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1. 发明申请

US20090017703A1 Socket Adaptor Apparatus 有权
标题翻译：插座适配器
公开(公告)号：US20090017703A1
公开(公告)日：2009-01-15
申请号：US12136460
申请日：2008-06-10
申请人： Hideyuki Takahashi , Kiyokazu Ikeya
发明人： Hideyuki Takahashi , Kiyokazu Ikeya
IPC分类号： H01R13/24
CPC分类号： H01R13/112 , G01R1/0483 , H01R12/57 , H01R13/111 , H01R13/2421 , H05K7/1084
摘要： A socket adaptor 10 made of an electrically insulating material has a main adaptor body 12 on which a plurality of through holes 14 containing an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pin 60 and coil spring 62 is placed in each through hole 14. An electrical engagement clipping part 68 for clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin 60. The coil spring 62 is installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.
摘要翻译：由电绝缘材料制成的插座适配器10具有主适配器主体12，其上形成有包含上开口和下开口的多个通孔14。在某些优选实施例中，探针60和螺旋弹簧62被放置在每个通孔14中。用于夹住从所述上开口插入相应通孔的触点的电接合夹持部分68形成在每个探针的上端螺旋弹簧62安装在每个探针上，并将相应的探头针偏压到一个位置，使得形成在探针的下端的尖端从下开口突出。

2. 发明授权

US06402537B2 Socket for removably mounting an electronic part 有权
标题翻译：用于可拆卸地安装电子部件的插座
公开(公告)号：US06402537B2
公开(公告)日：2002-06-11
申请号：US09891801
申请日：2001-06-26
申请人： Kiyokazu Ikeya
发明人： Kiyokazu Ikeya
IPC分类号： H01R1315
CPC分类号： H01R13/193 , H05K7/1007
摘要： A socket (2) for removably mounting a BGA package. A plurality of contacts (7) are mounted in a base (4), the contacts each having a pair of arms (7a and 7b) for effecting compressive electrical contact of the solder balls of the BGA package being held. A slider (5) is slidably mounted on the base (4) for opening and closing of the arms. An external force is applied in a prescribed direction at a cam follower portion (52) of the slider by a cam member (20) provided on a diagonal line of a generally square base (4). The cam engages the cam follower portion (52) of the slider at a selected angle of inclination and is movable in a direction which crosses, at a right angle, the moving direction of the slider.
摘要翻译：一个用于可拆卸地安装BGA封装的插座（2）。多个触点（7）安装在基座（4）中，每个触点具有一对臂（7a和7b），用于实现所保持的BGA封装的焊球的压缩电接触。滑块（5）可滑动地安装在基座（4）上，用于打开和关闭臂。通过设置在大致正方形基座（4）的对角线上的凸轮构件（20），在滑块的凸轮从动部（52）处以规定方向施加外力。凸轮以选定的倾斜角度与滑块的凸轮从动部分（52）接合，并且可以在与滑块的移动方向成直角的方向上移动。

