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1. 发明授权

US08546927B2 RFIC chip mounting structure 有权
标题翻译： RFIC芯片安装结构
公开(公告)号：US08546927B2
公开(公告)日：2013-10-01
申请号：US13223429
申请日：2011-09-01
申请人： Koji Shiroki , Makoto Osamura , Takeshi Kurihara , Masami Mizuyama
发明人： Koji Shiroki , Makoto Osamura , Takeshi Kurihara , Masami Mizuyama
IPC分类号： H01L23/02 , H01L23/34
CPC分类号： G06K19/07754 , H01L23/4985 , H01L23/49855 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/07802 , H01L2924/14 , H01Q1/2283 , H01Q1/36 , H01Q9/285 , H01L2924/00 , H01L2224/0401
摘要： An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.
摘要翻译： RFIC模块包括安装在安装基板上并且被密封树脂层封装的RFIC芯片。安装基板包括柔性基座和设置在柔性基座上的电极。外部端子设置在RFIC芯片的安装表面的四个角附近。位于柔性基座的表面上的多个安装平台中的一个是共用安装台面，并且限定由RFIC芯片的RF端子和NC端子共享的集成安装台面。当从上方观察时，共享安装平台布置成覆盖RFIC芯片的一侧。

2. 发明授权

US08941552B2 Composite printed wiring board and wireless communication system 有权
标题翻译：复合印刷线路板及无线通讯系统
公开(公告)号：US08941552B2
公开(公告)日：2015-01-27
申请号：US13572722
申请日：2012-08-13
申请人： Makoto Takeoka , Koji Shiroki , Nobuo Ikemoto , Yuya Dokai
发明人： Makoto Takeoka , Koji Shiroki , Nobuo Ikemoto , Yuya Dokai
IPC分类号： H01Q7/00 , G06K19/077 , H05K1/14 , H01Q1/22 , H01Q1/38 , H01Q23/00 , H05K3/34
CPC分类号： G06K19/07749 , H01Q1/2208 , H01Q1/38 , H01Q23/00 , H05K1/141 , H05K3/3436 , H05K2201/09481 , H05K2201/10098
摘要： A composite printed wiring board includes a parent board and a child board that is mounted on the parent board. A wireless IC element that processes a high-frequency signal, a loop-shaped electrode that is coupled to the wireless IC element, and a first radiator that is coupled to the loop-shaped electrode are provided on the child board. A second radiator that is coupled to the loop-shaped electrode via an electromagnetic field is provided on the parent board.
摘要翻译：复合印刷电路板包括母板和安装在母板上的子板。处理高频信号的无线IC元件，耦合到无线IC元件的环形电极和耦合到环形电极的第一散热器设置在子板上。在母板上提供通过电磁场耦合到环形电极的第二辐射器。

3. 发明授权

US06442399B1 Mobile communication apparatus 有权
标题翻译：移动通信装置
公开(公告)号：US06442399B1
公开(公告)日：2002-08-27
申请号：US09506474
申请日：2000-02-17
申请人： Teruhisa Tsuru , Harufumi Mandai , Koji Shiroki , Kenji Asakura , Seiji Kanba
发明人： Teruhisa Tsuru , Harufumi Mandai , Koji Shiroki , Kenji Asakura , Seiji Kanba
IPC分类号： H04B138
CPC分类号： H01Q1/362 , H01Q1/24 , H01Q1/243 , H01Q1/38
摘要： A portable telephone includes a portable telephone body made from plastic having a receiver, a transmitter, and dial keys, and a chip antenna which is mounted on a circuit board secured at the inside of the portable telephone body and which is electrically connected to an RF section provided on the circuit board in the portable telephone. The chip antenna is disposed near the transmitter at a location where a transmitted electromagnetic signal is unlikely to be affected by the body of a person who is holding the portable telephone.
摘要翻译：便携式电话包括由具有接收器，发射器和拨号键的塑料制成的便携式电话机，以及安装在固定在便携式电话机内部的电路板上的芯片天线，该电路板电连接到RF 在便携式电话机的电路板上提供的部分。芯片天线设置在发射机附近的位置，其中传输的电磁信号不太可能受到正在握持便携式电话的人的身体的影响。

