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1. 发明授权

US06709949B2 Method for aligning structures on a semiconductor substrate 失效
标题翻译：用于对准半导体衬底上的结构的方法
公开(公告)号：US06709949B2
公开(公告)日：2004-03-23
申请号：US10277127
申请日：2002-10-21
申请人： Holger Hübner
发明人： Holger Hübner
IPC分类号： H01L2176
CPC分类号： H01L25/50 , H01L25/0657 , H01L2225/06593 , H01L2924/0002 , Y10S438/975 , H01L2924/00
摘要： In the three-dimensional integration of integrated circuits, a thinned semiconductor substrate is arranged on a second semiconductor substrate and is mechanically and electrically connected thereto. To that end, in the second, thinned semiconductor substrate, continuous contact holes are formed proceeding from a substrate rear side as far as a first metal wiring plane on a substrate front side. In order to align the contact holes with the structures arranged on the front side, a structure is arranged on the front side of the substrate, which can be used as an alignment mark on the front side. The structure is overgrown with a useful layer and uncovered proceeding from the rear side of the substrate, so that the structure can also be used as an alignment mark from the rear side. This avoids an alignment error between the structures arranged on the front side and the rear side.
摘要翻译：在集成电路的三维集成中，减薄的半导体衬底被布置在第二半导体衬底上并机械地和电连接到其上。为此，在第二个变薄的半导体衬底中，从衬底背面直到基片正面上的第一金属布线平面形成连续的接触孔。为了将接触孔与布置在前侧上的结构对准，在基板的正面设置有可以用作前侧的对准标记的结构。该结构被长满了有用的层，并且从衬底的后侧开始覆盖，使得该结构也可以用作来自后侧的对准标记。这避免了布置在前侧和后侧的结构之间的对准误差。

2. 发明申请

US20140291003A1 Connecting Element for a Multi-Chip Module and Multi-Chip Module 有权
标题翻译：多芯片模块和多芯片模块的连接元件
公开(公告)号：US20140291003A1
公开(公告)日：2014-10-02
申请号：US14237177
申请日：2012-08-03
申请人： Holger Hübner , Björn Hoxhold , Axel Kaltenbacher
发明人： Holger Hübner , Björn Hoxhold , Axel Kaltenbacher
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01L23/13 , H01L23/14 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/24011 , H01L2224/24101 , H01L2224/24137 , H01L2224/24155 , H01L2224/25171 , H01L2224/8203 , H01L2224/821 , H01L2224/96 , H01L2924/12041 , H01L2224/82 , H01L2924/00014 , H01L2924/00
摘要： A connecting element can be used for a multi-chip module. The connecting element is provided for establishing an electrical connection between two elements and has a carrier and a first electrically conductive connecting structure on a first main surface of the carrier. The first connecting structure is designed in such a way that the first connecting structure connects the first and second elements to each other. A multi-chip module can have such a connecting element and two elements, wherein the two elements are electrically connected to each other in a wireless manner by the connecting element.
摘要翻译：连接元件可用于多芯片模块。连接元件设置用于在两个元件之间建立电连接，并且在载体的第一主表面上具有载体和第一导电连接结构。第一连接结构被设计成使得第一连接结构将第一和第二元件彼此连接。多芯片模块可以具有这样的连接元件和两个元件，其中两个元件通过连接元件以无线方式彼此电连接。