3. 发明授权

US06287127B1 Electrical socket apparatus 有权
标题翻译：电插座设备
公开(公告)号：US06287127B1
公开(公告)日：2001-09-11
申请号：US09694636
申请日：2000-10-23
申请人： Yasushi Hibino , Hideyuki Takahashi , Toyokazu Ezura , Kiyokazu Ikeya , Yasuhiro Ochiai
发明人： Yasushi Hibino , Hideyuki Takahashi , Toyokazu Ezura , Kiyokazu Ikeya , Yasuhiro Ochiai
IPC分类号： H01R1200
CPC分类号： H01R12/88 , H01R4/022
摘要： A socket (1) includes a body (1a) and a cover (3). Body (1a) has a base (2) having a horizontally movable slide (4) thereon on which a BGA package can be mounted and a plurality of contact members (6) arranged on base (2) corresponding to a pattern of solder balls of the BGA package. Each of contact members (6) has a pair of spring arms (6a, 6b) which can be opened and closed in response to movement of slide (4). In one embodiment, a cover (3) is vertically movable relative to body (1a). The cover (3) has motion transfer portions (31) having a wedge shape which are engageable with tapered force receiving portions (43) of slide(4). As cover (3) is pushed down, engagement surfaces (31) of motion transfer portions (30) engage force receiving surfaces (43) of slide (4) and slide (4) moves so that arms (6a, 6b) of contact members (6) are opened. In another embodiment, the motion transfer parts (31) are provided on a head (11) which has an air suction holder for a BGA package.
摘要翻译：插座（1）包括主体（1a）和盖子（3）。主体（1a）具有底座（2），其上具有可水平移动的滑动件（4），BGA组件可安装在其上，多个接触构件（6）布置在基座（2）上， BGA封装。每个接触构件（6）具有一对弹簧臂（6a，6b），其可以响应于滑块（4）的移动而被打开和关闭。在一个实施例中，盖（3）可相对于主体（1a）竖直移动。盖（3）具有可与滑动件（4）的锥形受力部分（43）接合的具有楔形形状的运动传递部分（31）。当盖（3）被推下时，运动传递部分（30）的接合表面（31）接合滑动件（4）的力接收表面（43）并且滑动件（4）移动，使得接触构件的臂（6a，6b）（6）打开。在另一个实施例中，运动传递部分（31）设置在具有用于BGA封装的吸气保持器的头部（11）上。

4. 发明授权

US06280219B1 Socket apparatus for IC packages 失效
标题翻译： IC封装的插座设备
公开(公告)号：US06280219B1
公开(公告)日：2001-08-28
申请号：US09753479
申请日：2001-01-03
申请人： Hideki Sano , Kiyokazu Ikeya
发明人： Hideki Sano , Kiyokazu Ikeya
IPC分类号： H01R1122
CPC分类号： H01R13/193 , H01R12/89 , H01R2201/20
摘要： A socket (10) having a base (12), an adapter (24) which has a mounting seat for a semiconductor device (100) and which is installed on the base, and a plurality of contact members (14) which are caused to engage respective terminals of the semiconductor device that has been placed on the mounting seat of the adapter. Each contact member (14) has a pair of arms (90, 130, 144) provided by the bifurcation of one end, with the other end being fixed to the base. Each contact member is caused to nip a respective terminal (102) of the semiconductor device arranged on the mounting seat at the tip portion of the pair of arms and has butting surfaces (92, 131, 148) that determine the minimum spacing distance of the tip portions of the arms on the opposing sides of each pair of arms. Contact members (14) are connected to socket terminals (21) via a connector including an expansion board (20), conductive wires (150, 160), flexible printed substrate (170), sockets (190, 200, 214) and lead guides (222, 224) in several embodiments.
摘要翻译：一种具有基座（12）的插座（10），具有用于半导体器件（100）的安装座并安装在基座上的适配器（24）和多个接触构件（14）接合已经放置在适配器的安装座上的半导体器件的各个端子。每个接触构件（14）具有由一端的分叉提供的一对臂（90,130,144），另一端固定在基座上。导致每个接触构件夹在布置在安装座上的在一对臂的尖端部分处的半导体器件的相应端子（102），并且具有确定最小间隔距离的对接表面（92,131,148）在每对臂的相对侧上的臂的尖端部分。接触构件（14）经由包括扩展板（20），导线（150,160），柔性印刷基板（170），插座（190,200,214）和导线引导件（222,224）。

