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1. 发明申请

WO2006132664A3 DECAL TRANSFER LITHOGRAPHY 审中-公开
公开(公告)号：WO2006132664A3
公开(公告)日：2007-04-05
申请号：PCT/US2005036812
申请日：2005-10-14
申请人： UNIV ILLINOIS , NUZZO RALPH G , CHILDS WILLIAM R , MOTALA MICHAEL J , LEE KEON JAE
发明人： NUZZO RALPH G , CHILDS WILLIAM R , MOTALA MICHAEL J , LEE KEON JAE
IPC分类号： G03F7/00
CPC分类号： G03F7/0002 , B81C1/0038 , B81C2201/0159 , B81C2201/0191 , B81C2203/038 , B82Y10/00 , B82Y40/00 , G03F7/34 , G03F7/346
摘要： A method of making a microstructure includes selectively activating a portion of a surface of a silicon-containing elastomer, contacting the activated portion with a substance, and bonding the activated portion and the substance, such that the activated portion of the surface and the substance in contact with the activated portion are irreversibly attached. The selective activation may be accomplished by positioning a mask on the surface of the silicon-containing elastomer, and irradiating the exposed portion with UV radiation.
摘要翻译：制造微结构的方法包括选择性地激活含硅弹性体的表面的一部分，使活化部分与物质接触，并且将活化部分和物质接合，使得表面的活化部分和物质在与活化部分的接触不可逆地附着。选择性活化可以通过将掩模定位在含硅弹性体的表面上，并用紫外线辐射照射暴露部分来实现。

2. 发明申请

WO2012047071A3 METHOD FOR MANUFACTURING FLEXIBLE NANOGENERATOR AND FLEXIBLE NANOGENERATOR MANUFACTURED THEREBY 审中-公开
公开(公告)号：WO2012047071A3
公开(公告)日：2012-08-23
申请号：PCT/KR2011007473
申请日：2011-10-10
申请人： KOREA ADVANCED INST SCI & TECH , LEE KEON JAE , PARK KWI IL , KOO MIN , HWANG GEON TAE
发明人： LEE KEON JAE , PARK KWI IL , KOO MIN , HWANG GEON TAE
IPC分类号： H02N2/18 , H01L41/312
CPC分类号： H02N2/186 , B81B2201/032 , B81C1/00357 , B81C2201/0194 , H01L41/312
摘要： Provided are a method for manufacturing a flexible nanogenerator and a flexible nanogenerator manufactured thereby. The method for manufacturing the flexible nanogenerator of the present invention includes the steps of: laminating a piezoelectric element layer having a piezoelectric material layer on a sacrificial substrate; crystallizing the piezoelectric element layer by thermally processing the piezoelectric element layer at a high temperature; separating unit piezoelectric elements from the sacrificial substrate by removing the sacrificial substrate; and transferring the separated unit piezoelectric elements onto a flexible substrate. The method for manufacturing the flexible nanogenerator and the flexible nanogenerator manufactured thereby of the present invention can continuously produce electric power from the movement of a human body and the like by producing electric power according to the bending of the substrate.

3. 发明申请

WO2008030960A2 CONTROLLED BUCKLING STRUCTURES IN SEMICONDUCTOR INTERCONNECTS AND NANOMEMBRANES FOR STRETCHABLE ELECTRONICS 审中-公开
标题翻译：可拉伸电子半导体互连和纳米材料中的受控屈曲结构
公开(公告)号：WO2008030960A2
公开(公告)日：2008-03-13
申请号：PCT/US2007/077759
申请日：2007-09-06
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , ROGERS, John A. , NUZZO, Ralph G. , MEITL, Matthew , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-young , SUN, Yugang , ZHU, Zhengtao , KO, Heung Cho , CARLSON, Andrew , CHOI, Won Mook , STOYKOVICH, Mark , JIANG, Hanqing , HUANG, Young
发明人： ROGERS, John A. , NUZZO, Ralph G. , MEITL, Matthew , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-young , SUN, Yugang , ZHU, Zhengtao , KO, Heung Cho , CARLSON, Andrew , CHOI, Won Mook , STOYKOVICH, Mark , JIANG, Hanqing , HUANG, Young
IPC分类号： H01L31/16
CPC分类号： H01L27/0688 , B81B3/0078 , B82Y10/00 , H01L21/6835 , H01L21/8221 , H01L21/8258 , H01L27/0605 , H01L27/1292 , H01L27/1446 , H01L27/281 , H01L29/0665 , H01L29/0673 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/20 , H01L29/7781 , H01L29/7842 , H01L29/78681 , H01L29/78696 , H01L31/0203 , H01L51/0097 , H01L2924/00011 , H01L2924/0002 , H01L2924/13091 , H01L2924/30105 , H05K1/0283 , H05K1/0313 , H05K3/20 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00 , H01L2224/80001 , H01L2924/00012
摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
摘要翻译：在一个方面，本发明提供了可拉伸的和可选地可印刷的部件，例如半导体和电子电路，其能够在拉伸，压缩，弯曲或以其他方式变形时提供良好的性能，以及制造或调谐这样的可伸缩组件。对于一些应用优选的可拉伸半导体和电子电路除了可拉伸之外还是柔性的，并且因此能够沿一个或多个轴显着地伸长，弯曲，弯曲或其他变形。此外，本发明的可拉伸半导体和电子电路适用于各种各样的器件配置，以提供完全柔性的电子和光电子器件。

