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1. 发明申请

US20070114709A1 Apparatus and method for installing cockpit module in vehicle body 失效
标题翻译：驾驶舱模块安装在车身上的装置和方法
公开(公告)号：US20070114709A1
公开(公告)日：2007-05-24
申请号：US11653878
申请日：2007-01-17
申请人： Yasuhiro Sawada , Shigenori Toyonaga , Kouichi Ohira , Toshifumi Inoue , Masashi Matsumoto , Masanobu Suzuki
发明人： Yasuhiro Sawada , Shigenori Toyonaga , Kouichi Ohira , Toshifumi Inoue , Masashi Matsumoto , Masanobu Suzuki
IPC分类号： B23Q1/00
CPC分类号： B62D25/147 , B62D25/145 , B62D25/16 , B62D65/04 , B62D65/14 , Y10T29/4981 , Y10T29/49829 , Y10T29/49895 , Y10T29/49899 , Y10T29/49902 , Y10T29/53039 , Y10T29/53061 , Y10T29/53365 , Y10T29/534 , Y10T29/53435 , Y10T29/53539 , Y10T29/53974 , Y10T29/53978
摘要： An installation apparatus is comprised of a pair of grasping brackets and an installation jig. The installation apparatus is employed to install a cockpit module in a vehicle body in a manner that the grasping brackets is detachably attached respectively to both end portions of a steering member of the cockpit module and that the installation jig grasps the grasping brackets and conveys the cockpit module to the vehicle body.
摘要翻译：安装装置由一对把持支架和安装夹具构成。安装装置用于将驾驶舱模块安装在车体中，使得把持支架分别可拆卸地安装在驾驶舱模块的转向构件的两个端部，并且安装夹具抓住抓握支架并传送驾驶舱模块到车体。

2. 发明授权

US06911405B2 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06911405B2
公开(公告)日：2005-06-28
申请号：US09988685
申请日：2001-11-20
申请人： Yoshimi Shioya , Kouichi Ohira , Kazuo Maeda , Tomomi Suzuki , Youichi Yamamoto , Yuichiro Kotake , Hiroshi Ikakura , Shoji Ohgawara
发明人： Yoshimi Shioya , Kouichi Ohira , Kazuo Maeda , Tomomi Suzuki , Youichi Yamamoto , Yuichiro Kotake , Hiroshi Ikakura , Shoji Ohgawara
IPC分类号： H01L21/28 , H01L21/205 , H01L21/3105 , H01L21/311 , H01L21/314 , H01L21/316 , H01L21/318 , H01L21/3205 , H01L21/321 , H01L21/3213 , H01L21/768 , H01L23/52 , H01L23/522 , H01L21/76 , H01L21/26 , H01L21/44
CPC分类号： H01L21/7685 , H01L21/3105 , H01L21/31116 , H01L21/3144 , H01L21/3185 , H01L21/321 , H01L21/32136 , H01L21/76826 , H01L21/76834 , H01L21/76838 , H01L21/76867 , H01L21/76886
摘要： A process gas consisting of one of N2, N2O or a mixture thereof is converted to a plasma and then a surface of a copper wiring layer is exposed to the plasma of the process gas, whereby a surface portion of the copper wiring layer is reformed and made into a copper diffusion preventing barrier. According to this method, a noble semiconductor device can be provided having increased operational speed and less copper diffusion.
摘要翻译：由N 2 N 2 N 2 O 2或其混合物之一组成的工艺气体被转化为等离子体，然后将铜布线层的表面暴露于等离子体的处理气体，由此将铜布线层的表面部分重整并制成铜扩散防止屏障。根据该方法，可以提供具有增加的操作速度和较少的铜扩散的贵金属半导体器件。

3. 发明授权

US06472334B2 Film forming method, semiconductor device manufacturing method, and semiconductor device 失效
标题翻译：成膜方法，半导体装置的制造方法以及半导体装置
公开(公告)号：US06472334B2
公开(公告)日：2002-10-29
申请号：US09824106
申请日：2001-04-03
申请人： Hiroshi Ikakura , Tomomi Suzuki , Kazuo Maeda , Yoshimi Shioya , Kouichi Ohira
发明人： Hiroshi Ikakura , Tomomi Suzuki , Kazuo Maeda , Yoshimi Shioya , Kouichi Ohira
IPC分类号： H01L21469
CPC分类号： H01L21/02126 , C23C16/402 , H01L21/02216 , H01L21/02274 , H01L21/3122 , H01L21/31612
摘要： There is provided a method of forming a silicon-containing insulating film on a substrate by reacting a compound having siloxane bonds and Si—R bonds (R is alkyl group) with a plasmanized reaction gas containing an oxidizing gas and H2.
摘要翻译：提供了通过使具有硅氧烷键的化合物和Si-R键（R为烷基）与含有氧化气体和H 2的质子化反应气体反应而在基板上形成含硅绝缘膜的方法。

