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1. 发明申请

WO2011119607A3 VISCOELASTIC INK FOR DIRECT WRITING OF HYDROGEL STRUCTURES 审中-公开
标题翻译：用于直接写水晶结构的粘弹
公开(公告)号：WO2011119607A3
公开(公告)日：2012-03-15
申请号：PCT/US2011029429
申请日：2011-03-22
申请人： UNIV ILLINOIS , LEWIS JENNIFER A , SHEPHERD ROBERT F , BARRY III ROBERT A , PARKER SARA T , SHEPHERD JENNIFER N H , WILTZIUS PIERRE , NUZZO RALPH G
发明人： LEWIS JENNIFER A , SHEPHERD ROBERT F , BARRY III ROBERT A , PARKER SARA T , SHEPHERD JENNIFER N H , WILTZIUS PIERRE , NUZZO RALPH G
IPC分类号： C09D11/00 , A61F2/02 , A61L27/34 , A61L27/40 , A61L27/52 , C09D11/10
CPC分类号： C09D11/16 , A61L27/16 , A61L27/26 , A61L27/52 , A61L27/56 , C09D11/10 , C09D11/101 , Y10T428/249921 , C08L33/10 , C08L5/08
摘要： A viscoelastic ink for direct writing of hydrogel structures includes a long chain polymer and a photopolymerizable moiety, which may be a photopolymerizable monomer or a photopolymerizable group attached to the long chain polymer. The ink may also include a crosslinking agent, a photoinitiator, and water. The long chain polymer is present at a concentration greater than a critical overlap concentration c* of the long chain polymer in the ink.
摘要翻译：用于直接书写水凝胶结构的粘弹性油墨包括长链聚合物和可光聚合部分，其可以是可光聚合的单体或连接到长链聚合物上的光聚合基团。油墨还可以包括交联剂，光引发剂和水。长链聚合物的浓度大于油墨中长链聚合物的临界重叠浓度c *。

2. 发明申请

WO2011119607A2 VISCOELASTIC INK FOR DIRECT WRITING OF HYDROGEL STRUCTURES 审中-公开
标题翻译：用于直接写水晶结构的粘弹
公开(公告)号：WO2011119607A2
公开(公告)日：2011-09-29
申请号：PCT/US2011/029429
申请日：2011-03-22
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , LEWIS, Jennifer, A. , SHEPHERD, Robert, F. , BARRY III, Robert, A. , PARKER, Sara, T. , SHEPHERD, Jennifer, N. H. , WILTZIUS, Pierre , NUZZO, Ralph, G.
发明人： LEWIS, Jennifer, A. , SHEPHERD, Robert, F. , BARRY III, Robert, A. , PARKER, Sara, T. , SHEPHERD, Jennifer, N. H. , WILTZIUS, Pierre , NUZZO, Ralph, G.
IPC分类号： C09D11/00 , C09D11/10 , A61L27/34 , A61L27/40 , A61L27/52 , A61F2/02
CPC分类号： C09D11/16 , A61L27/16 , A61L27/26 , A61L27/52 , A61L27/56 , C09D11/10 , C09D11/101 , Y10T428/249921 , C08L33/10 , C08L5/08
摘要： A viscoelastic ink for direct writing of hydrogel structures includes a long chain polymer and a photopolymerizable moiety, which may be a photopolymerizable monomer or a photopolymerizable group attached to the long chain polymer. The ink may also include a crosslinking agent, a photoinitiator, and water. The long chain polymer is present at a concentration greater than a critical overlap concentration c* of the long chain polymer in the ink.
摘要翻译：用于直接书写水凝胶结构的粘弹性油墨包括长链聚合物和可光聚合部分，其可以是可光聚合的单体或连接到长链聚合物上的光聚合基团。油墨还可以包括交联剂，光引发剂和水。长链聚合物的浓度大于油墨中长链聚合物的临界重叠浓度c *。

