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1. 发明授权

US5498765A Positive photoresist composition containing photoacid generator and use thereof 失效
标题翻译：含有光致酸发生剂的正性光致抗蚀剂组合物及其用途
公开(公告)号：US5498765A
公开(公告)日：1996-03-12
申请号：US311027
申请日：1994-09-26
申请人： Burton J. Carpenter, Jr. , Michael G. McMaster , Joseph LaTorre , Logan L. Simpson
发明人： Burton J. Carpenter, Jr. , Michael G. McMaster , Joseph LaTorre , Logan L. Simpson
IPC分类号： G03F7/004 , G03F7/029 , G03F7/039 , H01L21/027 , H01L21/30 , H05K3/06 , G03F7/30 , G03F7/40
CPC分类号： G03F7/039 , G03F7/0045 , Y10S430/106 , Y10S430/111 , Y10S430/115
摘要： A positive acting photoresist comprising a film forming reactive polymer; an iodonium initiator or a non-ionic compound that generates triflic acid upon exposure to radiation; and a multifunctional organic carboxylic acid is provided as well as use thereof.
摘要翻译：包含成膜反应性聚合物的正性光致抗蚀剂; 碘鎓引发剂或在暴露于辐射时产生三氟甲磺酸的非离子化合物; 并提供多官能有机羧酸及其用途。

2. 发明授权

US5266444A Method and composition for obtaining image reversal in epoxy formulations based upon photoinhibition 失效
标题翻译：基于光抑制获得环氧树脂配方中的图像反转的方法和组合物
公开(公告)号：US5266444A
公开(公告)日：1993-11-30
申请号：US943075
申请日：1992-09-10
申请人： Burton J. Carpenter, Jr. , Joseph LaTorre , Michael G. McMaster , Logan L. Simpson
发明人： Burton J. Carpenter, Jr. , Joseph LaTorre , Michael G. McMaster , Logan L. Simpson
IPC分类号： G03F7/004 , G03F7/038 , G03F7/38 , C03C1/725
CPC分类号： G03F7/038 , G03F7/0045 , G03F7/38 , Y10S430/118
摘要： A method and composition are shown for producing a positive-acting photoimagible epoxy resin. In addition to the epoxy resin, the compositions include a dual component cross-linking system which combines a basic curing agent with an onium or arylonium salt. The onium or arylonium salt produces a protic acid upon exposure to irradiation causing a reaction with the basic curing agent which renders the agent ineffective as an epoxy curing agent during subsequent heating. During a subsequent bake operation, only the unexposed regions of the epoxy will cross-link. As a result, the exposed areas wash away, leaving only the cured reverse image.
摘要翻译：显示了用于制备正性光可氧化环氧树脂的方法和组合物。除了环氧树脂之外，组合物还包括将碱性固化剂与鎓盐或芳基鎓盐组合的双组分交联体系。鎓或芳基盐在暴露于照射时产生质子酸，引起与碱性固化剂的反应，其使得该试剂在随后的加热期间作为环氧固化剂无效。在随后的烘烤操作中，仅环氧树脂的未曝光区域将交联。结果，暴露的区域被洗掉，只剩下固化的反转图像。

3. 发明专利

GB856250A Improvements in and relating to nut and bolt fasteners 未知
公开(公告)号：GB856250A
公开(公告)日：1960-12-14
申请号：GB1404558
申请日：1958-05-02
申请人： JOSEPH LATORRE
IPC分类号： F16B35/04 , F16B39/282 , F16B39/284 , F16B39/30
摘要： 856,250. Making nuts and bolts. LA TORRE, J. May 2, 1958 [May 6, 1957], No. 14045/58. Classes 83 (2) and 83 (4). [Also in Group XXV] A nut comprises a tubular body 21 with a locking portion 22 at one end and a workengaging flange 23 at the other, the flangebearing face 43 being frusto-conical. The locking portion is swayed inwardly to constrict the threads increasingly towards the nut end. In use, as face 43 is clamped against a workpiece 11, the flange deflects to reduce the loading on the leading threads 24 . The flanged end of bore 24 has a counterbore 25 to aid in aligning the nut on a bolt 13, which has a dimpled head 20 and wrench-engaging means, e.g. a hexagonal socket 16 at the free end. The plain shank of the bolt is slightly larger than the screwed part, and may be an interference fit in the work. The nut is forged to the shape shown in Fig. 5, then bored and screwed, and finally swaged in a die 36. The movement of the die stops when end 39 abuts surface 35. The bolt is forged by cold-heading, the tip is bored, and the socket is then formed by broaching. Alternatively, the socket may be formed in the forging operation.

