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1. 发明授权

US5718595A Socket apparatus 失效
标题翻译：插座设备
公开(公告)号：US5718595A
公开(公告)日：1998-02-17
申请号：US562141
申请日：1995-11-22
申请人： Masao Tohyama , Kiyokazu Ikeya , Takashi Tonooka
发明人： Masao Tohyama , Kiyokazu Ikeya , Takashi Tonooka
IPC分类号： G01R31/26 , H01L23/32 , H01R13/629 , H01R33/76 , H01R33/97 , H05K7/10 , H01R13/62
CPC分类号： H05K7/1023
摘要： A socket for removably mounting an electric part such as an IC package (30) has a cover (14) which when pushed down from a raised at rest position causes a drive shaft (26) fixed to the cover (14) to move down rotating a first lever (36) and actuating a second lever (38). Upon such rotation a latch (48) moves to a receded position which is obliquely above a plurality of contact elements (28) and, at the same time, vertically movable arms (50) rise to a selected vertical position from a cavity (52). The IC package (30) is then received on the vertically movable arms (50). When the downward force on the cover (14) is removed, cover (14) and the drive shaft (26) rise, first lever (36) and second lever (38) start moving in an opposite direction and the vertically movable arms (50) move down carrying the IC package (30), with a result that each terminal lead (32) of the IC package engages and rides on a contact portion (28f) of each contact element (28, 28') corresponding thereto and the latch (48) engages the terminal leads disposed on the contact portions (28f) in such a fashion as to sandwich the leads (32) and apply an additional contact force to the leads (32).
摘要翻译：用于可拆卸地安装诸如IC封装（30）的电气部件的插座具有盖（14），当从固定位置的升高状态下推时，盖子（14）使得固定到盖（14）的驱动轴（26）向下旋转第一杠杆（36）并且致动第二杠杆（38）。在这种旋转时，闩锁（48）移动到倾斜地位于多个接触元件（28）上方的后退位置，并且同时可垂直移动的臂（50）从空腔（52）升至选定的垂直位置，。 IC封装（30）然后被接收在可垂直移动的臂（50）上。当盖（14）上的向下的力被移除时，盖（14）和驱动轴（26）上升，第一杆（36）和第二杆（38）开始沿相反的方向移动，并且可升降臂）向下移动携带IC封装（30），结果是IC封装的每个端子引线（32）接合并骑在与其对应的每个接触元件（28,28'）的接触部分（28f）上，并且闩锁（48）以夹着引线（32）的方式接合设置在接触部分（28f）上的端子引线，并向引线（32）施加额外的接触力。

2. 发明授权

US5364284A Socket 失效
标题翻译：插座
公开(公告)号：US5364284A
公开(公告)日：1994-11-15
申请号：US88234
申请日：1993-07-06
申请人： Masao Tohyama , Kiyokazu Ikeya
发明人： Masao Tohyama , Kiyokazu Ikeya
IPC分类号： H01L23/32 , H01R13/193 , H01R33/76 , H01R33/97 , H05K7/10 , H01R11/22
CPC分类号： H05K7/1023 , H01R13/193
摘要： A socket having contact elements (22, 22', 50, 89) movable into and out of engagement with terminal leads (14a, 87) of an electrical component has a connection assembly (28, 34; 28', 34'; 58, 60, 66; 90, 91, 95) rotatably mounted to the base (10, 52, 80) of the socket for moving the contact elements into and out of engagement with the terminal leads. The connection assembly is driven by a movable cover (12) or by a motor (46) through a shaft (26, 54) which may be interconnected with comparable shafts on other sockets.
摘要翻译：具有与电气部件的端子引线（14a，87）可移入和脱离接合的接触元件（22,22'，50,89）的插座具有连接组件（28,34; 28'，34'; 58， 60,66; 90,91,95），其可旋转地安装到所述插座的基座（10,52,80）上，用于将所述接触元件移动到与所述端子引线接合和脱离接合。连接组件由可动盖（12）或电动机（46）通过轴（26,54）驱动，轴可与其他插座上的可比较的轴相互连接。

