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1. 发明授权

US08299968B2 Packaging material with electromagnetic coupling module 有权
标题翻译：包装材料带电磁耦合模块
公开(公告)号：US08299968B2
公开(公告)日：2012-10-30
申请号：US12536663
申请日：2009-08-06
申请人： Makoto Osamura , Norio Sakai , Noboru Kato
发明人： Makoto Osamura , Norio Sakai , Noboru Kato
IPC分类号： H01Q1/38 , H04B7/00
CPC分类号： H01Q1/2208 , B65D65/403 , B65D2203/10 , G06K19/07749 , H01L2224/16225 , H01Q1/12 , H01Q1/2216 , H01Q1/2225
摘要： A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.
摘要翻译：包装材料包括用于RFID系统的电磁耦合模块，其中无线电IC芯片被保护免受外部冲击和环境变化而不影响包装材料的平面性，促进了包括电磁耦合模块的组件，并且辐射特性令人满意包装材料包括衬垫和波形芯材料，其中电磁耦合模块布置在包装材料的内部。电磁耦合模块包括无线电IC芯片和馈电电路板，其上安装有无线电IC芯片，馈电电路板包括包括电感元件的谐振电路。包装材料由电介质制成，其中电介质和电磁耦合模块电磁耦合以发送/接收高频信号。

2. 发明授权

US08031124B2 Container with electromagnetic coupling module 有权
标题翻译：集装箱带电磁耦合模块
公开(公告)号：US08031124B2
公开(公告)日：2011-10-04
申请号：US12426369
申请日：2009-04-20
申请人： Noboru Kato , Norio Sakai
发明人： Noboru Kato , Norio Sakai
IPC分类号： H01Q1/38
CPC分类号： B65D25/20 , B65D2203/10 , G06K7/10178 , H01L2224/16 , H01Q1/2283 , H01Q1/362 , H01Q1/38 , H01Q7/00 , H01Q11/08
摘要： A container includes an electromagnetic coupling module on an inner surface of a container main body and a radiator made of a metal material on an outer surface of the container main body. The electromagnetic coupling module includes a feeder circuit board, on which a radio IC chip is mounted and in which a feeder circuit including a resonant circuit that has a predetermined resonant frequency and includes an inductance element is provided. The electromagnetic coupling module and the radiator preferably transmit and receive high-frequency signals through electromagnetic coupling. The container thus has an electromagnetic coupling module that includes a radio IC chip that is resistant to a shock applied from the outside and an environmental change, realizes an easy arrangement of a radiator and the electromagnetic coupling module, provides a preferable radiation characteristic, and is suitably used in an RFID system.
摘要翻译：容器包括在容器主体的内表面上的电磁耦合模块和在容器主体的外表面上由金属材料制成的散热器。电磁耦合模块包括馈电电路板，其上安装有无线电IC芯片，并且其中提供包括具有预定谐振频率并包括电感元件的谐振电路的馈电电路。电磁耦合模块和散热器优选通过电磁耦合传输和接收高频信号。因此，容器具有电磁耦合模块，其包括耐受来自外部施加的冲击和环境变化的无线IC芯片，实现散热器和电磁耦合模块的容易布置，提供优选的辐射特性，并且是适用于RFID系统。

3. 发明授权

US08720050B2 Method for manufacturing multilayer substrate with built-in chip-type electronic component 有权
标题翻译：具有内置芯片型电子部件的多层基板的制造方法
公开(公告)号：US08720050B2
公开(公告)日：2014-05-13
申请号：US12774072
申请日：2010-05-05
申请人： Osamu Chikagawa , Norio Sakai
发明人： Osamu Chikagawa , Norio Sakai
IPC分类号： H05K3/30
CPC分类号： H05K1/186 , H01L2224/16225 , H01L2924/19105 , H05K1/0306 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/10636 , Y02P70/611 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49163
摘要： A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor.
摘要翻译：具有内置芯片型电子部件的多层基板包括具有多个陶瓷层的陶瓷层叠体，设置在陶瓷层叠体中的具有外部端子电极的芯片型电子部件和设置在陶瓷层中的通路导体层叠方向。芯片型电子部件的外部端子电极与通路导体连接，在通孔导体的上端面和下端面中的至少一方形成连接工序。

