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1. 发明申请

US20100039128A1 Method and Apparatus for Detecting a Crack in a Semiconductor Wafer, and a Wafer Chuck 有权
标题翻译：用于检测半导体晶片中的裂纹的方法和装置以及晶片卡盘
公开(公告)号：US20100039128A1
公开(公告)日：2010-02-18
申请号：US12190745
申请日：2008-08-13
申请人： Alois Nitsch , Rainer Tilgner , Horst Baumeister
发明人： Alois Nitsch , Rainer Tilgner , Horst Baumeister
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01N29/14 , G01N29/223 , G01N2291/2697 , G01R31/2831 , G01R31/2853 , H01L22/12
摘要： A method for detecting a crack in a semiconductor wafer, which includes an electrical device and a connecting pad electrically coupled with the electrical device, is described. The crack is detected by an acoustic detector being acoustically coupled to the semiconductor wafer during contacting the contacting pad with a probe.
摘要翻译：描述了一种用于检测半导体晶片中的裂纹的方法，该方法包括电器件和与该电器件电连接的连接焊盘。在接触垫与探针接触期间，通过声学耦合到半导体晶片的声学检测器来检测裂纹。

2. 发明授权

US08244307B1 System allowing hands free use of a mobile phone in conjunction with a vehicle transceiver 有权
标题翻译：系统允许与车载收发器结合使用手机免费使用
公开(公告)号：US08244307B1
公开(公告)日：2012-08-14
申请号：US09568675
申请日：2000-05-11
申请人： Rainer Tilgner , Frank Dietrich
发明人： Rainer Tilgner , Frank Dietrich
IPC分类号： H44M1/00 , H04B1/034
CPC分类号： H04M1/6091 , B60R11/02 , B60R11/0241 , B60R11/0247 , B60R11/0264 , H04M2250/02
摘要： A communications system for a motor vehicle in which the hands-free device for a mobile phone is integrated into an audio or information system of the motor vehicle such as a car radio. The voice and/or data transmission between the mobile phone and the hands-free device takes place over an additional short-range radio link. A transceiver for this short-range radio link is contained both in the car radio and in the mobile phone. The need to install additional connection interfaces is thus eliminated. In addition, the need to couple the mobile phone to the hands-free device using a cable is eliminated. This has the advantage that the mobile phone can remain, for example, in the driver's pocket. The coupling between the mobile phone and car radio occurs automatically if the mobile phone moves into the range of the short-range radio link of the car radio.
摘要翻译：一种用于机动车辆的通信系统，其中将用于移动电话的免提装置集成到诸如汽车无线电的汽车的音频或信息系统中。移动电话和免提设备之间的语音和/或数据传输通过附加的短距离无线电链路进行。用于该短距离无线电链路的收发器包含在汽车收音机和移动电话中。因此，消除了安装附加连接接口的需要。此外，消除了使用电缆将手机耦合到免提装置的需要。这具有移动电话可以保持在例如驾驶员口袋中的优点。如果移动电话移动到无线电广播的短距离无线电链路的范围内，则手机和汽车收音机之间的耦合将自动发生。

3. 发明授权

US06930383B2 Electronic component including a housing and a substrate 有权
标题翻译：电子部件，包括壳体和基板
公开(公告)号：US06930383B2
公开(公告)日：2005-08-16
申请号：US10320946
申请日：2002-12-16
申请人： Hans-Jürgen Hacke , Holger Hübner , Axel Königer , Max-Gerhard Seitz , Rainer Tilgner
发明人： Hans-Jürgen Hacke , Holger Hübner , Axel Königer , Max-Gerhard Seitz , Rainer Tilgner
IPC分类号： H01L21/48 , H01L21/60 , H01L21/603 , H01L23/498 , H01L21/00
CPC分类号： H01L23/4985 , H01L21/4857 , H01L23/49822 , H01L23/49838 , H01L24/81 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.
摘要翻译：本发明涉及一种电子部件，其包括壳体和具有至少一个集成电路的第一基板，在第一基板的表面上以任意分布布置的多个接触表面。第二基板形成壳体，并经由绝缘接合层以表面接触的方式机械连接到第一基板的表面。第二基板具有以导电方式表面到表面连接到第一基板的接触表面的接触连接表面。第二基板具有对称布置的外部接触表面，其通过第二基板中的通孔而导电地连接到接触连接表面。

4. 发明授权

US06653732B2 Electronic component having a semiconductor chip 有权
标题翻译：具有半导体芯片的电子部件
公开(公告)号：US06653732B2
公开(公告)日：2003-11-25
申请号：US09850587
申请日：2001-05-07
申请人： Peter Alpern , Thomas Herzog , Wolfgang Sauert , Heinz Schauer , Rainer Tilgner
发明人： Peter Alpern , Thomas Herzog , Wolfgang Sauert , Heinz Schauer , Rainer Tilgner
IPC分类号： H01L2348
CPC分类号： H01L23/522 , H01L22/26 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.
摘要翻译：电子部件包括半导体芯片和/或测试结构。半导体芯片包括具有至少一个互连层，至少一个绝缘层和至少一个平坦化层的多层涂层。还公开了一种制造该组件的方法。在平坦化层中设置嵌入的粘附区域，由此粘附区域向相邻的绝缘层提供粘附表面。

5. 发明授权

US07973547B2 Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck 有权
标题翻译：用于检测半导体晶片中的裂纹的方法和装置以及晶片卡盘
公开(公告)号：US07973547B2
公开(公告)日：2011-07-05
申请号：US12190745
申请日：2008-08-13
申请人： Alois Nitsch , Rainer Tilgner , Horst Baumeister
发明人： Alois Nitsch , Rainer Tilgner , Horst Baumeister
IPC分类号： G01R31/308
CPC分类号： G01N29/14 , G01N29/223 , G01N2291/2697 , G01R31/2831 , G01R31/2853 , H01L22/12
摘要： A method for detecting a crack in a semiconductor wafer, which includes an electrical device and a connecting pad electrically coupled with the electrical device, is described. The crack is detected by an acoustic detector being acoustically coupled to the semiconductor wafer during contacting the contacting pad with a probe.
摘要翻译：描述了一种用于检测半导体晶片中的裂纹的方法，该方法包括电器件和与该电器件电连接的连接焊盘。在接触垫与探针接触期间，通过声学耦合到半导体晶片的声学检测器来检测裂纹。

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