![METHOD OF FABRICATING THIN FILM TRANSISTOR](/abs-image/US/2012/07/05/US20120171823A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: METHOD OF FABRICATING THIN FILM TRANSISTOR
- 专利标题(中):薄膜晶体管的制作方法
- 申请号:US13419757 申请日:2012-03-14
- 公开(公告)号:US20120171823A1 公开(公告)日:2012-07-05
- 发明人: Ji-Su Ahn , Eui-Hoon Hwang , Cheol-Ho Yu , Kwang-Nam Kim , Sung-Chul Kim
- 申请人: Ji-Su Ahn , Eui-Hoon Hwang , Cheol-Ho Yu , Kwang-Nam Kim , Sung-Chul Kim
- 申请人地址: KR Yongin-City
- 专利权人: SAMSUNG MOBILE DISPLAY CO., LTD.
- 当前专利权人: SAMSUNG MOBILE DISPLAY CO., LTD.
- 当前专利权人地址: KR Yongin-City
- 优先权: KR10-2008-0064000 20080702
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A thin film transistor (TFT), including a crystalline semiconductor pattern on a substrate, a gate insulating layer on the crystalline semiconductor pattern, the gate insulating layer having two first source/drain contact holes and a semiconductor pattern access hole therein, a gate electrode on the gate insulating layer, the gate electrode being between the two first source/drain contact holes, an interlayer insulating layer covering the gate electrode, the interlayer insulating layer having two second source/drain contact holes therein, and source and drain electrodes on the interlayer insulating layer, each of the source and drain electrodes being insulated from the gate electrode, and having a portion connected to the crystalline semiconductor pattern through the first and second source/drain contact holes.
摘要(中):
一种薄膜晶体管(TFT),包括在基板上的晶体半导体图形,在晶体半导体图案上的栅极绝缘层,栅极绝缘层具有两个第一源极/漏极接触孔和半导体图案访问孔,栅电极 在栅极绝缘层上,栅电极位于两个第一源极/漏极接触孔之间,覆盖栅电极的层间绝缘层,其中具有两个第二源极/漏极接触孔的层间绝缘层,以及栅电极上的源极和漏极 层间绝缘层,源极和漏极中的每一个与栅电极绝缘,并且具有通过第一和第二源极/漏极接触孔连接到晶体半导体图案的部分。
公开/授权文献:
- US08420513B2 Method of fabricating thin film transistor 公开/授权日:2013-04-16
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料 |
--------------H01L21/26 | ....用波或粒子辐射轰击的 |
----------------H01L21/335 | .....场效应晶体管 |
------------------H01L21/336 | ......带有绝缘栅的 |