4. 发明授权

US06222489B1 Antenna device 失效
标题翻译：天线设备
公开(公告)号：US06222489B1
公开(公告)日：2001-04-24
申请号：US09525821
申请日：2000-03-15
申请人： Teruhisa Tsuru , Harufumi Mandai , Koji Shiroki , Kenji Asakura , Seiji Kanba
发明人： Teruhisa Tsuru , Harufumi Mandai , Koji Shiroki , Kenji Asakura , Seiji Kanba
IPC分类号： H01Q136
CPC分类号： H01Q1/38 , H01Q1/362 , H01Q9/285
摘要： An antenna device, comprising an antenna unit including basic body comprising at least one of dielectric ceramic and magnetic ceramic, at least one conductor disposed at least one of inside and on a surface of the basic body, and a feeding electrode for applying a voltage to the conductor disposed on the surface of the basic body; a mounting board on which the antenna unit is mounted; a ground part in association with the mounting board and adapted to resonate with the antenna unit; and a length in the polarization direction of a radio wave of the ground part being about &lgr;/4 or more, where &lgr; is a wavelength of the radio wave, the basic body comprising a first generally planar sheet having a plurality of spaced, first conductors formed on one major surface thereof and a second generally planar sheet having a plurality of spaced second conductors formed on one major surface thereof; the first and second generally planar sheets being laminated together to form an elongated structure wherein respective pairs of the first and second conductors are coupled to one another to form respective spiral loops of a spiral antenna so that a central axis of the spiral antenna extends generally parallel to a longitudinal direction of the elongated structure; each of the sheets being formed of a material having a permeability of 1
摘要翻译：一种天线装置，包括天线单元，所述天线单元包括基体，所述天体单元包括介电陶瓷和磁性陶瓷中的至少一种，至少一个布置在所述基体的内部和表面中的至少一个导体，以及馈电电极，所述导体设置在所述基体的表面上; 安装天线单元的安装板; 与安装板相关联并适于与天线单元谐振的接地部分; 并且所述接地部分的无线电波的极化方向上的长度约为lambd / 4或更大，其中lambd是所述无线电波的波长，所述基体包括具有多个间隔开的第一导体在其一个主表面上形成有第二大体上平坦的片，其具有形成在其一个主表面上的多个间隔开的第二导体; 所述第一和第二大体平坦的片材被层压在一起以形成细长的结构，其中相应的第一和第二导体的对彼此耦合以形成螺旋形天线的相应的螺旋环，使得螺旋天线的中心轴线大致平行地延伸到所述细长结构的纵向方向; 每个片材由导磁率为1 <7或介电常数εi为1

5. 发明授权

US6052096A Chip antenna 失效
标题翻译：芯片天线
公开(公告)号：US6052096A
公开(公告)日：2000-04-18
申请号：US693447
申请日：1996-08-07
申请人： Teruhisa Tsuru , Harufumi Mandai , Koji Shiroki , Kenji Asakura , Seiji Kanba
发明人： Teruhisa Tsuru , Harufumi Mandai , Koji Shiroki , Kenji Asakura , Seiji Kanba
IPC分类号： H01Q1/36 , H01Q1/38 , H01Q7/00 , H01Q11/08
CPC分类号： H01Q1/38 , H01Q1/362
摘要： The present invention is directed to provide a compact chip antenna for mobile communication comprising a base member which comprises either of a material having a dielectric constant .epsilon. of 1
摘要翻译：本发明旨在提供一种用于移动通信的紧凑型芯片天线，其包括基本构件，该基座构件包括介电常数ε为1 <ε<130的材料或相对磁导率μ为1 <7的材料，至少一个导体，其形成在所述基底构件的表面上和/或所述基底构件的内部;以及至少一个馈电端子，设置在所述衬底的表面上，用于向所述导体施加电压。导体包括主要包含铜，镍，银，钯，铂或金中的任何一种的金属。