4. 发明授权

US06435196B1 Impurity processing apparatus and method for cleaning impurity processing apparatus 失效
标题翻译：杂质处理装置和清洗杂质处理装置的方法
公开(公告)号：US06435196B1
公开(公告)日：2002-08-20
申请号：US09451706
申请日：1999-12-01
申请人： Noritada Satoh , Kouichi Ohira , Bunya Matsui , Kazuo Maeda
发明人： Noritada Satoh , Kouichi Ohira , Bunya Matsui , Kazuo Maeda
IPC分类号： B08B600
CPC分类号： H01L21/67028
摘要： The present invention relates to an impurity processing apparatus in which impurities such as phosphorus, boron, or the like are doped in a semiconductor substrate, etc., or a PSG (PhosphoSilicateGlass) film, a BSG (BoroSilicateGlass) film, or a BPSG (BoroPhosphoSilicateGlass) film, or a carbon film, etc. This apparatus includes a chamber having an introduction port for an impurity-containing ion gas which is connected to an impurity-containing gas supply section, a substrate holder supporting a substrate which is to be ion-injected, or doped, or on which a film is formed using the impurity-containing gas, an introduction port of a water-containing gas which is provided upstream of the substrate holder in accordance with a flow direction of the impurity-containing gas, and is connected to a water-containing gas supply section, and first plasma generating means in a space extending from the introduction port for water-containing gas to the substrate holder for converting water-containing gas to a plasma.
摘要翻译：本发明涉及在半导体衬底等中掺杂诸如磷，硼等杂质的杂质处理装置，或PSG（磷酸硅酸盐玻璃）膜，BSG（硼硅酸盐玻璃）膜或BPSG（ BoroPhospho硅酸盐玻璃）膜或碳膜等。该装置包括具有与含杂质气体供给部连接的含杂质离子气体导入口的室，支撑待离子化的基板的基板保持架注入或掺杂，或者使用含杂质的气体形成膜，根据含杂质气体的流动方向设置在衬底保持器的上游的含水气体的引入口，并且连接到含水气体供给部，并且在从含水气体的导入口延伸到用于转换含水气体的基板保持器的空间中的第一等离子体产生装置 g气体到等离子体。

5. 发明授权

US06479408B2 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06479408B2
公开(公告)日：2002-11-12
申请号：US09843725
申请日：2001-04-30
申请人： Yoshimi Shioya , Kouichi Ohira , Kazuo Maeda
发明人： Yoshimi Shioya , Kouichi Ohira , Kazuo Maeda
IPC分类号： H01L2131
CPC分类号： H01L21/02126 , C23C16/30 , H01L21/02216 , H01L21/02274 , H01L21/3122 , H01L21/76801 , H01L21/76802 , H01L21/76834 , H01L21/76838
摘要： The present invention relates to a semiconductor device manufacturing method for forming an interlayer insulating film having a low dielectric constant by coating a copper wiring. The semiconductor device manufacturing method comprises the steps of preparing a substrate 21 from a surface of which copper wirings 23 are exposed, and forming an interlayer insulating film having a low dielectric constant on the substrate 21, wherein the interlayer insulating film is formed of a multi-layered insulating film including a insulating film 24 that contacts with the copper wirings 23, and the insulating film 24 is formed by plasmanizing a film forming gas containing an alkyl compound having an Si—O—Si bond and one oxygen-containing gas selected from the group consisting of N2O, H2O, and CO2, whose flow rate is equal to or less than a flow rate of the siloxane, to react mutually.
摘要翻译：本发明涉及通过涂覆铜布线形成具有低介电常数的层间绝缘膜的半导体器件制造方法。半导体器件制造方法包括从衬底21暴露的表面制备衬底21，并且在衬底21上形成具有低介电常数的层间绝缘膜的步骤，其中层间绝缘膜由多包括与铜布线23接触的绝缘膜24的绝缘膜，绝缘膜24通过将含有具有Si-O-Si键的烷基化合物和一种含氧气体的成膜气体等离子化而形成，该含氧气体选自由流动相等于或小于硅氧烷流量的N2O，H2O和CO2组成的组相互反应。