4. 发明专利

GB761149A Improvements in or relating to blind screw and nut fasteners 未知
公开(公告)号：GB761149A
公开(公告)日：1956-11-14
申请号：GB3512953
申请日：1953-12-17
申请人： JOSEPH LATORRE
IPC分类号： F16B19/10
摘要： 761,149. Bolts; rivets; locking nuts. LA TORRE, J. Dec. 17, 1953, No. 35129/53. Class 89 (1). [Also in Group XXIII] A fastener for insertion and clinching from one side of a workpiece comprises a bolt 10, Fig. 1, having a head 23, a threaded shank 24 and a stem 25, there being a groove 28 between the head and shank and the head having a conical undercut 27, a nut 11 threaded on the shank and having a head 17 and an internallythreaded cylindrical sleeve 18 terminating in a conical portion 19, and a ductile collar 12 surrounding the bolt and interposed between the portion 19 and head 23. Stem 25 has wrench-engaging flats and head 17 has radial slots 22, whereby either the nut or bolt may be rotated while the other is held stationary, after the fastener has been inserted through aligned holes, e.g. in workpieces 15, 16. As the bolt moves into the nut, portion 19 expands the collar until one end abuts the work 15, Fig. 3. and the other end is turned into a groove 28 to prevent relative unscrewing movement between the nut and bolt. Portion 19 is also deformed into groove 28, more or less according to the length of the fastener in relation to the thickness of the workpieces, to additionally lock the parts together. In another arrangement, the nut head is not countersunk and has a polygonal periphery.

5. 发明授权

US5374500A Positive photoresist composition containing photoacid generator and use thereof 失效
标题翻译：含有光致酸发生剂的正性光致抗蚀剂组合物及其用途
公开(公告)号：US5374500A
公开(公告)日：1994-12-20
申请号：US41460
申请日：1993-04-02
申请人： Burton J. Carpenter, Jr. , Michael G. McMaster , Joseph LaTorre , Logan L. Simpson
发明人： Burton J. Carpenter, Jr. , Michael G. McMaster , Joseph LaTorre , Logan L. Simpson
IPC分类号： G03F7/004 , G03F7/029 , G03F7/039 , H01L21/027 , H01L21/30 , H05K3/06 , C03C1/492
CPC分类号： G03F7/039 , G03F7/0045 , Y10S430/106 , Y10S430/111 , Y10S430/115
摘要： A positive acting photoresist comprising a film forming reactive polymer; an iodonium initiator or a non-ionic compound that generates triflic acid upon exposure to radiation; and a multifunctional organic carboxylic acid is provided as well as use thereof.
摘要翻译：包含成膜反应性聚合物的正性光致抗蚀剂; 碘鎓引发剂或在暴露于辐射时产生三氟甲磺酸的非离子化合物; 并提供多官能有机羧酸及其用途。