5. 发明授权

US5718595A Socket apparatus 失效
标题翻译：插座设备
公开(公告)号：US5718595A
公开(公告)日：1998-02-17
申请号：US562141
申请日：1995-11-22
申请人： Masao Tohyama , Kiyokazu Ikeya , Takashi Tonooka
发明人： Masao Tohyama , Kiyokazu Ikeya , Takashi Tonooka
IPC分类号： G01R31/26 , H01L23/32 , H01R13/629 , H01R33/76 , H01R33/97 , H05K7/10 , H01R13/62
CPC分类号： H05K7/1023
摘要： A socket for removably mounting an electric part such as an IC package (30) has a cover (14) which when pushed down from a raised at rest position causes a drive shaft (26) fixed to the cover (14) to move down rotating a first lever (36) and actuating a second lever (38). Upon such rotation a latch (48) moves to a receded position which is obliquely above a plurality of contact elements (28) and, at the same time, vertically movable arms (50) rise to a selected vertical position from a cavity (52). The IC package (30) is then received on the vertically movable arms (50). When the downward force on the cover (14) is removed, cover (14) and the drive shaft (26) rise, first lever (36) and second lever (38) start moving in an opposite direction and the vertically movable arms (50) move down carrying the IC package (30), with a result that each terminal lead (32) of the IC package engages and rides on a contact portion (28f) of each contact element (28, 28') corresponding thereto and the latch (48) engages the terminal leads disposed on the contact portions (28f) in such a fashion as to sandwich the leads (32) and apply an additional contact force to the leads (32).
摘要翻译：用于可拆卸地安装诸如IC封装（30）的电气部件的插座具有盖（14），当从固定位置的升高状态下推时，盖子（14）使得固定到盖（14）的驱动轴（26）向下旋转第一杠杆（36）并且致动第二杠杆（38）。在这种旋转时，闩锁（48）移动到倾斜地位于多个接触元件（28）上方的后退位置，并且同时可垂直移动的臂（50）从空腔（52）升至选定的垂直位置，。 IC封装（30）然后被接收在可垂直移动的臂（50）上。当盖（14）上的向下的力被移除时，盖（14）和驱动轴（26）上升，第一杆（36）和第二杆（38）开始沿相反的方向移动，并且可升降臂）向下移动携带IC封装（30），结果是IC封装的每个端子引线（32）接合并骑在与其对应的每个接触元件（28,28'）的接触部分（28f）上，并且闩锁（48）以夹着引线（32）的方式接合设置在接触部分（28f）上的端子引线，并向引线（32）施加额外的接触力。

6. 发明授权

US5688128A Detachable socket for an IC chip 失效
标题翻译：用于IC芯片的可拆卸插座
公开(公告)号：US5688128A
公开(公告)日：1997-11-18
申请号：US367962
申请日：1995-01-03
申请人： Kiyokazu Ikeya
发明人： Kiyokazu Ikeya
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76 , H01R33/94 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1023
摘要： A socket for mounting an electrical part such as an IC chip 60 in a freely detachable manner in which the electrical part 60 has a plurality of connective terminal parts of a prescribed pitch, has socket terminals 50 fixed in the socket 10 and a plurality of electroconductive parts 34 positioned on an insulating substrate 32. Each of the electroconductive parts 34 has first and second contact areas (34a, 34b) areas with the first contact area 34a having the same pitch as the pitch between the connective terminal parts BP. The insulating substrate 32 is held by a spring biased support member to provide for reliable contacting with the electrical part 60. The first contact area 34a of the electroconductive parts 34 provides electrical connection with one of the connective terminal parts BP of the electrical part 60 and the second contact part 34b provides electrical connection with one of the socket terminals 50 thereby providing reliable electrical connections between the electrical part 60 and the socket. This design provides for electrical connection for electrical parts without external lead terminals.
摘要翻译：用于以可自由拆卸的方式安装诸如IC芯片60的电气部件的插座，其中电气部件60具有多个具有规定间距的连接端子部件，其具有固定在插座10中的插座端子50和多个导电每个导电部分34具有第一和第二接触区域（34a，34b），其中第一接触区域34a具有与连接端子部件BP之间的间距相同的间距。绝缘基板32由弹簧偏置的支撑构件保持以提供与电气部件60的可靠接触。导电部分34的第一接触区域34a提供与电气部件60的连接端子部分BP中的一个电连接，以及第二接触部分34b提供与插座端子50之一的电连接，从而在电气部件60和插座之间提供可靠的电连接。该设计提供电气部件的电气连接，无需外部引线端子。