3. 发明授权

US5690281A Socket apparatus 失效
标题翻译：插座设备
公开(公告)号：US5690281A
公开(公告)日：1997-11-25
申请号：US518123
申请日：1995-08-22
申请人： Kiyokazu Ikeya , Kiyoshi Adachi , Masao Tohyama , Tomohiro Nakano
发明人： Kiyokazu Ikeya , Kiyoshi Adachi , Masao Tohyama , Tomohiro Nakano
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76 , H05K7/10 , H01R11/22
CPC分类号： H05K7/1007 , H05K7/1084
摘要： A socket having a structure which is suitable for electrical connection with ball-shaped lead terminals of an IC package is shown. When a cover (12) is pushed down, a latch (70) moves away, a slide plate (40) slides toward the positive side in an X direction through levers (52) and (50) and movable shaft (58) and both arms of each contact maker (30) open. Each lead terminal (solder ball) (32a) of the BGA package (32) is freely inserted between both arms of a respective contact maker (30) when in the open state. When cover (12) rises to its highest position, slide plate (40) slides in the reverse direction by the spring force of a compression coil spring, thereby returning to the its original position and both arms of each contact (32) engage each lead terminal (32a) in such a way as to hold it from opposite sides with a result that an electrical connection based on compressive engagement is obtained between each contact element (30) and each respective terminal (32a).
摘要翻译：示出了具有适于与IC封装的球形引线端子电连接的结构的插座。当盖子（12）被向下推动时，闩锁（70）移开，滑板（40）通过杠杆（52）和（50）和可移动轴（58）沿X方向向正侧滑动，并且两者每个联系人（30）的武器开放。当处于打开状态时，BGA封装（32）的每个引线端子（焊球）（32a）自由地插入相应接触器（30）的两个臂之间。当盖（12）上升到其最高位置时，滑板（40）通过压缩螺旋弹簧的弹簧力沿相反方向滑动，从而返回到其初始位置，并且每个触头（32）的两个臂与每个引线端子（32a）以使其从相对侧保持，从而在每个接触元件（30）和每个相应的端子（32a）之间获得基于压缩接合的电连接。

4. 发明授权

US4059553A Coating composition comprising oxides and/or hydroxides of Mg.sup.++, Ca.sup.++, chromium, manganese, and Zn.sup.++ and quaternary ammonium silicates useful for building materials 失效
标题翻译：包含Mg {hu {30 {{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{{ 用于建筑材料
公开(公告)号：US4059553A
公开(公告)日：1977-11-22
申请号：US678577
申请日：1976-04-20
申请人： Masao Tohyama , Minoru Ichigo , Takeshi Suzuki , Makoto Nakasu , Akinobu Ando , Akitoshi Yoshida , Masaharu Kosaka , Norihisa Hayasi , Shigeki Inoue
发明人： Masao Tohyama , Minoru Ichigo , Takeshi Suzuki , Makoto Nakasu , Akinobu Ando , Akitoshi Yoshida , Masaharu Kosaka , Norihisa Hayasi , Shigeki Inoue
IPC分类号： C04B12/04 , C04B28/24 , C09D1/02 , C09D5/00 , C08K3/00 , C04B13/24 , C08F45/24 , C08L25/14
CPC分类号： C04B12/04 , C04B28/24
摘要： A coating composition for building materials which comprises 100 parts by weight of a quaternary ammonium silicate having a silica content, calculated as SiO.sub.2, of 5 to 70% by weight, 2 to 200 parts by weight of a metal oxide and/or hydroxide capable of converting silica sol to silica gel and water in an amount sufficient to plasticize said composition.
摘要翻译：一种建筑材料用涂料组合物，其包含100重量份二氧化硅含量（SiO 2计）为5-70重量％的二氧化硅含量为2重量份的金属氧化物和/或氢氧化物将硅溶胶转化为硅胶和水，其量足以塑化所述组合物。