6. 发明授权

US5818398A Surface mounting type antenna system 失效
标题翻译：表面安装型天线系统
公开(公告)号：US5818398A
公开(公告)日：1998-10-06
申请号：US823828
申请日：1997-03-25
申请人： Teruhisa Tsuru , Haruhumi Mandai , Koji Shiroki , Kenji Asakura
发明人： Teruhisa Tsuru , Haruhumi Mandai , Koji Shiroki , Kenji Asakura
IPC分类号： H01Q1/36 , H01Q11/08 , H01Q1/24
CPC分类号： H01Q1/362 , H01Q11/08
摘要： A surface mounting type antenna system 10 is formed by spirally winding a conductor 14 made of copper or copper alloy, with a power supply member 12 provided at one end of the conductor 14, the other end thereof being a free end 13, on the edge faces of a rectangular parallelepiped as a dielectric substrate 11 by printing, deposition, pasting or plating. The dielectric substrate 11 is prepared by stacking a plurality of layers of ceramics, resin or a combination of ceramics and resin. On the underside 111 of the dielectric substrate 11 lies a power supply terminal 15 to which the power supply member 12 of the conductor 14 is connected. The power supply terminal 15 is simultaneously used as a fixing terminal for securing the surface mounting type antenna system 10 to, for example, a mounting board. Moreover, the conductor 14 squarely intersecting the axis C of the conductor winding is rectangular in transverse cross section having a width of w and a length of l.
摘要翻译：表面安装型天线系统10通过螺旋地缠绕由铜或铜合金制成的导体14而形成，电源构件12设置在导体14的一端，另一端为自由端13，在边缘通过印刷，沉积，糊化或电镀作为电介质基板11的长方体的表面。电介质基板11通过层叠多层陶瓷，树脂或陶瓷和树脂的组合来制备。电介质基板11的下侧111位于与导体14的电源部件12连接的电源端子15上。电源端子15同时用作用于将表面安装型天线系统10固定到例如安装板的固定端子。此外，与导体绕组的轴线C正交地交叉的导体14在宽度为w且长度为l的横截面中为矩形。

7. 发明授权

US5969680A Antenna device having a radiating portion provided between a wiring substrate and a case 失效
标题翻译：具有设置在布线基板和壳体之间的散热部的天线装置
公开(公告)号：US5969680A
公开(公告)日：1999-10-19
申请号：US883871
申请日：1997-06-27
申请人： Teruhisa Tsuru , Harufumi Mandai , Koji Shiroki , Kenji Asakura
发明人： Teruhisa Tsuru , Harufumi Mandai , Koji Shiroki , Kenji Asakura
IPC分类号： H01Q1/24 , H01Q9/04 , H01Q1/38
CPC分类号： H01Q9/0421 , H01Q1/243
摘要： An antenna device having a power supplying portion 52 mounted on a main wiring substrate 53a and a radiating portion 56a provided in a space between the main wiring substrate 53a and the inner surface of a sheathing case 55, the lower surface of the radiating portion 56a being opposed to the power supplying portion 52.
摘要翻译：一种天线装置，其具有安装在主布线基板53a上的供电部分52和设置在主布线基板53a和护套壳体55的内表面之间的空间中的散热部分56a，辐射部分56a的下表面是与供电部分52相对。

