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1. 发明申请

US20060192264A1 Contact assembly and socket for use with semiconductor packages 有权
标题翻译：接触组件和插座用于半导体封装
公开(公告)号：US20060192264A1
公开(公告)日：2006-08-31
申请号：US11326302
申请日：2006-01-05
申请人： Hideyuki Takahashi , Kiyokazu Ikeya
发明人： Hideyuki Takahashi , Kiyokazu Ikeya
IPC分类号： H01L31/00
CPC分类号： G01R1/0483 , G01R31/2863 , H01L2924/0002 , H01R12/7082 , H01R12/714 , H01R13/6467 , H01L2924/00
摘要： In a contact assembly, a first set of contacts (30-1 through 30-5) is arranged on a first surface and a second set of contacts (40-5 through 4-1) is arranged on a second surface with respective contacts of each set used as pairs. A plurality of first and second sets are stacked one on top of another separated by insulators, the first terminal portions (12) of respective first and the second sets of contacts are aligned in the direction of stacking and the second terminal portions (20) of the first and second sets of contacts are arranged in such a fashion as to be symmetrical relative to a median line. The pitch (P2) of the second terminal portions (20) of the first and the second sets of contacts is expanded to a greater degree than the pitch (P1) of the first terminal portions (12) in two preferred embodiments. The pitch of the second terminal portions of a contact assembly (200) having two first and two second sets of contacts is also shown expanded in the stacking direction in one embodiment forming a zigzag pattern of the second terminal portions.
摘要翻译：在接触组件中，第一组触点（30-1至30-5）布置在第一表面上，第二组触点（40-5至4-1）布置在第二表面上，每组用作对。多个第一组和第二组彼此堆叠在另一个绝缘体之上，相应的第一组和第二组触点的第一端子部分（12）在堆叠方向上对准，第二端子部分（20）第一和第二组触点以相对于中线对称的方式布置。在两个优选实施例中，第一和第二组触点的第二端子部分（20）的间距（P 2）比第一端子部分（12）的间距（P 1）更大的扩展。在一个实施例中，具有两个第一组和第二组第二组触点的接触组件（200）的第二端子部分的间距也被示出为在层叠方向上扩大形成第二端子部分的锯齿形图案。

2. 发明授权

US6033235A Socket apparatus particularly adapted for BGA type semiconductor devices 失效
标题翻译：插座设备特别适用于BGA型半导体器件
公开(公告)号：US6033235A
公开(公告)日：2000-03-07
申请号：US191404
申请日：1998-11-12
申请人： Kiyokazu Ikeya
发明人： Kiyokazu Ikeya
IPC分类号： G01R31/26 , G01R1/04 , H01L23/32 , H01R13/24 , H01R33/76 , H01R33/94 , H05K3/32 , H05K3/40 , H05K7/10 , H01R12/04
CPC分类号： H01R13/2421 , G01R1/0483 , H05K7/1061 , G01R1/0466 , H05K3/326 , H05K3/4007
摘要： A socket (1) for removably receiving semiconductor devices (8) for testing purposes has film contacts (81) each having a continuous or discontinuous annulus (71, 73, 76, 78) that has been formed on a film substrate and with a recess (72, 74, 77, 79) formed within the annulus exposed at a bottom of a seating or accommodating portion (31). When a BGA type semiconductor device (8) is received in the accommodating part (31) and a cover (16) is closed, electrically conductive balls (9) on the bottom of the semiconductor device (8) are pressed against respective film annular contacts (81, 82, 83, 84) thereby effecting an electric connection. Since the bottom most portion of the electrically conductive balls (9) are located within the recesses of the annular contacts, they will not be deformed. Since the film contacts (81) are prepared by etching and plating, the pitch can be easily narrowed, or otherwise modified.
摘要翻译：用于可拆卸地接收用于测试目的的半导体器件（8）的插座（1）具有每个具有连续或不连续环（71,73,76,78）的膜触点（81），其已经形成在膜基底上并具有凹部（72,74,77,79），其形成在暴露在座位或容纳部分（31）的底部的环形空间内。当BGA型半导体器件（8）被容纳在容纳部分（31）中并且盖（16）闭合时，半导体器件（8）底部的导电球（9）被压在相应的膜环形触点（81,82,83,84），从而实现电连接。由于导电球（9）的最底部位于环形触点的凹部内，所以它们不会变形。由于膜接触（81）通过蚀刻和电镀制备，所以可以容易地缩小间距或进行其它改变。

