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1. 发明申请

US20080115383A1 Method of drying honeycomb formed body 审中-公开
标题翻译：蜂窝成形体干燥方法
公开(公告)号：US20080115383A1
公开(公告)日：2008-05-22
申请号：US12007666
申请日：2008-01-14
申请人： Masayuki Nate , Makoto Osamura , Takahisa Kaneko , Yukihisa Wada
发明人： Masayuki Nate , Makoto Osamura , Takahisa Kaneko , Yukihisa Wada
IPC分类号： F26B5/04
CPC分类号： C04B35/6365 , B28B3/269 , B28B11/243 , B28B11/248 , C04B35/565 , C04B35/62655 , C04B38/0006 , C04B2111/00793 , C04B2111/0081 , C04B2235/428 , C04B2235/6021 , C04B2235/728 , C04B2235/80 , C04B2235/9638 , F27D5/00 , C04B40/02 , C04B40/0218
摘要： A method of drying a honeycomb formed body comprising an outer wall, partition walls disposed inside the outer wall, and cells surrounded by the partition walls and extending in an axial direction of the honeycomb formed body. The method of drying a honeycomb formed body comprises a drying step of starting to dry in a state of covering at least a part of the outer wall with a guide covering the outer wall so as not to come into contact with the outer wall. Alternatively, the method of drying a honeycomb formed body comprises a drying step of drying in a state of covering at least a part of the outer wall with a guide that covers the outer wall so as to come into contact with the outer wall, wherein in the drying step the pressure applied to the outer wall by the guide at the contact portion is less than 0.2 MPa.
摘要翻译：蜂窝成形体的干燥方法，其包括外壁，设置在外壁内的隔壁，以及被隔壁围绕并沿蜂窝成形体的轴向延伸的孔。干燥蜂窝成形体的方法包括以覆盖外壁的引导件覆盖外壁的至少一部分的状态开始干燥的干燥步骤，以便不与外壁接触。或者，干燥蜂窝成形体的方法包括干燥步骤，其以覆盖外壁的引导件覆盖外壁的至少一部分的状态进行干燥以与外壁接触，其中在通过导向件在接触部分施加到外壁的压力的干燥步骤小于0.2MPa。

2. 发明申请

US20120056337A1 RFIC CHIP MOUNTING STRUCTURE 有权
标题翻译： RFIC芯片安装结构
公开(公告)号：US20120056337A1
公开(公告)日：2012-03-08
申请号：US13223429
申请日：2011-09-01
申请人： Koji SHIROKI , Makoto OSAMURA , Takeshi KURIHARA , Masami MIZUYAMA
发明人： Koji SHIROKI , Makoto OSAMURA , Takeshi KURIHARA , Masami MIZUYAMA
IPC分类号： H01L23/48
CPC分类号： G06K19/07754 , H01L23/4985 , H01L23/49855 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/07802 , H01L2924/14 , H01Q1/2283 , H01Q1/36 , H01Q9/285 , H01L2924/00 , H01L2224/0401
摘要： An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.
摘要翻译： RFIC模块包括安装在安装基板上并且被密封树脂层封装的RFIC芯片。安装基板包括柔性基座和设置在柔性基座上的电极。外部端子设置在RFIC芯片的安装表面的四个角附近。位于柔性基座的表面上的多个安装平台中的一个是共用安装台面，并且限定由RFIC芯片的RF端子和NC端子共享的集成安装台面。当从上方观察时，共享安装平台布置成覆盖RFIC芯片的一侧。

3. 发明申请

US20090302972A1 PACKAGING MATERIAL WITH ELECTROMAGNETIC COUPLING MODULE 有权
标题翻译：包装材料与电磁耦合模块
公开(公告)号：US20090302972A1
公开(公告)日：2009-12-10
申请号：US12536663
申请日：2009-08-06
申请人： Makoto OSAMURA , Norio SAKAI , Noboru KATO
发明人： Makoto OSAMURA , Norio SAKAI , Noboru KATO
IPC分类号： H03H7/00
CPC分类号： H01Q1/2208 , B65D65/403 , B65D2203/10 , G06K19/07749 , H01L2224/16225 , H01Q1/12 , H01Q1/2216 , H01Q1/2225
摘要： A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.
摘要翻译：包装材料包括用于RFID系统的电磁耦合模块，其中无线电IC芯片被保护免受外部冲击和环境变化而不影响包装材料的平面性，促进了包括电磁耦合模块的组件，并且辐射特性令人满意包装材料包括衬垫和波形芯材料，其中电磁耦合模块布置在包装材料的内部。电磁耦合模块包括无线电IC芯片和馈电电路板，其上安装有无线电IC芯片，馈电电路板包括包括电感元件的谐振电路。包装材料由电介质制成，其中电介质和电磁耦合模块电磁耦合以发送/接收高频信号。