8. 发明授权

US5900845A Antenna device 失效
标题翻译：天线设备
公开(公告)号：US5900845A
公开(公告)日：1999-05-04
申请号：US711719
申请日：1996-09-04
申请人： Harufumi Mandai , Kenji Asakura , Teruhisa Tsuru , Koji Shiroki , Seiji Kanaba
发明人： Harufumi Mandai , Kenji Asakura , Teruhisa Tsuru , Koji Shiroki , Seiji Kanaba
IPC分类号： H01Q13/26 , H01Q1/27 , H01Q1/36 , H01Q1/38 , H01Q1/40 , H01Q9/30 , H05K3/30 , H05K3/34 , H01Q1/12
CPC分类号： H01Q1/362 , H01Q1/38 , H01Q1/40 , H05K3/301 , H05K3/3426 , Y02P70/613
摘要： An antenna device is provided in which deterioration of characteristics is prevented and which has improved strength. A chip antenna is inserted into a resin case serving as a support member, and one terminal of the resin case is bonded to a power feeding terminal and another terminal of the case is bonded to a fixation terminal of the chip antenna 2 by solder. The chip antenna is fixed to the resin case so that a gap is provided between the printed circuit board on which the chip antenna is mounted and the chip antenna. Then, by bonding the terminals of the resin case to the printed circuit board by solder, the chip antenna is mounted on the printed circuit board.
摘要翻译：提供一种天线装置，其中防止了特性的劣化并且其强度提高。将芯片天线插入到用作支撑构件的树脂壳体中，并且树脂壳体的一个端子接合到馈电端子，并且壳体的另一个端子通过焊料接合到芯片天线2的固定端子。芯片天线被固定到树脂壳体上，使得在安装有芯片天线的印刷电路板和芯片天线之间提供间隙。然后，通过焊接将树脂壳体的端子与印刷电路板接合，将芯片天线安装在印刷电路板上。

9. 发明授权

US5726612A Chip-type electronic component 失效
标题翻译：片式电子元器件
公开(公告)号：US5726612A
公开(公告)日：1998-03-10
申请号：US693582
申请日：1996-08-01
申请人： Harufumi Mandai , Noboru Kato , Koji Shiroki , Atsushi Tojyo
发明人： Harufumi Mandai , Noboru Kato , Koji Shiroki , Atsushi Tojyo
IPC分类号： H01F27/29 , H01G4/224 , H05K3/30 , H05K13/04 , H03H7/01
CPC分类号： H01G4/224 , H01F27/292 , H05K13/0408 , H05K13/046 , H05K3/303 , H05K2201/09181 , H05K2201/10568 , H05K2203/0195 , H05K2203/082 , Y02P70/613 , Y10T29/53178 , Y10T29/53191
摘要： A chip-type electronic component comprising at least one electronic component element which is mounted on a substrate. The electronic component element is provided on its upper portion with a flat surface which can be engaged by a suction nozzle.
摘要翻译：芯片型电子部件，其包括安装在基板上的至少一个电子元件元件。电子元件在其上部设置有可由吸嘴接合的平坦表面。

10. 发明授权

US5401910A Electronic component 失效
标题翻译：电子元器件
公开(公告)号：US5401910A
公开(公告)日：1995-03-28
申请号：US162444
申请日：1993-12-03
申请人： Harufumi Mandai , Noboru Kato , Koji Shiroki
发明人： Harufumi Mandai , Noboru Kato , Koji Shiroki
IPC分类号： C25D7/00 , H01G4/228 , H01G4/232 , H01L23/538 , H05K1/00
CPC分类号： H01G4/2325 , H01L23/5383 , H01L2924/0002
摘要： A ceramic substrate has a single plating film formed on both wiring electrodes formed on an upper surface of a ceramic body and external electrodes formed on side surfaces and a lower surface of the ceramic body. The plating film on the wiring electrodes and the external electrodes has a first plating layer made of Ni and a second plating layer made of Sn.
摘要翻译：陶瓷基板具有形成在陶瓷体的上表面上形成的两个布线电极上的单个电镀膜和形成在陶瓷体的侧面和下表面的外部电极。布线电极和外部电极上的镀膜具有由Ni制成的第一镀层和由Sn制成的第二镀层。

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