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1. 发明申请

WO2006130721A3 PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 审中-公开
标题翻译：可制造半导体结构及相关制造和组装方法
公开(公告)号：WO2006130721A3
公开(公告)日：2009-06-25
申请号：PCT/US2006021161
申请日：2006-06-01
申请人： UNIV ILLINOIS , NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
发明人： NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
IPC分类号： H01L21/302 , H01L21/8242 , H01L23/62 , H01R12/00 , H05K3/36
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
摘要翻译：本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。本发明的组合物和方法提供了高精度的记录转印和微米尺寸和/或纳米半导体结构的阵列在包括大面积基底和/或柔性基底的基底上的集成。此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性半导体器件。

2. 发明申请

WO2005122285A3 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 审中-公开
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：WO2005122285A3
公开(公告)日：2007-08-30
申请号：PCT/US2005019354
申请日：2005-06-02
申请人： UNIV ILLINOIS , NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
发明人： NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
IPC分类号： H01L21/00 , B81C1/00 , H01L21/20 , H01L21/30 , H01L21/326 , H01L21/4763 , H01L21/77 , H01L23/48 , H01L27/01 , H01L29/06 , H01L29/08 , H01L29/786 , H01L31/0312 , H01L31/18
CPC分类号： H01L23/02 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/76 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements (555) and assembling printable semiconductor elements onto substrate surfaces (330). The present invention also provides stretchable semiconductor structures (760).
摘要翻译：本发明提供了用于制造可印刷半导体元件（555）并将可印刷半导体元件组装到衬底表面（330）上的方法和装置。本发明还提供可拉伸半导体结构（760）。

3. 发明申请

WO2008036837A2 RELEASE STRATEGIES FOR MAKING TRANSFERABLE SEMICONDUCTOR STRUCTURES, DEVICES AND DEVICE COMPONENTS 审中-公开
标题翻译：发布可转换半导体结构，器件和器件组件的策略
公开(公告)号：WO2008036837A2
公开(公告)日：2008-03-27
申请号：PCT/US2007079070
申请日：2007-09-20
申请人： UNIV ILLINOIS , ROGERS JOHN A , NUZZO RALPH G , MEITL MATTHEW , KO HEUNG CHO , YOON JONGSEUNG , MENARD ETIENNE , BACA ALFRED J
发明人： ROGERS JOHN A , NUZZO RALPH G , MEITL MATTHEW , KO HEUNG CHO , YOON JONGSEUNG , MENARD ETIENNE , BACA ALFRED J
IPC分类号： H01L21/28
CPC分类号： H01L31/0735 , B81C1/0046 , B81C2201/0191 , B82Y10/00 , B82Y20/00 , B82Y40/00 , H01L21/7813 , H01L29/155 , H01L29/20 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/072 , H01L31/0725 , H01L31/184 , H01L31/1844 , H01L33/0079 , H01L2924/0002 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T156/1195 , H01L2924/00
摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
摘要翻译：提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个可转让结构。可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。这些方法和系统提供了制造高质量和低成本的光伏器件，可转移半导体结构（光电）器件和器件部件的手段。

4. 发明申请

WO2006132664A3 DECAL TRANSFER LITHOGRAPHY 审中-公开
公开(公告)号：WO2006132664A3
公开(公告)日：2007-04-05
申请号：PCT/US2005036812
申请日：2005-10-14
申请人： UNIV ILLINOIS , NUZZO RALPH G , CHILDS WILLIAM R , MOTALA MICHAEL J , LEE KEON JAE
发明人： NUZZO RALPH G , CHILDS WILLIAM R , MOTALA MICHAEL J , LEE KEON JAE
IPC分类号： G03F7/00
CPC分类号： G03F7/0002 , B81C1/0038 , B81C2201/0159 , B81C2201/0191 , B81C2203/038 , B82Y10/00 , B82Y40/00 , G03F7/34 , G03F7/346
摘要： A method of making a microstructure includes selectively activating a portion of a surface of a silicon-containing elastomer, contacting the activated portion with a substance, and bonding the activated portion and the substance, such that the activated portion of the surface and the substance in contact with the activated portion are irreversibly attached. The selective activation may be accomplished by positioning a mask on the surface of the silicon-containing elastomer, and irradiating the exposed portion with UV radiation.
摘要翻译：制造微结构的方法包括选择性地激活含硅弹性体的表面的一部分，使活化部分与物质接触，并且将活化部分和物质接合，使得表面的活化部分和物质在与活化部分的接触不可逆地附着。选择性活化可以通过将掩模定位在含硅弹性体的表面上，并用紫外线辐射照射暴露部分来实现。

