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    • 8. 发明授权
    • Method for forming nitrogen-containing oxide thin film using plasma enhanced atomic layer deposition
    • 使用等离子体增强原子层沉积形成含氮氧化物薄膜的方法
    • US06723642B1
    • 2004-04-20
    • US10377471
    • 2003-02-27
    • Jung-wook LimSun-jin Yun
    • Jung-wook LimSun-jin Yun
    • H01L2144
    • H01L21/0228C23C16/308C23C16/45529C23C16/45542C23C16/50H01L21/02175H01L21/02274H01L21/3145H01L21/31616
    • A method for forming a nitrogen-containing oxide thin film by using plasma enhanced atomic layer deposition is provided. In the method, the nitrogen-containing oxide thin film is deposited by supplying a metal source compound and oxygen gas into a reactor in a cyclic fashion with sequential alternating pulses of the metal source compound and the oxygen gas, wherein the oxygen gas is activated into plasma in synchronization of the pulsing thereof, and a nitrogen source gas is further sequentially pulsed into the reactor and activated into plasma over the substrate in synchronization with the pulsing thereof. According to the method, a dense nitrogen-containing oxide thin film can be deposited at a high rate, and a trace of nitrogen atoms can be incorporated in situ into the nitrogen-containing oxide thin film, thereby increasing the breakdown voltage of the film.
    • 提供了通过使用等离子体增强原子层沉积来形成含氮氧化物薄膜的方法。 在该方法中,通过以金属源化合物和氧气的顺序交替脉冲的循环方式将金属源化合物和氧气供给到反应器中来沉积含氮氧化物薄膜,其中氧气被激活成 其脉冲同步的等离子体和氮源气体进一步顺序地脉冲进入反应器并与其脉冲同步地激活到衬底上的等离子体中。 根据该方法,可以以高速率沉积致密的含氮氧化物薄膜,并且可以将微量的氮原子并入到含氮氧化物薄膜中,从而增加膜的击穿电压。