4. 发明申请

WO2006130721A2 PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 审中-公开
标题翻译：可制造半导体结构及相关制造和组装方法
公开(公告)号：WO2006130721A2
公开(公告)日：2006-12-07
申请号：PCT/US2006/021161
申请日：2006-06-01
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , NUZZO, Ralph G. , ROGERS, John A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Hueng Cho
发明人： NUZZO, Ralph G. , ROGERS, John A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Hueng Cho
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
摘要翻译：本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。本发明的组合物和方法提供了高精度的记录转印和微米尺寸和/或纳米半导体结构的阵列在包括大面积基底和/或柔性基底的基底上的集成。此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性半导体器件。

5. 发明申请

WO2005122285A2 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 审中-公开
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：WO2005122285A2
公开(公告)日：2005-12-22
申请号：PCT/US2005/019354
申请日：2005-06-02
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , NUZZO, Ralph, G. , ROGERS, John, A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao
发明人： NUZZO, Ralph, G. , ROGERS, John, A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao
IPC分类号： H01L31/0312
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

6. 发明申请

WO2012047071A2 METHOD FOR MANUFACTURING FLEXIBLE NANOGENERATOR AND FLEXIBLE NANOGENERATOR MANUFACTURED THEREBY 审中-公开
标题翻译：制造柔性纳米发射器及其制造的柔性纳米发射器的方法
公开(公告)号：WO2012047071A2
公开(公告)日：2012-04-12
申请号：PCT/KR2011007473
申请日：2011-10-10
申请人： KOREA ADVANCED INST SCI & TECH , LEE KEON JAE , PARK KWI IL , KOO MIN , HWANG GEON TAE
发明人： LEE KEON JAE , PARK KWI IL , KOO MIN , HWANG GEON TAE
IPC分类号： H02N2/18 , H01L41/312
CPC分类号： H02N2/186 , B81B2201/032 , B81C1/00357 , B81C2201/0194 , H01L41/312
摘要： Provided are a method for manufacturing a flexible nanogenerator and a flexible nanogenerator manufactured thereby. The method for manufacturing the flexible nanogenerator of the present invention includes the steps of: laminating a piezoelectric element layer having a piezoelectric material layer on a sacrificial substrate; crystallizing the piezoelectric element layer by thermally processing the piezoelectric element layer at a high temperature; separating unit piezoelectric elements from the sacrificial substrate by removing the sacrificial substrate; and transferring the separated unit piezoelectric elements onto a flexible substrate. The method for manufacturing the flexible nanogenerator and the flexible nanogenerator manufactured thereby of the present invention can continuously produce electric power from the movement of a human body and the like by producing electric power according to the bending of the substrate.
摘要翻译：提供了一种制造柔性纳米发电机的方法和由此制造的柔性纳米发电机。本发明的柔性纳米发电体的制造方法包括：在牺牲基板上层叠具有压电体层的压电元件层的工序; 通过在高温下对压电元件层进行热处理来使压电元件层结晶化; 通过去除牺牲衬底将单元压电元件与牺牲衬底分离; 并将分离的单元压电元件转移到柔性基板上。根据本发明制造的柔性纳米发电机及其制造的柔性纳米发电机的方法可以通过根据基板的弯曲产生电力而从人体的运动等连续地产生电力。

7. 发明申请

WO2005122285A3 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 审中-公开
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：WO2005122285A3
公开(公告)日：2007-08-30
申请号：PCT/US2005019354
申请日：2005-06-02
申请人： UNIV ILLINOIS , NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
发明人： NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
IPC分类号： H01L21/00 , B81C1/00 , H01L21/20 , H01L21/30 , H01L21/326 , H01L21/4763 , H01L21/77 , H01L23/48 , H01L27/01 , H01L29/06 , H01L29/08 , H01L29/786 , H01L31/0312 , H01L31/18
CPC分类号： H01L23/02 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/76 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements (555) and assembling printable semiconductor elements onto substrate surfaces (330). The present invention also provides stretchable semiconductor structures (760).
摘要翻译：本发明提供了用于制造可印刷半导体元件（555）并将可印刷半导体元件组装到衬底表面（330）上的方法和装置。本发明还提供可拉伸半导体结构（760）。