6. 发明授权

US5279711A Chip attach and sealing method 失效
标题翻译：芯片贴附和密封方法
公开(公告)号：US5279711A
公开(公告)日：1994-01-18
申请号：US724246
申请日：1991-07-01
申请人： Jerome A. Frankeny , Richard F. Frankeny , Joseph LaTorre
发明人： Jerome A. Frankeny , Richard F. Frankeny , Joseph LaTorre
IPC分类号： H01L21/56 , H01L21/60 , H01L23/31 , H05K3/34 , H05K3/40 , H05K1/00
CPC分类号： H01L24/81 , H01L21/56 , H01L23/3157 , H01L24/75 , H01L2224/16 , H01L2224/16237 , H01L2224/743 , H01L2224/75 , H01L2224/8014 , H01L2224/81136 , H01L2224/8114 , H01L2224/81191 , H01L2224/81801 , H01L2924/01033 , H01L2924/01076 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H05K3/3431 , H05K3/4007
摘要： A method of fabricating a substrate module is provided that includes cavities of a diameter and depth which take into account the statistical variance in the dimensions of C4 solder balls. By constructing cavities with the proper dimensions, electrical connection between the chip and substrate, via the solder balls, can be ensured. Further, an annular shoulder is provided which acts as a positive stop to prevent any over travel of the C4s within the cavity, thereby allowing a great deal more pressure to be applied to seat the chip than possible with conventional methods. The present invention also provides processes for applying a coating of material onto the substrate which acts as an adhesive and sealant. This material is provided intermediate any of the holes or cavities (vias) which may be contained within the substrate, and is not deposited in these vias such that no interference is encountered when attaching the chip by way of the C4 solder balls thereon. Chips, or additional substrate layers are then placed onto the substrate, thereby forming a sealed integrated circuit module, which has adhesive between the chip and carrier layers.
摘要翻译：提供了一种制造基板模块的方法，其包括直径和深度的空腔，其考虑到C4焊球的尺寸的统计差异。通过构造具有适当尺寸的空腔，可以确保芯片和衬底之间通过焊球的电连接。此外，提供了环形肩部，其作为止挡件，以防止C4内部空腔内的任何过度行进，从而允许施加大量更多的压力以将传统方法设置为可能。本发明还提供将材料涂层施加到作为粘合剂和密封剂的基材上的方法。该材料位于可以包含在基板内的任何孔或空穴（通孔）中，并且不沉积在这些通孔中，使得当通过C4焊球在其上附接芯片时不会遇到干扰。然后将芯片或附加的衬底层放置在衬底上，从而形成密封的集成电路模块，其在芯片和载体层之间具有粘合剂。

7. 发明授权

US5272042A Positive photoresist system for near-UV to visible imaging 失效
标题翻译：用于近紫外到可见成像的正性光致抗蚀剂系统
公开(公告)号：US5272042A
公开(公告)日：1993-12-21
申请号：US761183
申请日：1991-09-17
申请人： Robert D. Allen , William R. Brunsvold , Burton J. Carpenter , William D. Hinsberg , Joseph LaTorre , Michael G. McMaster , Melvin W. Montgomery , Wayne M. Moreau , Logan L. Simpson , Robert J. Tweig , Gregory M. Wallraff
发明人： Robert D. Allen , William R. Brunsvold , Burton J. Carpenter , William D. Hinsberg , Joseph LaTorre , Michael G. McMaster , Melvin W. Montgomery , Wayne M. Moreau , Logan L. Simpson , Robert J. Tweig , Gregory M. Wallraff
IPC分类号： G03F7/004 , G03F7/038 , G03F7/039 , H01L21/027 , H01L21/30 , G03C1/73
CPC分类号： G03F7/039 , Y10S430/111 , Y10S430/121 , Y10S430/122 , Y10S430/126 , Y10S430/127
摘要： Disclosed is a positive photoresist. The photoresist has as its polymeric component a substantially water and base insoluble, photolabile polymer. The photoresist further includes a photo acid generator that is capable of forming a strong acid. This photo acid generator may be a sulfonate ester derived from a N-hydroxyamide, or a N-hydroxyimide. Finally, the photoresist composition includes an appropriate photosensitizer.
摘要翻译：公开了一种正性光致抗蚀剂。光致抗蚀剂具有基本上水和碱不溶性的光不稳定聚合物作为其聚合物组分。光致抗蚀剂还包括能够形成强酸的光酸产生剂。该光酸产生剂可以是衍生自N-羟基酰胺或N-羟基酰亚胺的磺酸酯。最后，光致抗蚀剂组合物包括适当的光敏剂。

