生长室连接。 在液相外延生长之后,生长室被翻转,然后打开闸阀,使得生长室中的溶液返回溶液室。 因此,解决方案的重用是可能的。
    • 7. 发明授权
    • Light emitting element and method for manufacturing thereof
    • 发光元件及其制造方法
    • US06781158B2
    • 2004-08-24
    • US10131076
    • 2002-04-25
    • Akio NakamuraMasayuki ShinoharaMasahisa Endo
    • Akio NakamuraMasayuki ShinoharaMasahisa Endo
    • H01L3300
    • H01L33/30H01L33/305H01L33/32
    • A GaAsP-base light emitting element capable of sustaining an excellent light emission property for a long period, and a method for manufacturing thereof are provided. The light emitting element 1 has a p-n junction interface responsible for light emission formed between a p-type GaAs1-aPa layer 9 and an n-type GaAs1-aPa layer 8, and has a nitrogen-doped zone 8c formed in a portion including the p-n junction interface between such p-type GaAs1-aPa layer 9 and n-type GaAs1-aPa layer 8. Such element can be manufactured by fabricating a plurality of light emitting elements by varying nitrogen concentration Y of the nitrogen-doped zone 8c while keeping a mixed crystal ratio a of the p-type GaAs1- aPa layer 9 and n-type GaAs1-aPa layer 8 constant; finding an emission luminance/nitrogen concentration relationship by measuring emission luminance of the individual light emitting elements; and adjusting the nitrogen concentration of the nitrogen-doped zone 8c so as to fall within a range from 1.05Yp to 1.5Yp, where Yp is defined as a peak nitrogen concentration whereat the emission luminance of the light emitting element will become maximum at a mixed crystal ratio a.
    • 提供能够长期保持优异的发光特性的GaAsP基发光元件及其制造方法。 发光元件1具有负责在p型GaAs1-aPa层9和n型GaAs1-aPa层8之间形成的发光的pn结界面,并且具有氮化区8c,该氮掺杂区8c形成在包括 这种p型GaAs1-aPa层9和n型GaAs1-aPa层8之间的pn结界面。这样的元件可以通过在保持氮掺杂区8c的氮浓度Y的同时制造多个发光元件来制造 p型GaAs1-aPa层9和n型GaAs1-aPa层8的混晶比a恒定; 通过测量各个发光元件的发光亮度来发现发光亮度/氮浓度关系; 并将氮掺杂区8c的氮浓度调整到1.05Y〜1.5Yp的范围内,其中Yp被定义为在混合的发光元件的发光亮度将变得最大的峰值氮浓度 晶体比a。
    • 8. 发明授权
    • Method of making epitaxial wafers
    • 制造外延片的方法
    • US5362683A
    • 1994-11-08
    • US205558
    • 1994-03-04
    • Takao TakenakaMasahisa EndoMasato Yamada
    • Takao TakenakaMasahisa EndoMasato Yamada
    • C30B19/00H01L21/20H01L21/208H01L21/304H01L21/302
    • H01L21/304H01L21/02395H01L21/02463H01L21/02507H01L21/02546H01L21/02625H01L21/02628Y10S117/915
    • To manufacture epitaxial wafers with a smaller amount of semiconductor crystals at a lower cost by means of an efficient epitaxial growth process. An epitaxial wafer is made by forming, by means of epitaxial growth, GaAlAs layers with identical structures on both sides of a GaAs substrate wafer with the crystal plane orientation of {100}. The epitaxial wafer is then divided in the GaAs substrate wafer portion into two pieces to obtain two epitaxial wafers. To perform the epitaxial growth process, a plurality of GaAs substrate wafers are held at their edges and then the GaAs substrate wafers are placed in a Ga solution at prescribed spatial intervals. To divide the epitaxial wafer in the GaAs substrate portion into two pieces, the substrate wafer portion is cut parallel to the main surface. Or, the GaAs substrate wafer can also be removed by means of etching while the epitaxial wafer is rotated at a high speed in the etching solution.
    • 通过有效的外延生长工艺以更低的成本制造具有更少量的半导体晶体的外延晶片。 通过外延生长,通过在晶体平面取向为{100}的GaAs衬底晶片的两侧上形成具有相同结构的GaAlAs层来制造外延晶片。 然后将外延晶片在GaAs衬底晶片部分中分成两片,以获得两个外延晶片。 为了进行外延生长处理,将多个GaAs衬底晶片保持在其边缘,然后将GaAs衬底晶片以规定的空间间隔放置在Ga溶液中。 为了将GaAs衬底部分中的外延晶片分成两片,平行于主表面切割衬底晶片部分。 或者,也可以通过蚀刻去除GaAs衬底晶片,同时外延晶片在蚀刻溶液中以高速旋转。