3. 发明授权

US09301396B2 Connecting element for a multi-chip module and multi-chip module 有权
标题翻译：用于多芯片模块和多芯片模块的连接元件
公开(公告)号：US09301396B2
公开(公告)日：2016-03-29
申请号：US14237177
申请日：2012-08-03
申请人： Holger Hübner , Björn Hoxhold , Axel Kaltenbacher
发明人： Holger Hübner , Björn Hoxhold , Axel Kaltenbacher
IPC分类号： H05K1/11 , H05K1/18 , H01L23/00 , H01L23/13 , H01L23/14
CPC分类号： H05K1/181 , H01L23/13 , H01L23/14 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/24011 , H01L2224/24101 , H01L2224/24137 , H01L2224/24155 , H01L2224/25171 , H01L2224/8203 , H01L2224/821 , H01L2224/96 , H01L2924/12041 , H01L2224/82 , H01L2924/00014 , H01L2924/00
摘要： A connecting element can be used for a multi-chip module. The connecting element is provided for establishing an electrical connection between two elements and has a carrier and a first electrically conductive connecting structure on a first main surface of the carrier. The first connecting structure is designed in such a way that the first connecting structure connects the first and second elements to each other. A multi-chip module can have such a connecting element and two elements, wherein the two elements are electrically connected to each other in a wireless manner by the connecting element.
摘要翻译：连接元件可用于多芯片模块。连接元件设置用于在两个元件之间建立电连接，并且在载体的第一主表面上具有载体和第一导电连接结构。第一连接结构被设计成使得第一连接结构将第一和第二元件彼此连接。多芯片模块可以具有这样的连接元件和两个元件，其中两个元件通过连接元件以无线方式彼此电连接。

4. 发明授权

US06915945B2 Method for contact-connecting an electrical component to a substrate having a conductor structure 失效
标题翻译：将电气部件与具有导体结构的基板接触连接的方法
公开(公告)号：US06915945B2
公开(公告)日：2005-07-12
申请号：US10718775
申请日：2003-11-21
申请人： Holger Hübner
发明人： Holger Hübner
IPC分类号： H05K3/32 , H01L21/60 , H05K3/34 , B23K31/02 , B32B31/00
CPC分类号： H01L24/81 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/19043 , Y10T156/1002 , Y10T156/1089 , H01L2924/00
摘要： For the purpose of contact-connecting an electrical component, in particular a semiconductor component, on a substrate having a conductor structure, a joining temperature is chosen in such a way that the substrate, with a pressure being exerted on the electrical component, experiences a plastic deformation, with the result that the electrical component is pressed together with the conductor structure into the substrate in a positively locking manner. In order to produce the connection between the component and the substrate, use is preferably made of a thin diffusion solder layer which can be processed at temperatures lying below the melting point of the substrate.
摘要翻译：为了将电气部件特别是半导体部件接触连接到具有导体结构的基板上，接合温度被选择为使得施加在电气部件上的压力的基板经受塑性变形，结果电气部件与导体结构一起以正向锁定的方式被压在衬底中。为了产生部件和基板之间的连接，优选使用薄的扩散焊料层，其可以在低于基板的熔点的温度下进行加工。

5. 发明授权

US06872464B2 Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent 有权
标题翻译：用于扩散焊接工艺的焊接剂以及使用该焊剂制造焊接接头的方法
公开(公告)号：US06872464B2
公开(公告)日：2005-03-29
申请号：US10384311
申请日：2003-03-07
申请人： Holger Hübner , Vaidyanathan Kripesh
发明人： Holger Hübner , Vaidyanathan Kripesh
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , B23K35/30 , B23K35/34 , C22C13/00
CPC分类号： B23K35/26 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/30 , B23K35/34 , Y10T428/12028 , Y10T428/12063 , Y10T428/1209 , Y10T428/12111 , Y10T428/12139
摘要： A soldering agent for use in diffusion soldering processes contains, in a soldering paste, a mixture of at least partially metallic grains of a high-melting metal and a solder metal. In a diffusion soldering process, the solder metal reacts completely with the high-melting metal and metals belonging to parts that are to be joined to one another by the soldering process, to form an intermetallic phase.
摘要翻译：用于扩散焊接工艺的焊剂在焊膏中含有至少部分高熔点金属的金属颗粒和焊料金属的混合物。在扩散焊接工艺中，焊料金属与属于要通过焊接工艺彼此接合的部件的高熔点金属和金属完全反应，以形成金属间相。

