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1. 发明授权

US08381997B2 Radio frequency IC device and method of manufacturing the same 有权
标题翻译：射频IC器件及其制造方法
公开(公告)号：US08381997B2
公开(公告)日：2013-02-26
申请号：US13308575
申请日：2011-12-01
申请人： Makoto Osamura , Kenji Kubota , Noboru Kato
发明人： Makoto Osamura , Kenji Kubota , Noboru Kato
IPC分类号： G06K19/067
CPC分类号： G06K19/07756 , H01L2224/50 , Y10T29/4913
摘要： A radio frequency IC device that prevents variations in the value of capacitive coupling between a radio frequency IC element and a radiation electrode and has good signal transmission efficiency includes a radio frequency IC element including input/output electrodes and, a first base including intermediate electrodes that are capacitively coupled to the input/output electrodes and have capacitance values C1a and C1b, respectively, and a second base including radiation electrodes and that are capacitively coupled to the intermediate electrodes and have capacitance values C2a and C2b, respectively. A capacitance C1 obtained by combining C1a and C1b is smaller than a capacitance C2 obtained by combining C2a and C2b.
摘要翻译：防止射频IC元件与放射电极之间的电容耦合值的变动并且具有良好的信号传输效率的射频IC器件包括包括输入/输出电极的射频IC元件和包括中间电极的第一基底，电容耦合到输入/输出电极并且分别具有电容值C1a和C1b，以及包括辐射电极的第二基极，并且电容耦合到中间电极并分别具有电容值C2a和C2b。通过组合C1a和C1b获得的电容C1小于通过组合C2a和C2b获得的电容C2。

2. 发明授权

US08299968B2 Packaging material with electromagnetic coupling module 有权
标题翻译：包装材料带电磁耦合模块
公开(公告)号：US08299968B2
公开(公告)日：2012-10-30
申请号：US12536663
申请日：2009-08-06
申请人： Makoto Osamura , Norio Sakai , Noboru Kato
发明人： Makoto Osamura , Norio Sakai , Noboru Kato
IPC分类号： H01Q1/38 , H04B7/00
CPC分类号： H01Q1/2208 , B65D65/403 , B65D2203/10 , G06K19/07749 , H01L2224/16225 , H01Q1/12 , H01Q1/2216 , H01Q1/2225
摘要： A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.
摘要翻译：包装材料包括用于RFID系统的电磁耦合模块，其中无线电IC芯片被保护免受外部冲击和环境变化而不影响包装材料的平面性，促进了包括电磁耦合模块的组件，并且辐射特性令人满意包装材料包括衬垫和波形芯材料，其中电磁耦合模块布置在包装材料的内部。电磁耦合模块包括无线电IC芯片和馈电电路板，其上安装有无线电IC芯片，馈电电路板包括包括电感元件的谐振电路。包装材料由电介质制成，其中电介质和电磁耦合模块电磁耦合以发送/接收高频信号。

3. 发明授权

US09705194B2 Antenna module 有权
公开(公告)号：US09705194B2
公开(公告)日：2017-07-11
申请号：US13368358
申请日：2012-02-08
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
IPC分类号： H01Q9/04
CPC分类号： H01Q9/0407
摘要： In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

4. 发明授权

US09064198B2 Electromagnetic-coupling-module-attached article 有权
公开(公告)号：US09064198B2
公开(公告)日：2015-06-23
申请号：US11740509
申请日：2007-04-26
申请人： Noboru Kato , Ikuhei Kimura , Kimikazu Iwasaki , Satoshi Ishino
发明人： Noboru Kato , Ikuhei Kimura , Kimikazu Iwasaki , Satoshi Ishino
IPC分类号： G08B13/14 , G06K19/077
CPC分类号： H02J50/12 , G06K19/07749 , G06K19/07771 , G06K19/07773 , H01L2224/16227 , H02J17/00
摘要： An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.

5. 发明授权

US08797148B2 Radio frequency IC device and radio communication system 有权
标题翻译：射频IC设备和无线电通信系统
公开(公告)号：US08797148B2
公开(公告)日：2014-08-05
申请号：US12859340
申请日：2010-08-19
申请人： Noboru Kato , Nobuo Ikemoto
发明人： Noboru Kato , Nobuo Ikemoto
IPC分类号： G08C17/02 , G06K19/077
CPC分类号： G06K19/07749 , G06K19/07767 , G06K19/07777 , G06K19/07786 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01Q1/2208 , H01Q1/2216 , H01Q1/2225 , H01Q1/38 , H01Q9/16 , H01Q9/24 , H01Q23/00 , H01L2224/0401
摘要： A radio frequency IC device achieves impedance matching between a radio IC chip and a radiation plate in a wide frequency band, and achieves desired radiation characteristics over a wide range of frequencies. A radio frequency IC device and a radio communication system allow both long-distance and short-distance communication and, in particular, allow short-distance communication using a small amount of energy. The radio frequency IC device includes an electromagnetic coupling module including a radio IC chip and a feed circuit board, and a radiation plate. An annular electrode is arranged to be coupled to both a feed circuit of the electromagnetic coupling module and the radiation plate. The radiation plate defines an electric-field radiation plate for long-distance communication, while the annular electrode defines a magnetic-field radiation plate for short-distance communication. The feed circuit board may be removed, so that the radio IC chip is coupled to the annular electrode directly or with an interposer disposed therebetween.
摘要翻译：射频IC器件在宽频带中实现无线IC芯片与辐射板之间的阻抗匹配，并且在宽的频率范围内实现期望的辐射特性。无线电频率IC设备和无线电通信系统允许远程和短距离通信，并且特别地允许使用少量能量的短距离通信。射频IC器件包括具有无线IC芯片和馈电电路基板的电磁耦合模块和辐射板。环形电极被布置成耦合到电磁耦合模块的馈电电路和辐射板。辐射板限定了用于长距离通信的电场辐射板，而环形电极限定了用于短距离通信的磁场辐射板。馈电电路板可以被去除，使得无线电IC芯片直接耦合到环形电极或者设置在它们之间的插入器。