8. 发明授权

US5198693A Aperture formation in aluminum circuit card for enhanced thermal dissipation 失效
标题翻译：铝电路卡中的孔径形成用于增强散热
公开(公告)号：US5198693A
公开(公告)日：1993-03-30
申请号：US831855
申请日：1992-02-05
申请人： Ronald L. Imken , Joseph LaTorre
发明人： Ronald L. Imken , Joseph LaTorre
IPC分类号： B42D15/10 , G06K19/077 , H01L23/12 , H01L23/373 , H01L23/40 , H05K1/02 , H05K1/05 , H05K1/18 , H05K3/00 , H05K3/44 , H05K7/20
CPC分类号： H05K1/0204 , H01L23/3735 , H01L23/4006 , H05K1/021 , H01L2023/4043 , H01L2023/4062 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01078 , H01L2924/14 , H01L2924/19041 , H05K1/053 , H05K1/182 , H05K2201/09054 , H05K2203/0315 , H05K2203/049 , H05K2203/135
摘要： A method and system are provided for forming apertures in the dielectric layers of an aluminum circuit to allow electrical connection to the aluminum core and enhance the thermal efficiency of integrated circuit devices attached thereto. Specifically, the apertures are formed to accommodate the ICs and allow them to be in direct contact with the aluminum core layer of the circuit card. The apertures are formed by placing a photoresist material on the aluminum core in locations corresponding to the desired locations of the aperture. The photoresist material is used as a "placeholder" during subsequent processing. The aluminum is then anodized to form aluminum oxide and a polymer material is then electrophoretically placed over the aluminum oxide. The photoresist "placeholder" is then removed, leaving an aperture that will accommodate an IC. The top of the polymer layer can then be circuitized to interconnect the chips.
摘要翻译：提供了一种用于在铝电路的电介质层中形成孔的方法和系统，以允许与铝芯的电连接并增强与其连接的集成电路器件的热效率。具体地，形成孔以容纳IC并允许它们与电路卡的铝芯层直接接触。通过将光致抗蚀剂材料放置在对应于孔的所需位置的位置的铝芯上而形成孔。光致抗蚀剂材料在后续处理中被用作“占位符”。然后将铝阳极氧化以形成氧化铝，然后将聚合物材料电泳放置在氧化铝上。然后去除光致抗蚀剂“占位符”，留下将容纳IC的孔。然后可以将聚合物层的顶部电路化以使芯片互连。

9. 发明授权

US5146674A Manufacturing process of a high density substrate design 失效
标题翻译：高密度基板设计的制造工艺
公开(公告)号：US5146674A
公开(公告)日：1992-09-15
申请号：US724245
申请日：1991-07-01
申请人： Richard F. Frankeny , Karl Hermann , Ronald L. Imken , Joseph LaTorre
发明人： Richard F. Frankeny , Karl Hermann , Ronald L. Imken , Joseph LaTorre
IPC分类号： H01L21/48 , H01L23/538 , H05K3/00 , H05K3/20 , H05K3/42 , H05K3/44 , H05K3/46
CPC分类号： H05K3/462 , H01L21/4857 , H01L23/5383 , H05K3/445 , H01L2924/0002 , H05K2201/09318 , H05K2201/09554 , H05K2201/09563 , H05K2203/0152 , H05K2203/066 , H05K2203/0733 , H05K3/0023 , H05K3/205 , H05K3/423 , H05K3/4641 , H05K3/4647 , Y10T29/49126 , Y10T29/49156
摘要： Substrate layers with individual bumps and cavities are provided which can be manufactured and tested in parallel and then joined into a multilayer substrate. The method of manufacturing these layers, as contemplated by the present invention, includes initially forming a plurality of vias in a layer of electrically conductive material. Next, a dielectric material, is placed adjacent the layer of conductive material. Holes which are coaxial with the vias are then formed in the dielectric material. Electrically conductive material is then deposited within the vias, thereby forming a conductive stud. Additional electrically conductive material is then deposited, on the side of the dielectric opposite the conductive material to form a signal layer, as well projections of electrically conductive material extending from the studs. A continuous layer of dielectric material is then placed adjacent the side of the substrate opposite the projections. A portion of this layer, adjacent the stud, is then removed, thereby exposing the stud and forming a cavity. The substrate layers can then be joined to form a multilayer substrate module.
摘要翻译：提供具有单独凸块和空腔的基板层，其可以并联制造和测试，然后连接到多层基板中。如本发明所设想的制造这些层的方法包括最初在导电材料层中形成多个通孔。接下来，将电介质材料放置在邻近导电材料层的位置。然后在电介质材料中形成与通孔同轴的孔。然后将导电材料沉积在通孔内，从而形成导电柱。然后在电介质的与导电材料相对的一侧上沉积附加的导电材料以形成信号层，以及从螺柱延伸的导电材料的突起。然后将连续的介电材料层放置成与衬底相对的与突起相对的一侧。然后去除邻近螺柱的该层的一部分，从而暴露螺柱并形成空腔。然后可以将衬底层接合以形成多层衬底模块。

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