5. 发明申请

WO2008030666A3 MULTISPECTRAL PLASMONIC CRYSTAL SENSORS 审中-公开
标题翻译：多光谱PLASMONIC晶体传感器
公开(公告)号：WO2008030666A3
公开(公告)日：2008-10-09
申请号：PCT/US2007074293
申请日：2007-07-25
申请人： UNIV ILLINOIS , NUZZO RALPH G , ROGERS JOHN A , MACK NATHAN H , STEWART MATTHEW , MALYARCHUK VIKTOR , YAO JIMIN
发明人： NUZZO RALPH G , ROGERS JOHN A , MACK NATHAN H , STEWART MATTHEW , MALYARCHUK VIKTOR , YAO JIMIN
IPC分类号： G01N21/55
CPC分类号： G01N21/554
摘要： The present invention provides plasmonic crystals comprising three-dimensional and quasi comprising three-dimensional distributions of metallic or semiconducting films, including multi-layered crystal structures comprising nanostructured films and film arrays. Plasmonic crystals of the present invention include precisely registered and deterministically selected nonplanar crystal geometries and spatial distributions providing highly coupled, localized plasmonic responses in thin film elements and/or nanostructures of the crystal. Coupling of plasmonic responses provided by three-dimensional and quasi-three dimensional plasmonic crystal geometries and structures of the present invention generates enhanced local plasmonic field distributions useful for detecting small changes in the composition of an external dielectric environment proximate to a sensing surface of the plasmonic crystal. Plasmonic crystal structures of the present invention are also useful for providing highly localized excitation and/or imaging of fluorophores proximate to the crystal surface.
摘要翻译：本发明提供包含三维和准包含金属或半导体膜的三维分布的等离子体激元晶体，包括包含纳米结构膜和膜阵列的多层晶体结构。本发明的等离子体激元晶体包括精确配准和确定性选择的非平面晶体几何形状和空间分布，在晶体的薄膜元件和/或纳米结构中提供高度耦合的，局部等离子体激元响应。由本发明的三维和准三维等离子体晶体几何形状和结构提供的等离子体激元响应的耦合产生增强的局部等离子体激元场分布，其可用于检测靠近等离子体激元的感测表面的外部电介质环境的组成的微小变化水晶。本发明的等离激元晶体结构也可用于提供靠近晶体表面的荧光团的高度局部激发和/或成像。

6. 发明申请

WO2011119607A3 VISCOELASTIC INK FOR DIRECT WRITING OF HYDROGEL STRUCTURES 审中-公开
标题翻译：用于直接写水晶结构的粘弹
公开(公告)号：WO2011119607A3
公开(公告)日：2012-03-15
申请号：PCT/US2011029429
申请日：2011-03-22
申请人： UNIV ILLINOIS , LEWIS JENNIFER A , SHEPHERD ROBERT F , BARRY III ROBERT A , PARKER SARA T , SHEPHERD JENNIFER N H , WILTZIUS PIERRE , NUZZO RALPH G
发明人： LEWIS JENNIFER A , SHEPHERD ROBERT F , BARRY III ROBERT A , PARKER SARA T , SHEPHERD JENNIFER N H , WILTZIUS PIERRE , NUZZO RALPH G
IPC分类号： C09D11/00 , A61F2/02 , A61L27/34 , A61L27/40 , A61L27/52 , C09D11/10
CPC分类号： C09D11/16 , A61L27/16 , A61L27/26 , A61L27/52 , A61L27/56 , C09D11/10 , C09D11/101 , Y10T428/249921 , C08L33/10 , C08L5/08
摘要： A viscoelastic ink for direct writing of hydrogel structures includes a long chain polymer and a photopolymerizable moiety, which may be a photopolymerizable monomer or a photopolymerizable group attached to the long chain polymer. The ink may also include a crosslinking agent, a photoinitiator, and water. The long chain polymer is present at a concentration greater than a critical overlap concentration c* of the long chain polymer in the ink.
摘要翻译：用于直接书写水凝胶结构的粘弹性油墨包括长链聚合物和可光聚合部分，其可以是可光聚合的单体或连接到长链聚合物上的光聚合基团。油墨还可以包括交联剂，光引发剂和水。长链聚合物的浓度大于油墨中长链聚合物的临界重叠浓度c *。