5. 发明授权

US6050836A Socket apparatus 失效
公开(公告)号：US6050836A
公开(公告)日：2000-04-18
申请号：US971385
申请日：1997-11-17
申请人： Masao Tohyama
发明人： Masao Tohyama
IPC分类号： G01R31/26 , G01R1/04 , H01L23/32 , H01R13/11 , H01R13/193 , H01R13/629 , H01R33/76 , H05K7/10 , H01R11/22
CPC分类号： G01R1/0408 , H01R13/193 , H05K7/1084
摘要： A socket (1) for burn-in tests of IC packages employs rack and pinion gears to drive contact makers (6). As a cover (3) is depressed against coil springs (38), a slide actuator member (4) with sliding portions (30, 32) is raised by rack (3b, 26a, 27a, 28a, 29a) and pinion gears (34, 35). Slide actuator member 4 includes grid members (4b) which bias the contact makers (6) into an open position when the actuator member is raised and allows the contact makers to close when the slide actuator member is lowered. Supporting surfaces (30d, 32d) of the sliding parts (30, 32) of the slide actuator member are raised higher than interdigitated loading surfaces (20a, 21a) of guide elements (20, 21) of the base (2) so that the IC package (5) can be easily positioned by the supporting surfaces (30d, 32d) without engaging the ball terminals (5b) with arms (6a, 6b) of contact makers (6). Cover (3) begins to move upwardly when the downward force on the cover is released, while the slide actuator member (4) moves downwardly. Subsequently, the IC package (5) is precisely positioned on loading surfaces (20a, 21a) by the guiding surfaces (20b, 21b) since the supporting surfaces (30d, 32d) are lowered below the loading surfaces (20a, 21a), simultaneously the ball terminals (5b) are clamped by the arms (6a, 6b). In a second embodiment the contact makers (6) of socket (1A) are arranged obliquely relative to the sides of the slide actuator member allowing a contact arrangement having a finer pitch. In a third embodiment the slide actuator member (4") is formed integrally with the cover (3"). A modified embodiment shows a modified contact maker (60) formed with a constriction and with a grid member (4b'") of the slide actuator member received in between respective arms (60a, 60b) for controlling the open and closed position of the contact maker.

6. 发明授权

US6045382A Socket apparatus for IC packages 失效
标题翻译： IC封装的插座设备
公开(公告)号：US6045382A
公开(公告)日：2000-04-04
申请号：US971383
申请日：1997-11-17
申请人： Masao Tohyama , Hideki Sano
发明人： Masao Tohyama , Hideki Sano
IPC分类号： G01R31/26 , G01R1/04 , H01L23/32 , H01R13/11 , H01R33/76 , H05K7/10 , H01R11/22
CPC分类号： H05K7/1023 , G01R1/0433
摘要： An IC seating portion (14) of a socket (2) for a semiconductor device (300) is arranged so that the IC terminal leads can engage with contact heads (22) of contact pins (20) mounted in the socket. Each contact pin (20) is arranged in a respective slit (8) formed by partition members (7) providing electrically isolation of the contact pins from one another. Socket (2) has a blocking member (3) which blocks the gaps or slits at their top to prevent IC terminal leads from becoming entangled with the slits or contact pins (20). A stop member (4) is formed in the IC seating portion (14) to facilitate positioning of a semiconductor device (300) on the seating portion and to prevent the IC terminal leads from interfering with contact pins (20).
摘要翻译：布置了用于半导体器件（300）的插座（2）的IC座部分（14），使得IC端子引线可以与安装在插座中的接触针（20）的接触头（22）接合。每个接触销（20）布置在由分隔构件（7）形成的相应狭缝（8）中，所述分隔构件（7）提供接触销彼此的电隔离。插座（2）具有阻挡其顶部上的间隙或狭缝的阻挡构件（3），以防止IC端子引线与狭缝或接触针（20）缠结。止动构件（4）形成在IC支座部分（14）中，以便于将半导体装置（300）定位在座位部分上，并防止IC端子引线与接触针（20）干涉。

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