3. 发明授权

US5690281A Socket apparatus 失效
标题翻译：插座设备
公开(公告)号：US5690281A
公开(公告)日：1997-11-25
申请号：US518123
申请日：1995-08-22
申请人： Kiyokazu Ikeya , Kiyoshi Adachi , Masao Tohyama , Tomohiro Nakano
发明人： Kiyokazu Ikeya , Kiyoshi Adachi , Masao Tohyama , Tomohiro Nakano
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76 , H05K7/10 , H01R11/22
CPC分类号： H05K7/1007 , H05K7/1084
摘要： A socket having a structure which is suitable for electrical connection with ball-shaped lead terminals of an IC package is shown. When a cover (12) is pushed down, a latch (70) moves away, a slide plate (40) slides toward the positive side in an X direction through levers (52) and (50) and movable shaft (58) and both arms of each contact maker (30) open. Each lead terminal (solder ball) (32a) of the BGA package (32) is freely inserted between both arms of a respective contact maker (30) when in the open state. When cover (12) rises to its highest position, slide plate (40) slides in the reverse direction by the spring force of a compression coil spring, thereby returning to the its original position and both arms of each contact (32) engage each lead terminal (32a) in such a way as to hold it from opposite sides with a result that an electrical connection based on compressive engagement is obtained between each contact element (30) and each respective terminal (32a).
摘要翻译：示出了具有适于与IC封装的球形引线端子电连接的结构的插座。当盖子（12）被向下推动时，闩锁（70）移开，滑板（40）通过杠杆（52）和（50）和可移动轴（58）沿X方向向正侧滑动，并且两者每个联系人（30）的武器开放。当处于打开状态时，BGA封装（32）的每个引线端子（焊球）（32a）自由地插入相应接触器（30）的两个臂之间。当盖（12）上升到其最高位置时，滑板（40）通过压缩螺旋弹簧的弹簧力沿相反方向滑动，从而返回到其初始位置，并且每个触头（32）的两个臂与每个引线端子（32a）以使其从相对侧保持，从而在每个接触元件（30）和每个相应的端子（32a）之间获得基于压缩接合的电连接。

4. 发明授权

US5482471A Socket apparatus for IC package testing 失效
标题翻译：用于IC封装测试的插座设备
公开(公告)号：US5482471A
公开(公告)日：1996-01-09
申请号：US197437
申请日：1994-02-16
申请人： Ikuo Mori , Kiyokazu Ikeya
发明人： Ikuo Mori , Kiyokazu Ikeya
IPC分类号： G01R31/26 , G01R1/04 , H01L21/66 , H01L23/32 , H01R33/76 , H05K7/10 , H01R13/15
CPC分类号： H05K7/1007 , G01R1/0483 , H05K7/1084
摘要： A socket for testing integrated circuit (IC) packages (100) has a lower block (10) with a plurality of contact elements (11) movable between open and closed positions mounted therein, an upper block (20) fixed on the lower bock (10) and formed with a lead insertion hole (21) for the insertion of each lead (101) of the IC package (100), a cover member (30) adapted for vertical, up and down movement relative to the upper block (20), and a spring biased slide block (40) mounted to slidably reciprocate in a recess formed between the upper and lower blocks (10,20) in a direction which crosses, at approximately a right angle, the direction in which a lead (101) of an IC package (100) would be inserted into an opened contact element (11). The slide block (40) has a plurality of apertures (41) for opening and closing contact elements (11) upon movement of the cover member (30) by the use of a contact part opening and closing element (50) converting movement of the cover (30) to sliding action of the slide block (40).
摘要翻译：用于测试集成电路（IC）封装（100）的插座具有下块（10），其中多个接触元件（11）可在安装在其中的打开和关闭位置之间移动，固定在下部块上的上块（20）并且形成有用于插入IC封装（100）的每个引线（101）的引线插入孔（21），适于相对于上部块（20）垂直，上下移动的盖构件（30））和弹簧偏置滑动块（40），其安装成在形成在所述上部和下部块（10,20）之间的凹部中可滑动地往复运动，所述凹部沿大致直角交叉的方向，）将被插入到打开的接触元件（11）中。滑动块（40）具有多个孔（41），用于通过使用接触部分打开和关闭元件（50）来转动盖构件（30）的移动来打开和关闭接触元件（11）盖（30）滑动块（40）的滑动动作。