7. 发明申请

WO2005088759A3 MICROFLUIDIC ELECTROCHEMICAL REACTORS 审中-公开
标题翻译：微流电化学反应器
公开(公告)号：WO2005088759A3
公开(公告)日：2006-12-21
申请号：PCT/US2005007567
申请日：2005-03-08
申请人： UNIV ILLINOIS , NUZZO RALPH G , MITROVSKI SVETLANA M
发明人： NUZZO RALPH G , MITROVSKI SVETLANA M
IPC分类号： H01M8/10 , H01M2/00 , H01M4/86 , H01M4/88 , H01M8/24
CPC分类号： H01M8/1004 , G01N27/3271 , H01M4/8605 , H01M4/8626 , H01M4/8896 , H01M8/1018 , H01M8/1037 , H01M8/1067 , H01M8/1088 , H01M8/1097 , H01M8/241 , Y02P70/56
摘要： A microfluidic electrochemical reactor includes an electrode and one or more microfluidic channels on the electrode, where the microfluidic channels are covered with a membrane containing a gas permeable polymer. The distance between the electrode and the membrane is less than 500 micrometers. The microfluidic electrochemical reactor can provide for increased reaction rates in electrochemical reactions using a gaseous reactant, as compared to conventional electrochemical cells. Microfluidic electrochemical reactors can be incorporated into devices for applications such as fuel cells, electrochemical analysis, microfluidic actuation, pH gradient formation.
摘要翻译：微流体电化学反应器包括电极和电极上的一个或多个微流体通道，其中微流体通道被含有气体可渗透聚合物的膜覆盖。电极和膜之间的距离小于500微米。与常规电化学电池相比，微流控电化学反应器可以提供使用气态反应物的电化学反应中增加的反应速率。微流控电化学反应器可以并入用于诸如燃料电池，电化学分析，微流体致动，pH梯度形成等应用的装置中。

9. 发明公开

EP2064734A4 RELEASE STRATEGIES FOR MAKING TRANSFERABLE SEMICONDUCTOR STRUCTURES, DEVICES AND DEVICE COMPONENTS 有权
标题翻译：瑞士法郎ZER HERSTELLUNGÜBERTRAGBARERHALBLEITERSTRUKTUREN，-GERÄTEUND-GERÄTEBAUTEILE
公开(公告)号：EP2064734A4
公开(公告)日：2014-03-26
申请号：EP07842903
申请日：2007-09-20
申请人： UNIV ILLINOIS
发明人： ROGERS JOHN A , NUZZO RALPH G , MEITL MATTHEW , KO HEUNG CHO , YOON JONGSEUNG , MENARD ETIENNE , BACA ALFRED J
IPC分类号： H01L29/20 , B81C1/00 , B82Y10/00 , B82Y20/00 , H01L21/78 , H01L31/0687 , H01L31/072
CPC分类号： H01L31/0735 , B81C1/0046 , B81C2201/0191 , B82Y10/00 , B82Y20/00 , B82Y40/00 , H01L21/7813 , H01L29/155 , H01L29/20 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/072 , H01L31/0725 , H01L31/184 , H01L31/1844 , H01L33/0079 , H01L2924/0002 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T156/1195 , H01L2924/00
摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
摘要翻译：提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个可转让结构。可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。这些方法和系统提供了制造高质量和低成本的光伏器件，可转移半导体结构（光电）器件和器件部件的手段。

10. 发明公开

EP1759422A4 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 有权转让
标题翻译：方法与设备可打印的半导体元件的生产和装配
公开(公告)号：EP1759422A4
公开(公告)日：2011-04-06
申请号：EP05755193
申请日：2005-06-02
申请人： UNIV ILLINOIS
发明人： NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
IPC分类号： H01L21/20 , B81C1/00 , H01L21/02 , H01L21/30 , H01L21/326 , H01L21/4763 , H01L21/77 , H01L23/48 , H01L27/01 , H01L29/06 , H01L29/08 , H01L29/786 , H01L31/0312 , H01L31/18
CPC分类号： H01L23/02 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/76 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷的半导体元件和组装可印刷的半导体元件到衬底上表面的方法和装置。方法，设备和设备部件本发明的能够产生宽范围的柔性电子和光电子器件和基底包含聚合物材料上的设备的阵列。本发明因此提供了可拉伸的半导体结构，并且能够在拉伸构型良好的性能可拉伸电子器件。

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