6. 发明授权

US5589001A Apparatus for forming a film on a wafer 失效
标题翻译：用于在晶片上形成薄膜的装置
公开(公告)号：US5589001A
公开(公告)日：1996-12-31
申请号：US159127
申请日：1993-11-30
申请人： Kazuo Maeda , Kouichi Ohira , Hiroshi Chino
发明人： Kazuo Maeda , Kouichi Ohira , Hiroshi Chino
IPC分类号： H01L21/205 , C23C16/44 , C23C16/458 , H01L21/00 , H01L21/304 , C23C16/00
CPC分类号： H01L21/67115 , C23C16/4407 , C23C16/4584
摘要： An apparatus for forming a film by the CVD method allows reaction products to be easily removed from a gas discharge surface without decreasing the uptime/downtime ratio, and includes a gas distributor having a gas discharge surface for discharge of a reaction gas for forming a film on a substrate. A wafer holder has a wafer mounting surface facing the gas discharge surface. A cleaner has a suction head and a brush formed at the entrance of the suction head. A rotary shaft supports the cleaner for movement between the gas discharge surface and a stand-by position and brings the brush of the cleaner onto the gas discharge surface. A vertical positioner moves the wafer holder or gas distributor upward or downward, whereby the wafer holder approaches the gas discharge surface for forming a film and is spaced from the gas discharge surface when cleaning the gas discharge surface by movement of the cleaner on the gas discharge surface.
摘要翻译：通过CVD法形成膜的装置允许反应产物容易地从气体放电表面除去而不减少正常运行时间/停机时间比，并且包括具有用于排出形成膜的反应气体的气体放电表面的气体分配器在基板上。晶片保持器具有面向气体排出表面的晶片安装表面。吸尘器在吸头的入口处形成有吸头和刷子。旋转轴支撑清洁器，用于在排气表面和待机位置之间移动，并将清洁器的刷子带到排气表面上。垂直定位器向上或向下移动晶片保持器或气体分配器，由此晶片保持器靠近气体排出表面以形成膜，并且通过清洁器在气体放电上的移动来清洁气体排出表面时与气体排出表面间隔开表面。

7. 发明授权

US5302209A Apparatus for manufacturing semiconductor device 失效
标题翻译：半导体器件制造装置
公开(公告)号：US5302209A
公开(公告)日：1994-04-12
申请号：US930709
申请日：1992-10-27
申请人： Kazuo Maeda , Kouichi Ohira , Mitsuo Hirose
发明人： Kazuo Maeda , Kouichi Ohira , Mitsuo Hirose
IPC分类号： C23C14/56 , C23C16/458 , C23C16/54 , C30B25/12 , C30B25/14 , H01L21/00 , H01L21/205 , H01L21/31 , H01L21/677 , H01L21/68 , C23C16/00
CPC分类号： H01L21/68764 , C23C16/4584 , C23C16/54 , H01L21/67167 , H01L21/67778 , H01L21/68771
摘要： A continuous type automated apparatus for manufacturing a semiconductor device by forming a film on a wafer by a CVD method. The apparatus moves the wafer while maintaining the wafer at a predetermined temperature, and controls production of individual wafers and formation of multi-layer films of different types. The apparatus includes a wafer holder, a rotary shaft for supporting the wafer holder so that wafer loading surfaces of the wafer holder rotate in a circle within a single plane. A gas dispersion unit is provided separate from the wafer holder and facing the wafer loading surface of the wafer holder. A first pair of contacts are electrically connected to a heater and are mounted on the rotary shaft and a second pair of contacts are connected to a power source are in sliding contact with the first pair of contacts so that the rotation of the rotary shaft is not obstructed. This apparatus is useful as a continuous type automated CVD apparatus.
摘要翻译： PCT No.PCT / JP92 / 00135 Sec。 371日期：1992年10月27日 102（e）日期1992年10月27日PCT提交1992年2月12日PCT公布。公开号WO92 / 15114 日期：1992年9月3日。一种用于通过CVD方法在晶片上形成薄膜制造半导体器件的连续型自动化装置。该装置在将晶片保持在预定温度的同时移动晶片，并且控制单个晶片的生产和形成不同类型的多层膜。该装置包括晶片保持器，用于支撑晶片保持器的旋转轴，使得晶片保持器的晶片加载表面在单个平面内以圆形旋转。气体分散单元与晶片保持器分离设置并面向晶片保持器的晶片装载表面。第一对触点电连接到加热器并且安装在旋转轴上，并且连接到电源的第二对触点与第一对触点滑动接触，使得旋转轴的旋转不是阻碍了该装置可用作连续型自动化CVD装置。