3. 发明申请

WO2006130721A3 PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 审中-公开
标题翻译：可制造半导体结构及相关制造和组装方法
公开(公告)号：WO2006130721A3
公开(公告)日：2009-06-25
申请号：PCT/US2006021161
申请日：2006-06-01
申请人： UNIV ILLINOIS , NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
发明人： NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
IPC分类号： H01L21/302 , H01L21/8242 , H01L23/62 , H01R12/00 , H05K3/36
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
摘要翻译：本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。本发明的组合物和方法提供了高精度的记录转印和微米尺寸和/或纳米半导体结构的阵列在包括大面积基底和/或柔性基底的基底上的集成。此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性半导体器件。

4. 发明申请

WO2008036837A2 RELEASE STRATEGIES FOR MAKING TRANSFERABLE SEMICONDUCTOR STRUCTURES, DEVICES AND DEVICE COMPONENTS 审中-公开
标题翻译：发布可转换半导体结构，器件和器件组件的策略
公开(公告)号：WO2008036837A2
公开(公告)日：2008-03-27
申请号：PCT/US2007079070
申请日：2007-09-20
申请人： UNIV ILLINOIS , ROGERS JOHN A , NUZZO RALPH G , MEITL MATTHEW , KO HEUNG CHO , YOON JONGSEUNG , MENARD ETIENNE , BACA ALFRED J
发明人： ROGERS JOHN A , NUZZO RALPH G , MEITL MATTHEW , KO HEUNG CHO , YOON JONGSEUNG , MENARD ETIENNE , BACA ALFRED J
IPC分类号： H01L21/28
CPC分类号： H01L31/0735 , B81C1/0046 , B81C2201/0191 , B82Y10/00 , B82Y20/00 , B82Y40/00 , H01L21/7813 , H01L29/155 , H01L29/20 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/072 , H01L31/0725 , H01L31/184 , H01L31/1844 , H01L33/0079 , H01L2924/0002 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T156/1195 , H01L2924/00
摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
摘要翻译：提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个可转让结构。可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。这些方法和系统提供了制造高质量和低成本的光伏器件，可转移半导体结构（光电）器件和器件部件的手段。

5. 发明申请

WO2006132664A2 DECAL TRANSFER LITHOGRAPHY 审中-公开
公开(公告)号：WO2006132664A2
公开(公告)日：2006-12-14
申请号：PCT/US2005/036812
申请日：2005-10-14
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , NUZZO, Ralph, G. , CHILDS, William, R. , MOTALA, Michael, J. , LEE, Keon, Jae
发明人： NUZZO, Ralph, G. , CHILDS, William, R. , MOTALA, Michael, J. , LEE, Keon, Jae
CPC分类号： G03F7/0002 , B81C1/0038 , B81C2201/0159 , B81C2201/0191 , B81C2203/038 , B82Y10/00 , B82Y40/00 , G03F7/34 , G03F7/346
摘要： A method of making a microstructure includes selectively activating a portion of a surface of a silicon-containing elastomer, contacting the activated portion with a substance, and bonding the activated portion and the substance, such that the activated portion of the surface and the substance in contact with the activated portion are irreversibly attached. The selective activation may be accomplished by positioning a mask on the surface of the silicon-containing elastomer, and irradiating the exposed portion with UV radiation.
摘要翻译：制造微结构的方法包括选择性地激活含硅弹性体的表面的一部分，使活化部分与物质接触，并且将活化部分和物质接合，使得表面的活化部分和物质在与活化部分的接触不可逆地附着。选择性激活可以通过将掩模定位在含硅弹性体的表面上，并用UV辐射照射暴露部分来实现。