4. 发明申请

US20090303549A1 Image processing device, image processing method, and image forming apparatus 有权
标题翻译：图像处理装置，图像处理方法和图像形成装置
公开(公告)号：US20090303549A1
公开(公告)日：2009-12-10
申请号：US12457239
申请日：2009-06-04
申请人： Norio Sakai
发明人： Norio Sakai
IPC分类号： H04N1/41
CPC分类号： H04N1/46 , H04N1/203 , H04N1/2032 , H04N1/32358 , H04N1/32443 , H04N2201/0094
摘要： An image processing device including a first image reading unit to read image data on a front side of a document page, a second image reading unit to read image data on a back side of the document page, a first image processing unit to process the image data read by the first image reading unit, a second image processing unit to process the image data read by the second image reading unit, a memory to store image data, a memory control unit to control access to the memory, and a bus switch that connects the first image processing unit and the second image processing unit to the memory control unit. The bus switch includes a first compression unit to compress the image data processed by the first image processing unit, and a second compression unit to compress the image data processed by the second image processing unit.
摘要翻译：一种图像处理装置，包括：第一图像读取单元，用于读取文档页面的前侧上的图像数据;第二图像读取单元，用于读取文档页面的背面的图像数据;第一图像处理单元，用于处理图像由第一图像读取单元读取的数据，用于处理由第二图像读取单元读取的图像数据的第二图像处理单元，存储图像数据的存储器，控制对存储器的存取的存储器控制单元以及总线开关，将第一图像处理单元和第二图像处理单元连接到存储器控制单元。总线开关包括用于压缩由第一图像处理单元处理的图像数据的第一压缩单元和用于压缩由第二图像处理单元处理的图像数据的第二压缩单元。

5. 发明授权

US07595997B2 Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子部件，多层陶瓷基板以及多层陶瓷电子部件的制造方法
公开(公告)号：US07595997B2
公开(公告)日：2009-09-29
申请号：US12165700
申请日：2008-07-01
申请人： Masato Nomiya , Norio Sakai , Mitsuyoshi Nishide
发明人： Masato Nomiya , Norio Sakai , Mitsuyoshi Nishide
IPC分类号： H05K1/14 , H01L23/48
CPC分类号： H05K1/181 , H01L21/4803 , H01L23/15 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01046 , H01L2924/01079 , H01L2924/09701 , H01L2924/19105 , H05K1/0306 , H05K1/113 , H05K3/0029 , H05K3/4611 , H05K3/4629 , H05K3/4694 , H05K2201/0195 , H05K2201/09045 , H05K2201/10378 , H05K2201/10674 , Y02P70/611 , Y10T428/24926 , H01L2224/0401
摘要： In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin, the multilayer ceramic body being formed by stacking a ceramic base material layer and a shrinkage-inhibiting layer having a predetermined conductor pattern. Also, a via hole conductor is disposed in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion, and a surface mounting-type electronic component such as a semiconductor element is connected, through a conductive binder, to the one of the end surfaces of the via hole conductor exposed in the surface of the pedestal portion. A resin is provided between the surface mounting-type electronic component and the pedestal portion, the resin having the same composition as in the resin of the pedestal portion. A semiconductor element is mounted as the surface mounting-type electronic component on the pedestal portion.
摘要翻译：在多层陶瓷电子部件中，在多层陶瓷体的第一主面的区域上设置基座部，并且包括非金属无机粉末和树脂，使得基座部分固定在第一主表面上，通过堆叠陶瓷基材层和具有预定导体图案的收缩抑制层，形成多层陶瓷体。此外，通孔导体设置在基座部分中，使得一个端面暴露在基座部分的表面中，并且诸如半导体元件的表面安装型电子部件通过导电粘合剂连接，到露出在基座部分的表面中的通孔导体的端面之一。在表面安装型电子部件和基座部之间设置有与基座部的树脂相同的树脂。半导体元件作为表面安装型电子部件安装在基座部上。