5. 发明授权

US06614247B2 Socket apparatus and method for removably mounting an electronic package 失效
标题翻译：用于可拆卸地安装电子封装的插座装置和方法
公开(公告)号：US06614247B2
公开(公告)日：2003-09-02
申请号：US10012864
申请日：2001-10-22
申请人： Kiyokazu Ikeya , Kyozo Katayose
发明人： Kiyokazu Ikeya , Kyozo Katayose
IPC分类号： G01R3102
CPC分类号： G01R1/0483
摘要： A socket (10) has a plurality of contacts (13) arranged in base (11). Each contact has one arm (13a) for contacting a solder ball of an electronic package (2). A slider (12) has a seat (12a) for package (2), a plurality of terminal receiving holes (12b), a terminal engagement surface (12c) formed at each terminal receiving hole for engagement with a respective solder ball and a plurality of contact receiving holes (12d). When slider (12) is moved in one directions package (2) can be seated with each ball disposed in a respective terminal receiving hole. When the slider returns, each ball is elastically contacted between an arm (13a) and a terminal engagement surface (12c).
摘要翻译：插座（10）具有布置在基座（11）中的多个触点（13）。每个触点具有用于接触电子封装（2）的焊球的一个臂（13a）。滑块（12）具有用于封装（2）的座（12a），多个端子接收孔（12b），形成在每个端子接收孔处的端子接合表面（12c），用于与相应的焊球接合，并且多个的接触孔（12d）。当滑块（12）在一个方向上移动时，可以将每个球设置在相应的端子容纳孔中，使得包装件（2）可以安置。当滑块返回时，每个球在臂（13a）和端子接合表面（12c）之间弹性接触。

6. 发明授权

US5628635A Test socket for an integrated circuit 失效
标题翻译：用于集成电路的测试插座
公开(公告)号：US5628635A
公开(公告)日：1997-05-13
申请号：US400208
申请日：1995-03-07
申请人： Kiyokazu Ikeya
发明人： Kiyokazu Ikeya
IPC分类号： H01L21/66 , H01L23/32 , H01R33/76 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1023
摘要： A socket has a main socket body 10 and a plurality of contact members 12 adapted for making electrical contact with electrical parts (20, 30) of both small outline package (SOP) type and small outline J-leaded package (SOJ) type. The contact members 12 have a base part 12a that is fixed in the main socket body, a contact part (12d, 12e and 12f) which guides and makes pressure contact with the connection terminals (22, 32) of the electrical part (20, 30) and a connective part 12c which integrally connects the base part (12a) and the contact part (12d, 12e and 12f). Each contact also includes a spring reinforcement and current bypass part (12h). The contact part further includes an upper guide portion (12f), a lower guide portion (12d) and a contact portion (12e).
摘要翻译：插座具有主插座主体10和适于与小外形封装（SOP）型和小外形J型引线封装（SOJ）型的电气部件（20,30）进行电接触的多个接触构件12。接触构件12具有固定在主插座主体中的基部12a，与电气部件20的连接端子（22,32）导引并压接的接触部（12d，12e，12f） 30）以及将基部（12a）和接触部（12d，12e，12f）整体连接的连接部12c。每个触点还包括弹簧加强件和电流旁路部件（12h）。接触部分还包括上引导部分（12f），下引导部分（12d）和接触部分（12e）。

7. 发明授权

US5020998A Test socket 失效
标题翻译：测试插座
公开(公告)号：US5020998A
公开(公告)日：1991-06-04
申请号：US421220
申请日：1989-10-13
申请人： Kiyokazu Ikeya , Masanori Yagi
发明人： Kiyokazu Ikeya , Masanori Yagi
IPC分类号： G01R31/26 , G01R1/04 , H01R13/629 , H01R33/76 , H01R33/97 , H05K7/10
CPC分类号： H05K7/1023 , G01R1/0433
摘要： A socket for testing integrated circuit units has contact elements and holding members movable on a body and has a cover reciprocable toward the body to move the contact elements and holding members in selected sequence for receiving an integrated circuit unit in a carrier on the body and away from the body to permit the holding members to engage the carrier and to permit the contact elements to engage terminals on the integrated circuit on the carrier for releasably connecting the terminals in a test circuit.
摘要翻译：用于测试集成电路单元的插座具有可在主体上移动的接触元件和保持构件，并且具有能够朝向主体往复运动的盖，用于以选定的顺序移动接触元件和保持构件，以便在载体上接收集成电路单元并将其移开从而允许保持构件接合载体并允许接触元件接合在载体上的集成电路上的端子，以便将测试电路中的端子可释放地连接。