8. 发明申请

WO2012036537A2 APPARATUS AND METHOD FOR MANUFACTURING GRAPHENE USING A FLASH LAMP OR LASER BEAM, AND GRAPHENE MANUFACTURED BY SAME 审中-公开
标题翻译：使用闪光灯或激光束制造石墨的装置和方法以及由其制造的石墨
公开(公告)号：WO2012036537A2
公开(公告)日：2012-03-22
申请号：PCT/KR2011006917
申请日：2011-09-19
申请人： KOREA ADVANCED INST SCI & TECH , LEE KEON-JAE , CHOI IN-SUNG
发明人： LEE KEON-JAE , CHOI IN-SUNG
IPC分类号： C01B31/02 , B01J19/08 , C23C16/26 , H01L21/268
CPC分类号： C23C16/26 , B82Y30/00 , B82Y40/00 , C01B32/184 , H01L21/02527 , H01L21/0262 , H01L29/1606 , H01L29/518
摘要： Provided are a method and an apparatus for manufacturing graphene using a flash lamp, and graphene manufactured by the same. The apparatus of the present invention comprises: a chamber in which a substrate for growing graphene is arranged; an inlet unit which introduces reaction gas to one side of the substrate; a vacuum unit which applies vacuum to the chamber; and a flash lamp or laser device arranged in an upper portion of the chamber to irradiate light to the substrate, wherein the substrate is transferred by a roll-to-roll transfer means. The method and apparatus for manufacturing graphene according to the present invention induces reaction gas for graphene growth using heat of the light irradiated over a large area from the flash lamp, so as to grow graphene on the substrate. In addition, a flexible substrate is transferred by a roll-to-roll transfer system to grow graphene thereon, and graphene-based semiconductor devices may be mass-produced just by varying the composition of reaction gas without deforming graphene.
摘要翻译：提供了使用闪光灯制造石墨烯的方法和装置以及由其制造的石墨烯。本发明的装置包括：其中布置有用于生长石墨烯的基底的腔室; 入口单元，其将反应气体引入到所述基板的一侧; 真空单元，其向腔室施加真空; 以及布置在所述室的上部中以将光照射到所述基板的闪光灯或激光装置，其中所述基板通过卷对卷传送装置传送。根据本发明的用于制造石墨烯的方法和装置利用从闪光灯在大面积上照射的光的热量来诱导用于石墨烯生长的反应气体，以便在基板上生长石墨烯。此外，柔性基板通过辊对辊转移系统转移以在其上生长石墨烯，并且石墨烯半导体器件可以仅通过改变反应气体的组成而不使石墨烯变形而大量生产。

9. 发明申请

WO2006130721A3 PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 审中-公开
标题翻译：可制造半导体结构及相关制造和组装方法
公开(公告)号：WO2006130721A3
公开(公告)日：2009-06-25
申请号：PCT/US2006021161
申请日：2006-06-01
申请人： UNIV ILLINOIS , NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
发明人： NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
IPC分类号： H01L21/302 , H01L21/8242 , H01L23/62 , H01R12/00 , H05K3/36
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
摘要翻译：本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。本发明的组合物和方法提供了高精度的记录转印和微米尺寸和/或纳米半导体结构的阵列在包括大面积基底和/或柔性基底的基底上的集成。此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性半导体器件。

10. 发明申请

WO2006132664A2 DECAL TRANSFER LITHOGRAPHY 审中-公开
公开(公告)号：WO2006132664A2
公开(公告)日：2006-12-14
申请号：PCT/US2005/036812
申请日：2005-10-14
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , NUZZO, Ralph, G. , CHILDS, William, R. , MOTALA, Michael, J. , LEE, Keon, Jae
发明人： NUZZO, Ralph, G. , CHILDS, William, R. , MOTALA, Michael, J. , LEE, Keon, Jae
CPC分类号： G03F7/0002 , B81C1/0038 , B81C2201/0159 , B81C2201/0191 , B81C2203/038 , B82Y10/00 , B82Y40/00 , G03F7/34 , G03F7/346
摘要： A method of making a microstructure includes selectively activating a portion of a surface of a silicon-containing elastomer, contacting the activated portion with a substance, and bonding the activated portion and the substance, such that the activated portion of the surface and the substance in contact with the activated portion are irreversibly attached. The selective activation may be accomplished by positioning a mask on the surface of the silicon-containing elastomer, and irradiating the exposed portion with UV radiation.
摘要翻译：制造微结构的方法包括选择性地激活含硅弹性体的表面的一部分，使活化部分与物质接触，并且将活化部分和物质接合，使得表面的活化部分和物质在与活化部分的接触不可逆地附着。选择性激活可以通过将掩模定位在含硅弹性体的表面上，并用UV辐射照射暴露部分来实现。

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