6. 发明授权

US08692718B2 Antenna and wireless IC device 有权
标题翻译：天线和无线IC器件
公开(公告)号：US08692718B2
公开(公告)日：2014-04-08
申请号：US13083626
申请日：2011-04-11
申请人： Noboru Kato , Yuya Dokai
发明人： Noboru Kato , Yuya Dokai
IPC分类号： H01Q1/38
CPC分类号： H01Q9/045 , G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01Q1/2283 , H01Q1/36 , H01Q1/40 , H01Q7/00
摘要： An antenna and a wireless IC device that includes the antenna are provided for which the manufacturing process is simple and for which there is a low probability of a poor connection occurring between a feeder portion and a radiation electrode. An antenna includes a radiation electrode that is provided on a main surface of an insulator board, a ground electrode and/or a counter electrode that is arranged so as to oppose the radiation electrode, and a magnetic field electrode that is connected to the radiation electrode through a connection portion. The magnetic field electrode is defined by line-shaped electrodes and feeds a signal to the radiation electrode from a feeder portion defined by ends of the line-shaped electrodes through the magnetic field electrode.
摘要翻译：提供了包括天线的天线和无线IC器件，其制造过程简单，并且在馈电部分和辐射电极之间出现差的连接的可能性很低。天线包括设置在绝缘体板的主表面上的辐射电极，与辐射电极相对配置的接地电极和/或对电极，以及连接到辐射电极的磁场电极通过连接部分。磁场电极由线状电极限定，并且通过磁场电极从由线状电极的端部限定的馈电部分向辐射电极馈送信号。

7. 发明授权

US08676117B2 Wireless IC device and component for wireless IC device 有权
公开(公告)号：US08676117B2
公开(公告)日：2014-03-18
申请号：US13567108
申请日：2012-08-06
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC分类号： H04B5/00
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

8. 发明授权

US08668151B2 Wireless IC device 有权
标题翻译：无线IC设备
公开(公告)号：US08668151B2
公开(公告)日：2014-03-11
申请号：US12859880
申请日：2010-08-20
申请人： Noboru Kato , Satoshi Ishino
发明人： Noboru Kato , Satoshi Ishino
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , H01F17/0013 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/181 , H01Q1/2283 , H01Q1/50 , H01Q7/00 , H01Q21/29 , H05K1/0239 , H05K1/0243 , H05K3/305 , H05K2201/10098 , H05K2201/10727 , H01L2924/00012 , H01L2224/0401
摘要： A wireless IC device improves radiation characteristics or directivity of signals and reliably communicates with a reader/writer. The wireless IC device includes an electromagnetically coupled module includes a wireless IC device and a feed circuit substrate, a protective layer, a first radiation plate, and a second radiation plate. The feed circuit substrate includes a feed circuit including inductance elements. The feed circuit is electrically connected to the wireless IC chip and coupled to the radiation plates. Signals received by the radiation plates are provided to the wireless IC chip via the feed circuit. Signals from the wireless IC chip are provided to the radiation plates via the feed circuit and then radiated to the outside.
摘要翻译：无线IC器件提高信号的辐射特性或方向性，并可靠地与读/写器通信。无线IC器件包括电磁耦合模块，其包括无线IC器件和馈电电路衬底，保护层，第一辐射板和第二辐射板。馈电电路基板包括包括电感元件的馈电电路。馈电电路电连接到无线IC芯片并耦合到辐射板。由辐射板接收的信号通过馈电电路提供给无线IC芯片。来自无线IC芯片的信号通过馈电电路提供给辐射板，然后辐射到外部。

9. 发明授权

US08592687B2 Signal line and circuit substrate 有权
公开(公告)号：US08592687B2
公开(公告)日：2013-11-26
申请号：US13343740
申请日：2012-01-05
申请人： Noboru Kato , Jun Sasaki , Satoshi Ishino
发明人： Noboru Kato , Jun Sasaki , Satoshi Ishino
IPC分类号： H05K1/02
CPC分类号： H05K1/0298 , H01P3/081 , H01P3/088 , H05K1/0219 , H05K1/0225 , H05K1/028 , H05K2201/0715 , H05K2201/09618
摘要： A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.

10. 发明授权

US08590797B2 Wireless IC device 有权
公开(公告)号：US08590797B2
公开(公告)日：2013-11-26
申请号：US13585866
申请日：2012-08-15
申请人： Noboru Kato , Nobuo Ikemoto
发明人： Noboru Kato , Nobuo Ikemoto
IPC分类号： G06K19/06
CPC分类号： G06K19/0775 , G06K19/0709 , G06K19/0723 , G06K19/07749 , G06K19/07779 , G06K19/07781 , G06K19/07783 , G06K19/07784 , H01Q1/2225 , H01Q1/48 , H01Q7/00 , H05K1/0243 , H05K2201/10098
摘要： A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.

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