4. 发明授权

US08381997B2 Radio frequency IC device and method of manufacturing the same 有权
标题翻译：射频IC器件及其制造方法
公开(公告)号：US08381997B2
公开(公告)日：2013-02-26
申请号：US13308575
申请日：2011-12-01
申请人： Makoto Osamura , Kenji Kubota , Noboru Kato
发明人： Makoto Osamura , Kenji Kubota , Noboru Kato
IPC分类号： G06K19/067
CPC分类号： G06K19/07756 , H01L2224/50 , Y10T29/4913
摘要： A radio frequency IC device that prevents variations in the value of capacitive coupling between a radio frequency IC element and a radiation electrode and has good signal transmission efficiency includes a radio frequency IC element including input/output electrodes and, a first base including intermediate electrodes that are capacitively coupled to the input/output electrodes and have capacitance values C1a and C1b, respectively, and a second base including radiation electrodes and that are capacitively coupled to the intermediate electrodes and have capacitance values C2a and C2b, respectively. A capacitance C1 obtained by combining C1a and C1b is smaller than a capacitance C2 obtained by combining C2a and C2b.
摘要翻译：防止射频IC元件与放射电极之间的电容耦合值的变动并且具有良好的信号传输效率的射频IC器件包括包括输入/输出电极的射频IC元件和包括中间电极的第一基底，电容耦合到输入/输出电极并且分别具有电容值C1a和C1b，以及包括辐射电极的第二基极，并且电容耦合到中间电极并分别具有电容值C2a和C2b。通过组合C1a和C1b获得的电容C1小于通过组合C2a和C2b获得的电容C2。

5. 发明授权

US08299968B2 Packaging material with electromagnetic coupling module 有权
标题翻译：包装材料带电磁耦合模块
公开(公告)号：US08299968B2
公开(公告)日：2012-10-30
申请号：US12536663
申请日：2009-08-06
申请人： Makoto Osamura , Norio Sakai , Noboru Kato
发明人： Makoto Osamura , Norio Sakai , Noboru Kato
IPC分类号： H01Q1/38 , H04B7/00
CPC分类号： H01Q1/2208 , B65D65/403 , B65D2203/10 , G06K19/07749 , H01L2224/16225 , H01Q1/12 , H01Q1/2216 , H01Q1/2225
摘要： A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.
摘要翻译：包装材料包括用于RFID系统的电磁耦合模块，其中无线电IC芯片被保护免受外部冲击和环境变化而不影响包装材料的平面性，促进了包括电磁耦合模块的组件，并且辐射特性令人满意包装材料包括衬垫和波形芯材料，其中电磁耦合模块布置在包装材料的内部。电磁耦合模块包括无线电IC芯片和馈电电路板，其上安装有无线电IC芯片，馈电电路板包括包括电感元件的谐振电路。包装材料由电介质制成，其中电介质和电磁耦合模块电磁耦合以发送/接收高频信号。

6. 发明申请

US20090305635A1 PACKAGING MATERIAL WITH ELECTROMAGNETIC COUPLING MODULE 审中-公开
标题翻译：包装材料与电磁耦合模块
公开(公告)号：US20090305635A1
公开(公告)日：2009-12-10
申请号：US12536669
申请日：2009-08-06
申请人： Makoto OSAMURA , Norio SAKAI , Noboru KATO
发明人： Makoto OSAMURA , Norio SAKAI , Noboru KATO
IPC分类号： H04B7/00
CPC分类号： H01Q1/2208 , B65D2203/10 , H01Q1/2216 , H01Q1/2225
摘要： A packaging material with an electromagnetic coupling module for a RFID system, is constructed such that a radio IC chip is protected from external shock and environmental change without adversely affecting the planarity of the packaging material, the assembly of a radiator and an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module and a radiator that are electromagnetically coupled to each other are arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The radiator electromagnetically couples with the electromagnetic coupling module to transmit/receive high frequency signals.
摘要翻译：具有用于RFID系统的电磁耦合模块的包装材料被构造成使得无线电IC芯片被保护免受外部冲击和环境变化，而不会不利地影响包装材料的平面性，散热器和电磁耦合模块的组装是促进，辐射特性令人满意。包装材料包括衬垫和波形芯材料，其中电磁耦合模块和彼此电磁耦合的散热器布置在包装材料的内部。电磁耦合模块包括无线电IC芯片和馈电电路板，其上安装有无线电IC芯片，馈电电路板包括包括电感元件的谐振电路。散热器与电磁耦合模块电磁耦合以发送/接收高频信号。