6. 发明申请

WO2008030960A2 CONTROLLED BUCKLING STRUCTURES IN SEMICONDUCTOR INTERCONNECTS AND NANOMEMBRANES FOR STRETCHABLE ELECTRONICS 审中-公开
标题翻译：可拉伸电子半导体互连和纳米材料中的受控屈曲结构
公开(公告)号：WO2008030960A2
公开(公告)日：2008-03-13
申请号：PCT/US2007/077759
申请日：2007-09-06
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , ROGERS, John A. , NUZZO, Ralph G. , MEITL, Matthew , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-young , SUN, Yugang , ZHU, Zhengtao , KO, Heung Cho , CARLSON, Andrew , CHOI, Won Mook , STOYKOVICH, Mark , JIANG, Hanqing , HUANG, Young
发明人： ROGERS, John A. , NUZZO, Ralph G. , MEITL, Matthew , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-young , SUN, Yugang , ZHU, Zhengtao , KO, Heung Cho , CARLSON, Andrew , CHOI, Won Mook , STOYKOVICH, Mark , JIANG, Hanqing , HUANG, Young
IPC分类号： H01L31/16
CPC分类号： H01L27/0688 , B81B3/0078 , B82Y10/00 , H01L21/6835 , H01L21/8221 , H01L21/8258 , H01L27/0605 , H01L27/1292 , H01L27/1446 , H01L27/281 , H01L29/0665 , H01L29/0673 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/20 , H01L29/7781 , H01L29/7842 , H01L29/78681 , H01L29/78696 , H01L31/0203 , H01L51/0097 , H01L2924/00011 , H01L2924/0002 , H01L2924/13091 , H01L2924/30105 , H05K1/0283 , H05K1/0313 , H05K3/20 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00 , H01L2224/80001 , H01L2924/00012
摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
摘要翻译：在一个方面，本发明提供了可拉伸的和可选地可印刷的部件，例如半导体和电子电路，其能够在拉伸，压缩，弯曲或以其他方式变形时提供良好的性能，以及制造或调谐这样的可伸缩组件。对于一些应用优选的可拉伸半导体和电子电路除了可拉伸之外还是柔性的，并且因此能够沿一个或多个轴显着地伸长，弯曲，弯曲或其他变形。此外，本发明的可拉伸半导体和电子电路适用于各种各样的器件配置，以提供完全柔性的电子和光电子器件。

7. 发明申请

WO2008030666A2 MULTISPECTRAL PLASMONIC CRYSTAL SENSORS 审中-公开
标题翻译：多层等离子体水晶传感器
公开(公告)号：WO2008030666A2
公开(公告)日：2008-03-13
申请号：PCT/US2007/074293
申请日：2007-07-25
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , NUZZO, Ralph G. , ROGERS, John A. , MACK, Nathan H. , STEWART, Matthew , MALYARCHUK, Viktor , YAO, Jimin
发明人： NUZZO, Ralph G. , ROGERS, John A. , MACK, Nathan H. , STEWART, Matthew , MALYARCHUK, Viktor , YAO, Jimin
IPC分类号： G01N21/55
CPC分类号： G01N21/554
摘要： The present invention provides plasmonic crystals comprising three-dimensional and quasi comprising three-dimensional distributions of metallic or semiconducting films, including multi-layered crystal structures comprising nanostructured films and film arrays. Plasmonic crystals of the present invention include precisely registered and deterministically selected nonplanar crystal geometries and spatial distributions providing highly coupled, localized plasmonic responses in thin film elements and/or nanostructures of the crystal. Coupling of plasmonic responses provided by three-dimensional and quasi-three dimensional plasmonic crystal geometries and structures of the present invention generates enhanced local plasmonic field distributions useful for detecting small changes in the composition of an external dielectric environment proximate to a sensing surface of the plasmonic crystal. Plasmonic crystal structures of the present invention are also useful for providing highly localized excitation and/or imaging of fluorophores proximate to the crystal surface.
摘要翻译：本发明提供包括三维和准包括金属或半导体膜的三维分布的等离子体晶体，包括包含纳米结构膜和膜阵列的多层晶体结构。本发明的等离子体晶体包括在晶体的薄膜元件和/或纳米结构中提供高度耦合的局部等离子体响应的精确对准和确定性选择的非平面晶体几何形状和空间分布。通过本发明的三维和三维等离子体晶体几何结构和结构提供的等离子体激发响应的耦合产生增强的局部等离子体激元场分布，其可用于检测接近等离子体激元的感测表面的外部电介质环境的组成的小变化水晶。本发明的等离子体晶体结构也可用于提供接近晶体表面的荧光团的高度局部激发和/或成像。