8. 发明授权

US4846704A Test socket with improved contact engagement 失效
标题翻译：测试插座具有改进的接触接合
公开(公告)号：US4846704A
公开(公告)日：1989-07-11
申请号：US190278
申请日：1988-05-04
申请人： Kiyokazu Ikeya
发明人： Kiyokazu Ikeya
IPC分类号： H01R33/74 , G01R31/28 , H01L23/32 , H01R33/76 , H05K7/10
CPC分类号： G01R31/2886 , H05K7/1007
摘要： A test socket has movable contact elements blanked from sheet metal to provide each element with a mounting leg part, a contact part at an edge of the blanked sheet metal, and a resilient curved part between the leg and contact parts permitting the contact part to be moved into and out of engagement with terminals of an IC unit to be tested in the socket and has a plurality of projections formed in side-by-side relation to each other in the edge of the sheet metal at the contact part for improving the making and breaking of electrical connection to the IC unit terminal.

9. 发明授权

US4715823A Plug-in socket assembly for integrated circuit package 失效
标题翻译：插入式插座组件用于集成电路封装
公开(公告)号：US4715823A
公开(公告)日：1987-12-29
申请号：US934063
申请日：1986-11-21
申请人： Toyokazu Ezura , Fujio Katsumata , Kiyokazu Ikeya
发明人： Toyokazu Ezura , Fujio Katsumata , Kiyokazu Ikeya
IPC分类号： G01R31/26 , H01R13/62 , H01R33/76 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1046 , Y10S439/923
摘要： A Plug-in socket assembly for use with a semiconductor integrated circuit package has a plurality of contact elements mounted on a support member. The contact elements are each formed with a spring portion, an elongated arm portion merging out of the spring portion to an inner lug portion engageable with a contact pin of the integrated circuit package and an outer lug portion in engagement with a housing member movable downwardly toward and upwardly away from the support member. The housing member is formed with an open space to receive the integrated circuit package therein and a carrier unit adapted to support the integrated circuit package is mounted on the support member and is movable relative to both the support and the housing members.
摘要翻译：用于半导体集成电路封装的插入式插座组件具有安装在支撑构件上的多个接触元件。接触元件各自形成有弹簧部分，从弹簧部分合并到可与集成电路封装的接触销接合的内部突出部分的细长臂部分和与可向下移动的壳体部件接合的外部突出部分并向上远离支撑构件。壳体构件形成有开放空间以在其中容纳集成电路封装，并且适于支撑集成电路封装的载体单元安装在支撑构件上并且可相对于支撑件和壳体构件移动。

10. 发明申请

US20090017703A1 Socket Adaptor Apparatus 有权
标题翻译：插座适配器
公开(公告)号：US20090017703A1
公开(公告)日：2009-01-15
申请号：US12136460
申请日：2008-06-10
申请人： Hideyuki Takahashi , Kiyokazu Ikeya
发明人： Hideyuki Takahashi , Kiyokazu Ikeya
IPC分类号： H01R13/24
CPC分类号： H01R13/112 , G01R1/0483 , H01R12/57 , H01R13/111 , H01R13/2421 , H05K7/1084
摘要： A socket adaptor 10 made of an electrically insulating material has a main adaptor body 12 on which a plurality of through holes 14 containing an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pin 60 and coil spring 62 is placed in each through hole 14. An electrical engagement clipping part 68 for clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin 60. The coil spring 62 is installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.
摘要翻译：由电绝缘材料制成的插座适配器10具有主适配器主体12，其上形成有包含上开口和下开口的多个通孔14。在某些优选实施例中，探针60和螺旋弹簧62被放置在每个通孔14中。用于夹住从所述上开口插入相应通孔的触点的电接合夹持部分68形成在每个探针的上端螺旋弹簧62安装在每个探针上，并将相应的探头针偏压到一个位置，使得形成在探针的下端的尖端从下开口突出。

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