7. 发明授权

US5320551A Socket 失效
标题翻译：插座
公开(公告)号：US5320551A
公开(公告)日：1994-06-14
申请号：US937627
申请日：1992-08-28
申请人： Ikuo Mori , Kiyokazu Ikeya
发明人： Ikuo Mori , Kiyokazu Ikeya
IPC分类号： G01R31/26 , G01R1/04 , H01L23/32 , H01R33/76 , H05K7/10 , H01R11/22
CPC分类号： H05K7/1007 , G01R1/0433
摘要： A socket with a base and a reciprocating cover for use in the burn-in test of an electrical part which is characterized in that during the time from immediately before mounting of the electrical part to the completion of mounting thereof, the electrical part is moved in such a manner that a terminal lead of the electrical part will come in contact and wipe a contact element of the socket so that any oxide film on the surface of the contact element of socket is removed. Also, a latch can be provided for holding the socket in desired mounting position during the above described wiping and contacting procedure.
摘要翻译：一种具有基座和往复式盖的插座，用于电气部件的老化试验，其特征在于，在从电气部件的安装之前到其完成安装的时间期间，将电气部件移动到使得电气部件的端子引线接触并擦拭插座的接触元件，使得插座的接触元件的表面上的任何氧化膜被去除。而且，在上述擦拭和接触程序期间，可以设置一个闩锁以将插座保持在所需的安装位置。

8. 发明申请

US20060192264A1 Contact assembly and socket for use with semiconductor packages 有权
标题翻译：接触组件和插座用于半导体封装
公开(公告)号：US20060192264A1
公开(公告)日：2006-08-31
申请号：US11326302
申请日：2006-01-05
申请人： Hideyuki Takahashi , Kiyokazu Ikeya
发明人： Hideyuki Takahashi , Kiyokazu Ikeya
IPC分类号： H01L31/00
CPC分类号： G01R1/0483 , G01R31/2863 , H01L2924/0002 , H01R12/7082 , H01R12/714 , H01R13/6467 , H01L2924/00
摘要： In a contact assembly, a first set of contacts (30-1 through 30-5) is arranged on a first surface and a second set of contacts (40-5 through 4-1) is arranged on a second surface with respective contacts of each set used as pairs. A plurality of first and second sets are stacked one on top of another separated by insulators, the first terminal portions (12) of respective first and the second sets of contacts are aligned in the direction of stacking and the second terminal portions (20) of the first and second sets of contacts are arranged in such a fashion as to be symmetrical relative to a median line. The pitch (P2) of the second terminal portions (20) of the first and the second sets of contacts is expanded to a greater degree than the pitch (P1) of the first terminal portions (12) in two preferred embodiments. The pitch of the second terminal portions of a contact assembly (200) having two first and two second sets of contacts is also shown expanded in the stacking direction in one embodiment forming a zigzag pattern of the second terminal portions.
摘要翻译：在接触组件中，第一组触点（30-1至30-5）布置在第一表面上，第二组触点（40-5至4-1）布置在第二表面上，每组用作对。多个第一组和第二组彼此堆叠在另一个绝缘体之上，相应的第一组和第二组触点的第一端子部分（12）在堆叠方向上对准，第二端子部分（20）第一和第二组触点以相对于中线对称的方式布置。在两个优选实施例中，第一和第二组触点的第二端子部分（20）的间距（P 2）比第一端子部分（12）的间距（P 1）更大的扩展。在一个实施例中，具有两个第一组和第二组第二组触点的接触组件（200）的第二端子部分的间距也被示出为在层叠方向上扩大形成第二端子部分的锯齿形图案。