8. 发明授权

US07168145B2 Method for installing cockpit module in vehicle body using temporary grasping brackets 失效
标题翻译：使用临时夹具将驾驶舱模块安装在车身上的方法
公开(公告)号：US07168145B2
公开(公告)日：2007-01-30
申请号：US11056175
申请日：2005-02-14
申请人： Yasuhiro Sawada , Shigenori Toyonaga , Kouichi Ohira , Toshifumi Inoue , Masashi Matsumoto , Masanobu Suzuki
发明人： Yasuhiro Sawada , Shigenori Toyonaga , Kouichi Ohira , Toshifumi Inoue , Masashi Matsumoto , Masanobu Suzuki
IPC分类号： B23Q3/00 , B23P17/00 , B23P11/00 , B23P21/00
CPC分类号： B62D25/147 , B62D25/145 , B62D25/16 , B62D65/04 , B62D65/14 , Y10T29/4981 , Y10T29/49829 , Y10T29/49895 , Y10T29/49899 , Y10T29/49902 , Y10T29/53039 , Y10T29/53061 , Y10T29/53365 , Y10T29/534 , Y10T29/53435 , Y10T29/53539 , Y10T29/53974 , Y10T29/53978
摘要： An installation apparatus is comprised of a pair of grasping brackets and an installation jig. The installation apparatus is employed to install a cockpit module in a vehicle body in a manner that the grasping brackets is detachably attached respectively to both end portions of a steering member of the cockpit module and that the installation jig grasps the grasping brackets and conveys the cockpit module to the vehicle body.
摘要翻译：安装装置由一对把持支架和安装夹具构成。安装装置用于将驾驶舱模块安装在车体中，使得把持支架分别可拆卸地安装在驾驶舱模块的转向构件的两个端部，并且安装夹具抓住抓握支架并传送驾驶舱模块到车体。

9. 发明授权

US06688674B2 Production of vehicles 有权
标题翻译：生产车辆
公开(公告)号：US06688674B2
公开(公告)日：2004-02-10
申请号：US09964675
申请日：2001-09-28
申请人： Manabu Sato , Masato Takiguchi , Kouji Sato , Kouichi Ohira , Masami Tashiro , Takashi Matsuoka , Takamitsu Tajima , Kenji Kanamori
发明人： Manabu Sato , Masato Takiguchi , Kouji Sato , Kouichi Ohira , Masami Tashiro , Takashi Matsuoka , Takamitsu Tajima , Kenji Kanamori
IPC分类号： B62D2500
CPC分类号： B23K26/24 , B23K26/0838 , B23K26/0884 , B23K26/10 , B23K37/047 , B23K2101/006 , B23K2101/045 , B23K2103/10 , B23P21/004 , B23P2700/50 , B62D23/00 , B62D25/025 , B62D25/06 , B62D25/161 , B62D25/20 , B62D25/2009 , B62D25/2018 , B62D25/2027 , B62D25/2036 , B62D25/2045 , B62D27/02 , B62D27/026 , B62D29/001 , B62D29/008 , B62D65/00 , B62D65/02 , B62D65/04 , B62D65/06 , B62D65/18 , Y10T29/49622 , Y10T29/49829 , Y10T29/49831 , Y10T29/51 , Y10T29/5191 , Y10T29/5196 , Y10T29/53365 , Y10T29/534
摘要： A compact vehicle production line. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.
摘要翻译：紧凑型车辆生产线。生产线包括组装地板构件的地板工艺。每个都是在挤出压铸工艺中通过在预定方向上迫使熔融铝合金通过模腔而制成的铝合金挤出压铸产品。组装的地板组成部分被焊接以形成地板结构。在内部部件安装过程中，内部部件是地板结构以制造地板单元。在身体主体处理中，将两个身体侧面结构中的每一个修整成身体侧面单元。屋顶结构被修剪成屋顶单元。组装地板单元，车身侧单元和车顶单元。将组件焊接成一个主体单元。在运行部件安装过程中，下运行单元安装到主体单元。在外部部件附接过程中，将彩色主体面板附接到主体单元。

10. 发明授权

US06668438B2 Production of vehicles 有权
公开(公告)号：US06668438B2
公开(公告)日：2003-12-30
申请号：US09964674
申请日：2001-09-28
申请人： Manabu Sato , Masato Takiguchi , Kouji Sato , Kouichi Ohira , Masami Tashiro , Takashi Matsuoka , Takamitsu Tajima , Kenji Kanamori
发明人： Manabu Sato , Masato Takiguchi , Kouji Sato , Kouichi Ohira , Masami Tashiro , Takashi Matsuoka , Takamitsu Tajima , Kenji Kanamori
IPC分类号： B23P2304
CPC分类号： B23K26/24 , B23K26/0838 , B23K26/0884 , B23K26/10 , B23K37/047 , B23K2101/006 , B23K2101/045 , B23K2103/10 , B23P21/004 , B23P2700/50 , B62D23/00 , B62D25/025 , B62D25/06 , B62D25/161 , B62D25/20 , B62D25/2009 , B62D25/2018 , B62D25/2027 , B62D25/2036 , B62D25/2045 , B62D27/02 , B62D27/026 , B62D29/001 , B62D29/008 , B62D65/00 , B62D65/02 , B62D65/04 , B62D65/06 , B62D65/18 , Y10T29/49622 , Y10T29/49829 , Y10T29/49831 , Y10T29/51 , Y10T29/5191 , Y10T29/5196 , Y10T29/53365 , Y10T29/534
摘要： A compact vehicle production line is disclosed. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.

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