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    • 10. 发明授权
    • Process for formation for hetero junction structured film utilizing V
grooves
    • 利用V沟槽形成异质结结构薄膜的工艺
    • US5500389A
    • 1996-03-19
    • US342031
    • 1994-11-17
    • Seung-Chang LeeSun-Jin YunBo-Woo KimSang-Won Kang
    • Seung-Chang LeeSun-Jin YunBo-Woo KimSang-Won Kang
    • B82Y10/00B82Y40/00H01L21/20H01L21/203
    • H01L33/025H01L21/0243H01L21/02532H01L21/02639H01L33/002Y10S438/938
    • A process for formation of a hetero junction structured film utilizing V grooves is disclosed. A monocrystalline film 1 is etched into V grooves, and thereupon, a hetero film 2 having misfits is grown, so that dislocations would be intensively distributed within the V grooves. Then, an oxide layer 3 is formed thereupon, and then, the portions of the oxide layer 3 and the hereto film 2 corresponding to the V grooves are removed by carrying out an etching. Then, the residue oxide layer is removed, thereby forming a non-stress non-dislocation hetero junction structure. Further, the following steps can be added. That is, on the above structure, a thin oxide layer 3 is deposited by carrying out a thermal oxidation or a chemical deposition, and then, a polycrystalline silicon film 4 is deposited. Then the surface irregularities are smoothened by carrying out a selective grinding. Or the following steps may be added. That is, the V groove portions of the hetero film 2 and the monocrystalline film 1 are filled with a monocrystalline film, and the residue oxide layer 3 is removed. Thus a hetero junction film can be grown in which the stress effect is minimized, and the dislocation concentration is made to be extremely low.
    • 公开了一种利用V沟形成异质结结构薄膜的方法。 将单晶膜1蚀刻成V槽,随后生长出错位的异质膜2,使位错集中分布在V槽内。 然后,在其上形成氧化物层3,然后通过进行蚀刻来去除与V槽对应的氧化物层3和本膜2的部分。 然后,除去残留氧化物层,从而形成非应力非位错异质结结构。 此外,可以添加以下步骤。 也就是说,在上述结构中,通过进行热氧化或化学沉积来沉积薄的氧化物层3,然后沉积多晶硅膜4。 然后通过进行选择性研磨使表面凹凸平滑。 或者可以添加以下步骤。 也就是说,异质膜2和单晶膜1的V槽部分填充有单晶膜,并且去除残余氧化物层3。 因此,可以生长应力效应最小化的异质结膜,并使位错浓度极低。