9. 发明授权

US6033235A Socket apparatus particularly adapted for BGA type semiconductor devices 失效
标题翻译：插座设备特别适用于BGA型半导体器件
公开(公告)号：US6033235A
公开(公告)日：2000-03-07
申请号：US191404
申请日：1998-11-12
申请人： Kiyokazu Ikeya
发明人： Kiyokazu Ikeya
IPC分类号： G01R31/26 , G01R1/04 , H01L23/32 , H01R13/24 , H01R33/76 , H01R33/94 , H05K3/32 , H05K3/40 , H05K7/10 , H01R12/04
CPC分类号： H01R13/2421 , G01R1/0483 , H05K7/1061 , G01R1/0466 , H05K3/326 , H05K3/4007
摘要： A socket (1) for removably receiving semiconductor devices (8) for testing purposes has film contacts (81) each having a continuous or discontinuous annulus (71, 73, 76, 78) that has been formed on a film substrate and with a recess (72, 74, 77, 79) formed within the annulus exposed at a bottom of a seating or accommodating portion (31). When a BGA type semiconductor device (8) is received in the accommodating part (31) and a cover (16) is closed, electrically conductive balls (9) on the bottom of the semiconductor device (8) are pressed against respective film annular contacts (81, 82, 83, 84) thereby effecting an electric connection. Since the bottom most portion of the electrically conductive balls (9) are located within the recesses of the annular contacts, they will not be deformed. Since the film contacts (81) are prepared by etching and plating, the pitch can be easily narrowed, or otherwise modified.
摘要翻译：用于可拆卸地接收用于测试目的的半导体器件（8）的插座（1）具有每个具有连续或不连续环（71,73,76,78）的膜触点（81），其已经形成在膜基底上并具有凹部（72,74,77,79），其形成在暴露在座位或容纳部分（31）的底部的环形空间内。当BGA型半导体器件（8）被容纳在容纳部分（31）中并且盖（16）闭合时，半导体器件（8）底部的导电球（9）被压在相应的膜环形触点（81,82,83,84），从而实现电连接。由于导电球（9）的最底部位于环形触点的凹部内，所以它们不会变形。由于膜接触（81）通过蚀刻和电镀制备，所以可以容易地缩小间距或进行其它改变。

10. 发明授权

US5690281A Socket apparatus 失效
标题翻译：插座设备
公开(公告)号：US5690281A
公开(公告)日：1997-11-25
申请号：US518123
申请日：1995-08-22
申请人： Kiyokazu Ikeya , Kiyoshi Adachi , Masao Tohyama , Tomohiro Nakano
发明人： Kiyokazu Ikeya , Kiyoshi Adachi , Masao Tohyama , Tomohiro Nakano
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76 , H05K7/10 , H01R11/22
CPC分类号： H05K7/1007 , H05K7/1084
摘要： A socket having a structure which is suitable for electrical connection with ball-shaped lead terminals of an IC package is shown. When a cover (12) is pushed down, a latch (70) moves away, a slide plate (40) slides toward the positive side in an X direction through levers (52) and (50) and movable shaft (58) and both arms of each contact maker (30) open. Each lead terminal (solder ball) (32a) of the BGA package (32) is freely inserted between both arms of a respective contact maker (30) when in the open state. When cover (12) rises to its highest position, slide plate (40) slides in the reverse direction by the spring force of a compression coil spring, thereby returning to the its original position and both arms of each contact (32) engage each lead terminal (32a) in such a way as to hold it from opposite sides with a result that an electrical connection based on compressive engagement is obtained between each contact element (30) and each respective terminal (32a).
摘要翻译：示出了具有适于与IC封装的球形引线端子电连接的结构的插座。当盖子（12）被向下推动时，闩锁（70）移开，滑板（40）通过杠杆（52）和（50）和可移动轴（58）沿X方向向正侧滑动，并且两者每个联系人（30）的武器开放。当处于打开状态时，BGA封装（32）的每个引线端子（焊球）（32a）自由地插入相应接触器（30）的两个臂之间。当盖（12）上升到其最高位置时，滑板（40）通过压缩螺旋弹簧的弹簧力沿相反方向滑动，从而返回到其初始位置，并且每个触头（32）的两个臂与每个引线端子（32a）以使其从相对侧保持，从而在每个接触元件（30）和每个相应的端子（32a）之间获得基于压缩接合的电连接。

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