6. 发明申请

US20070158101A1 Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same 有权
标题翻译：具有内置片式电子元件的多层基板及其制造方法
公开(公告)号：US20070158101A1
公开(公告)日：2007-07-12
申请号：US10597919
申请日：2005-10-20
申请人： Osamu Chikagawa , Norio Sakai
发明人： Osamu Chikagawa , Norio Sakai
IPC分类号： H05K1/16
CPC分类号： H05K1/186 , H01L2224/16225 , H01L2924/19105 , H05K1/0306 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/10636 , Y02P70/611 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49163
摘要： A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor.
摘要翻译：具有内置芯片型电子部件的多层基板包括具有多个陶瓷层的陶瓷层叠体，设置在陶瓷层叠体中的具有外部端子电极的芯片型电子部件和设置在陶瓷层中的通路导体层叠方向。芯片型电子部件的外部端子电极与通路导体连接，在通孔导体的上端面和下端面中的至少一方形成连接工序。

7. 发明授权

US07162794B2 Manufacturing method for multilayer ceramic elements 有权
标题翻译：多层陶瓷元件的制造方法
公开(公告)号：US07162794B2
公开(公告)日：2007-01-16
申请号：US10348024
申请日：2003-01-22
申请人： Norio Sakai , Kazuhiro Iida
发明人： Norio Sakai , Kazuhiro Iida
IPC分类号： H05K3/30
CPC分类号： H01L23/585 , H01L21/481 , H01L2924/0002 , H05K1/0306 , H05K3/0052 , H05K2201/09036 , H05K2201/0909 , H05K2201/09781 , H05K2203/302 , Y10T29/49126 , Y10T29/4913 , Y10T29/49163 , Y10T29/49165 , Y10T29/49789 , Y10T29/4979 , H01L2924/00
摘要： A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.
摘要翻译：多层集成基板包括以栅格图案布置的断开槽，以将基板的主表面分割成多个块，并且还包括布置成穿过断开槽的防裂导体膜。防断裂导体膜含有防止多层一体化基板沿着断裂槽的不希望的断裂的金属成分。

8. 发明申请

US20060281297A1 Multilayer electronic part and structure for mounting multilayer electronic part 有权
标题翻译：用于安装多层电子部件的多层电子部件和结构
公开(公告)号：US20060281297A1
公开(公告)日：2006-12-14
申请号：US10554671
申请日：2005-01-05
申请人： Nobuaki Ogawa , Norio Sakai
发明人： Nobuaki Ogawa , Norio Sakai
IPC分类号： H01L21/4763 , H01L23/48
CPC分类号： H01L23/5384 , H01L23/5383 , H01L23/5389 , H01L2224/16225 , H01L2924/09701 , H01L2924/15192 , H01L2924/1531 , H01L2924/15311 , H01L2924/16152 , H01L2924/19105 , H01L2924/19106
摘要： A multilayer electronic component includes a multilayer substrate having a first main surface and a second main surface, a resin layer having a mounting surface and a contact surface bonded to the first main surface, a via conductor provided inside the resin layer, and an external terminal electrode disposed on the mounting surface so as to come in contact with the via conductor. The external terminal electrode has a first region on a main surface facing the mounting surface and a second region on a main surface facing away from the mounting surface. The first region is connected to the via conductor while the second region is provided with a bonding member. The second region is arranged such that, when the first region is projected through to the main surface facing away from the mounting surface, the second region is spaced from and does not overlap with a region in which the first region is projected.
摘要翻译：多层电子部件包括具有第一主表面和第二主表面的多层基板，具有安装表面和与第一主表面接合的接触表面的树脂层，设置在树脂层内部的通孔导体和外部端子电极，其设置在安装表面上以与通孔导体接触。外部端子电极在主表面上具有面向安装表面的第一区域和在远离安装表面的主表面上的第二区域。第一区域连接到通孔导体，而第二区域设置有接合构件。第二区域布置成使得当第一区域突出到远离安装表面的主表面时，第二区域与第一区域投影的区域间隔开并且不与第一区域突出的区域重叠。