6. 发明授权

US06930383B2 Electronic component including a housing and a substrate 有权
标题翻译：电子部件，包括壳体和基板
公开(公告)号：US06930383B2
公开(公告)日：2005-08-16
申请号：US10320946
申请日：2002-12-16
申请人： Hans-Jürgen Hacke , Holger Hübner , Axel Königer , Max-Gerhard Seitz , Rainer Tilgner
发明人： Hans-Jürgen Hacke , Holger Hübner , Axel Königer , Max-Gerhard Seitz , Rainer Tilgner
IPC分类号： H01L21/48 , H01L21/60 , H01L21/603 , H01L23/498 , H01L21/00
CPC分类号： H01L23/4985 , H01L21/4857 , H01L23/49822 , H01L23/49838 , H01L24/81 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.
摘要翻译：本发明涉及一种电子部件，其包括壳体和具有至少一个集成电路的第一基板，在第一基板的表面上以任意分布布置的多个接触表面。第二基板形成壳体，并经由绝缘接合层以表面接触的方式机械连接到第一基板的表面。第二基板具有以导电方式表面到表面连接到第一基板的接触表面的接触连接表面。第二基板具有对称布置的外部接触表面，其通过第二基板中的通孔而导电地连接到接触连接表面。

7. 发明授权

US06597053B1 Integrated circuit arrangement with a number of structural elements and method for the production thereof 有权
标题翻译：具有许多结构元件的集成电路装置及其制造方法
公开(公告)号：US06597053B1
公开(公告)日：2003-07-22
申请号：US09403157
申请日：1999-10-15
申请人： Anton Anthofer , Holger Hübner
发明人： Anton Anthofer , Holger Hübner
IPC分类号： H01L31113
CPC分类号： H01L23/60 , H01L21/76264 , H01L21/76289 , H01L23/552 , H01L2224/16145 , H01L2924/1301 , H01L2924/1305 , H01L2924/00
摘要： An integrated circuit arrangement having a number of structural elements, at least one of which is surrounded by a metallic shielding structure. This structural element is thus protected against interference due to disturbing impulses from its environment. In particular, the structural elements of the circuit arrangement can be arranged next to or on top of one another. To produce the metallic shielding structure of a structural element of the circuit arrangement, at least one depression which surrounds the structural element is created and then lined with metal. The contacts and electrical connections of the structural element are electrically insulated from the metal of the shielding structure. To connect two structural elements within a three-dimensional circuit arrangement, the surfaces of the structural elements that face one another can be covered with two different metals, the alloy thereof having a melting point TS above the melting point T1 of at least one of the metals, so that heating to a temperature between the two melting points results in a permanent connection.
摘要翻译：一种具有多个结构元件的集成电路装置，其中至少一个由金属屏蔽结构包围。因此，该结构元件由于来自其环境的冲击而受到防止干扰。特别地，电路装置的结构元件可以被布置在彼此之上或之上。为了制造电路装置的结构元件的金属屏蔽结构，产生围绕结构元件的至少一个凹陷，然后用金属衬里。结构元件的触点和电连接与屏蔽结构的金属电绝缘。为了连接三维电路装置中的两个结构元件，相互面对的结构元件的表面可以被两种不同的金属覆盖，其合金的熔点TS高于至少一个的熔点T1 金属，使得加热到两个熔点之间的温度导致永久连接。

8. 发明授权

US06906370B1 Semiconductor component having a material reinforced contact area 失效
标题翻译：具有材料增强接触面积的半导体部件
公开(公告)号：US06906370B1
公开(公告)日：2005-06-14
申请号：US09685362
申请日：2000-10-10
申请人： Holger Hübner , Thomas Röhr
发明人： Holger Hübner , Thomas Röhr
IPC分类号： H01L21/768 , H01L21/8242 , H01L21/8246 , H01L23/522 , H01L27/108
CPC分类号： H01L23/5226 , H01L21/76895 , H01L27/10852 , H01L27/11507 , H01L2924/0002 , Y10S257/907 , H01L2924/00
摘要： A semiconductor component having a material-reinforced contact area formed of a metal layer is disclosed. The contact area is jointly formed by a second metal area of a first metal layer and a fourth metal area of a second metal layer which is to be contacted. A thickness of the contact area material is at least twice that of a single metal layer and thereby prevents penetrative etching when a hole is created for contacting the metal layer.
摘要翻译：公开了一种具有由金属层形成的材料增强的接触区域的半导体部件。接触区域由第一金属层的第二金属区域和待接触的第二金属层的第四金属区域共同形成。接触面积材料的厚度为单一金属层的厚度的至少两倍，从而防止当产生用于接触金属层的孔时的渗透蚀刻。

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