7. 发明申请

US20050115101A1 Method of drying honeycomb formed body 审中-公开
标题翻译：蜂窝成形体干燥方法
公开(公告)号：US20050115101A1
公开(公告)日：2005-06-02
申请号：US10506968
申请日：2003-02-05
申请人： Masayuki Nate , Makoto Osamura , Takahisa Kaneko , Yukihisa Wada
发明人： Masayuki Nate , Makoto Osamura , Takahisa Kaneko , Yukihisa Wada
IPC分类号： F26B3/347 , B28B3/20 , B28B11/00 , B28B11/24 , C04B35/636 , C04B38/00 , F26B11/00 , F26B25/16 , F27D5/00 , F26B3/34 , F26B7/00
CPC分类号： C04B35/6365 , B28B3/269 , B28B11/243 , B28B11/248 , C04B35/565 , C04B35/62655 , C04B38/0006 , C04B2111/00793 , C04B2111/0081 , C04B2235/428 , C04B2235/6021 , C04B2235/728 , C04B2235/80 , C04B2235/9638 , F27D5/00 , C04B40/02 , C04B40/0218
摘要： A method of drying a honeycomb formed body comprising an outer wall, partition walls disposed inside the outer wall, and cells surrounded by the partition walls and extending in an axial direction of the honeycomb formed body. The method of drying a honeycomb formed body comprises a drying step of starting to dry in a state of covering at least a part of the outer wall 7a and 7b with a guide 12 covering the outer wall 7a and/or 7b so as not to come into contact with the outer wall 7a and/or 7b. Alternatively, the method of drying a honeycomb formed body comprises a drying step of drying in a state of covering at least a part of the outer wall with a guide that covers the outer wall so as to come into contact with the outer wall, wherein in the drying step the pressure applied to the outer wall by the guide at the contact portion is less than 0.2 MPa. A method of drying a honeycomb formed body causing less distortion and cross sectional deformation in the honeycomb formed body is provided.
摘要翻译：蜂窝成形体的干燥方法，其包括外壁，设置在外壁内的隔壁，以及被隔壁围绕并沿蜂窝成形体的轴向延伸的孔。干燥蜂窝成形体的方法包括干燥步骤，其在覆盖外壁7a和7b的至少一部分的状态下开始干燥，其中导向件12覆盖外壁7a和/或7b。以不与外壁7a和/或7b接触。或者，干燥蜂窝成形体的方法包括干燥步骤，其以覆盖外壁的引导件覆盖外壁的至少一部分的状态进行干燥以与外壁接触，其中在通过导向件在接触部分施加到外壁的压力的干燥步骤小于0.2MPa。提供了一种蜂窝成形体的干燥方法，其在蜂窝成形体中产生较小的变形和横截面变形。

8. 发明授权

US08546927B2 RFIC chip mounting structure 有权
标题翻译： RFIC芯片安装结构
公开(公告)号：US08546927B2
公开(公告)日：2013-10-01
申请号：US13223429
申请日：2011-09-01
申请人： Koji Shiroki , Makoto Osamura , Takeshi Kurihara , Masami Mizuyama
发明人： Koji Shiroki , Makoto Osamura , Takeshi Kurihara , Masami Mizuyama
IPC分类号： H01L23/02 , H01L23/34
CPC分类号： G06K19/07754 , H01L23/4985 , H01L23/49855 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/07802 , H01L2924/14 , H01Q1/2283 , H01Q1/36 , H01Q9/285 , H01L2924/00 , H01L2224/0401
摘要： An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.
摘要翻译： RFIC模块包括安装在安装基板上并且被密封树脂层封装的RFIC芯片。安装基板包括柔性基座和设置在柔性基座上的电极。外部端子设置在RFIC芯片的安装表面的四个角附近。位于柔性基座的表面上的多个安装平台中的一个是共用安装台面，并且限定由RFIC芯片的RF端子和NC端子共享的集成安装台面。当从上方观察时，共享安装平台布置成覆盖RFIC芯片的一侧。

9. 发明申请

US20120074229A1 RADIO FREQUENCY IC DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：无线电频率IC器件及其制造方法
公开(公告)号：US20120074229A1
公开(公告)日：2012-03-29
申请号：US13308575
申请日：2011-12-01
申请人： Makoto OSAMURA , Kenji KUBOTA , Noboru KATO
发明人： Makoto OSAMURA , Kenji KUBOTA , Noboru KATO
IPC分类号： G06K19/077 , H05K13/04
CPC分类号： G06K19/07756 , H01L2224/50 , Y10T29/4913
摘要： A radio frequency IC device that prevents variations in the value of capacitive coupling between a radio frequency IC element and a radiation electrode and has good signal transmission efficiency includes a radio frequency IC element including input/output electrodes and, a first base including intermediate electrodes that are capacitively coupled to the input/output electrodes and have capacitance values C1a and C1b, respectively, and a second base including radiation electrodes and that are capacitively coupled to the intermediate electrodes and have capacitance values C2a and C2b, respectively. A capacitance C1 obtained by combining C1a and C1b is smaller than a capacitance C2 obtained by combining C2a and C2b.
摘要翻译：防止射频IC元件与放射电极之间的电容耦合值的变动并且具有良好的信号传输效率的射频IC器件包括包括输入/输出电极的射频IC元件和包括中间电极的第一基底，电容耦合到输入/输出电极并且分别具有电容值C1a和C1b，以及包括辐射电极的第二基极，并且电容耦合到中间电极并分别具有电容值C2a和C2b。通过组合C1a和C1b获得的电容C1小于通过组合C2a和C2b获得的电容C2。

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