9. 发明授权

US06891109B2 Monolithic ceramic substrate and method for making the same 有权
标题翻译：单片陶瓷基板及其制造方法
公开(公告)号：US06891109B2
公开(公告)日：2005-05-10
申请号：US10116646
申请日：2002-04-04
申请人： Mitsuyoshi Nishide , Ryoji Nakamura , Norio Sakai
发明人： Mitsuyoshi Nishide , Ryoji Nakamura , Norio Sakai
IPC分类号： B28B11/00 , H01L21/48 , H05K1/09 , H05K3/46 , H05K1/00
CPC分类号： B32B18/00 , B32B2307/202 , B32B2307/204 , B32B2307/206 , B32B2307/208 , B32B2307/538 , B32B2311/04 , B32B2311/08 , B32B2311/12 , C04B2235/3215 , C04B2235/3217 , C04B2235/36 , C04B2235/658 , C04B2237/40 , C04B2237/407 , C04B2237/408 , C04B2237/56 , C04B2237/562 , C04B2237/565 , C04B2237/706 , H01L21/481 , H01L21/4857 , H05K1/09 , H05K1/092 , H05K3/4626 , H05K2201/0195 , H05K2201/0317 , H05K2201/0352 , Y10T29/49126 , Y10T29/49155 , Y10T428/24926
摘要： A monolithic ceramic substrate includes a green laminate having a plurality of green functional ceramic layers including a functional ceramic material, green support layers including a ceramic material that does not sinter at a sintering temperature for the green functional ceramic material to prevent shrinkage of the functional ceramic layers, first conductor patterns including a thin-film conductor, and second conductor patterns including a thick-film conductor. The green laminate is fired at the sintering temperature for the green functional ceramic material.
摘要翻译：单片陶瓷基板包括具有多个功能性陶瓷材料的绿色功能性陶瓷层的绿色层压体，包含陶瓷材料的绿色支撑层，该陶瓷材料在烧结温度下不会烧结用于绿色功能性陶瓷材料，以防止功能性陶瓷的收缩层，包括薄膜导体的第一导体图案和包括厚膜导体的第二导体图案。绿色层压体在烧结温度下对于绿色功能性陶瓷材料进行烧制。

10. 发明授权

US06861588B2 Laminated ceramic electronic component and method of producing the same 有权
标题翻译：层压陶瓷电子部件及其制造方法
公开(公告)号：US06861588B2
公开(公告)日：2005-03-01
申请号：US10620096
申请日：2003-07-15
申请人： Norio Sakai , Mitsuyoshi Nishide , Masaaki Mizushiro , Kenji Kubota , Nobuyuki Suzuki
发明人： Norio Sakai , Mitsuyoshi Nishide , Masaaki Mizushiro , Kenji Kubota , Nobuyuki Suzuki
IPC分类号： H01L23/498 , H05K1/03 , H05K3/40 , H05K3/46 , H01L23/02
CPC分类号： H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4007 , H05K3/4611 , H05K3/4629 , H01L2924/00
摘要： A laminated ceramic electronic component includes an embedded portion formed in the periphery of an external terminal electrode so as to extend and be embedded in a component main member defined by ceramic layers, whereby affects of a small edge angle are eliminated.
摘要翻译：层叠陶瓷电子部件包括形成在外部端子电极的周围的嵌入部分，以便延伸并嵌入由陶瓷层限定的部件主要部件中，从而消除了小的边缘角度的影响。

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