8. 发明申请

WO2006130721A2 PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 审中-公开
标题翻译：可制造半导体结构及相关制造和组装方法
公开(公告)号：WO2006130721A2
公开(公告)日：2006-12-07
申请号：PCT/US2006/021161
申请日：2006-06-01
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , NUZZO, Ralph G. , ROGERS, John A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Hueng Cho
发明人： NUZZO, Ralph G. , ROGERS, John A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao , KO, Hueng Cho
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
摘要翻译：本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。本发明的组合物和方法提供了高精度的记录转印和微米尺寸和/或纳米半导体结构的阵列在包括大面积基底和/或柔性基底的基底上的集成。此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性半导体器件。

9. 发明申请

WO2005122285A2 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 审中-公开
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：WO2005122285A2
公开(公告)日：2005-12-22
申请号：PCT/US2005/019354
申请日：2005-06-02
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , NUZZO, Ralph, G. , ROGERS, John, A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao
发明人： NUZZO, Ralph, G. , ROGERS, John, A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao
IPC分类号： H01L31/0312
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

10. 发明申请

WO1997007429A1 SELF-ASSEMBLED MONOLAYER DIRECTED PATTERNING OF SURFACES 审中-公开
标题翻译：自组装单面指向表面图案
公开(公告)号：WO1997007429A1
公开(公告)日：1997-02-27
申请号：PCT/US1996013223
申请日：1996-08-16
申请人： PRESIDENT AND FELLOWS OF HARVARD COLLEGE , CLEM, Paul, G. , JEON, Noo-Li , MRKSICH, Milan , NUZZO, Ralph, G. , PAYNE, David, A. , WHITESIDES, George, M. , XIA, Younan
发明人： PRESIDENT AND FELLOWS OF HARVARD COLLEGE
IPC分类号： G03F07/00
CPC分类号： B82Y30/00 , B01J2219/00317 , B01J2219/00382 , B01J2219/00659 , B05D1/283 , B41M3/003 , B82Y10/00 , B82Y40/00 , C23C16/01 , C23C16/04 , C23C16/042 , C40B60/14 , G03F7/0002 , H01L21/28562 , H01L21/76879 , H01L21/76898
摘要： A technique for creating patterns of material deposited on a surface involves forming a self-assembled monolayer in a pattern on the surface and depositing, via chemical vapor deposition or via sol-gel processing, a material on the surface in a pattern complementary to the self-assembled monolayer pattern. The material can be a metal, metal oxide, or the like. The surface can be contoured, including trenches or holes, the trenches or holes remaining free of self-assembled monolayer while the remainder of the surface is coated. When exposed to deposition conditions, metal or metal oxide is deposited in the trenches or holes, and remaining portions of the article surface remain free of deposition. The technique finds particular use in creation of conductive metal pathways selectively within holes passing from one side of a substrate to another.
摘要翻译：用于产生沉积在表面上的材料图案的技术包括以表面上的图案形成自组装单层，并通过化学气相沉积或经由溶胶 - 凝胶加工，以与自身互补的图案沉积在表面上的材料组装的单层图案。该材料可以是金属，金属氧化物等。表面可以是轮廓，包括沟槽或孔，沟槽或孔保持没有自组装单层，而表面的其余部分被涂覆。当暴露于沉积条件时，金属或金属氧化物沉积在沟槽或孔中，并且制品表面的剩余部分保持不沉积。该技术特别用于在从衬底的一侧通过到另一侧的孔内选择性地形成导电金属通路。

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