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1. 发明授权

US08323075B2 Polishing head, polishing apparatus and method for demounting workpiece 有权
标题翻译：抛光头，抛光装置和拆卸工件的方法
公开(公告)号：US08323075B2
公开(公告)日：2012-12-04
申请号：US12734119
申请日：2007-11-21
申请人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
发明人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B5/00 , B24B41/06
CPC分类号： B24B37/30 , B24B37/345 , Y10T29/49826
摘要： A polishing head having a disklike carrier in which an annular projecting portion and a carrier-engagement portion are formed in a peripheral portion, a disklike head body in which a head-body-engagement portion is formed outside, a diaphragm for connecting the head body with the carrier, a spacer located between the carrier-engagement portion and the head-body-engagement portion in a part of the carrier-engagement portion and/or the head-body-engagement portion, in which the spacer abuts on the carrier-engagement portion and/or the head-body-engagement portion at the time of lifting the head body so that the workpiece is demounted from the polishing pad by lifting the carrier with it inclined. As a result, there is provided a polishing head in which the workpiece can be easily, safely and surely demounted from the polishing pad by lifting the polishing head holding the workpiece without overhanging the polishing head from the turn table and the like.
摘要翻译：一种抛光头，其具有圆盘状载体，其中环形突出部分和载体接合部分形成在周边部分中，盘状头体，其中头部体接合部分形成在外部;光阑，用于连接头部主体在载体接合部分和头部本体接合部分之间的间隔件位于载体接合部分和/或头部本体接合部分的一部分中，间隔件邻接在载体接合部分上，在抬起头部本体时使接合部和/或头体接合部通过使其倾斜地抬起托架而使抛光垫从抛光垫上拆下。结果，提供了一种研磨头，其中通过提起保持工件的抛光头而不会使抛光头从转台等悬垂，从而可以从抛光垫容易地，安全地和可靠地拆卸工件。

2. 发明申请

US20100291838A1 POLISHING HEAD AND POLISHING APPARATUS HAVING THE SAME 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US20100291838A1
公开(公告)日：2010-11-18
申请号：US12733535
申请日：2008-10-20
申请人： Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
发明人： Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
IPC分类号： B24B49/00 , B24B37/04 , B24B7/22 , B24B41/06
CPC分类号： B24B37/30 , B24B41/06
摘要： The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.
摘要翻译：本发明是一种研磨头，其中橡胶膜形成为靴形，其中橡胶膜由中间板保持的位置远离工件保持部分; 靴形橡胶膜的端部形成为O形环，使得橡胶膜由中间板保持，尽可能地减小中间板和橡胶膜之间的接触面积。结果，提供了一种具有橡胶卡盘方法的抛光头，其中尽可能地抑制了在工件的表面上发生诸如划痕的表面缺陷，并且可以将工件均匀且稳定地抛光到外围。

3. 发明授权

US06692341B2 Abrasive machine 有权
标题翻译：磨料机
公开(公告)号：US06692341B2
公开(公告)日：2004-02-17
申请号：US10136578
申请日：2002-04-25
申请人： Hiromi Kishida , Yoshio Nakamura , Susumu Onishi
发明人： Hiromi Kishida , Yoshio Nakamura , Susumu Onishi
IPC分类号： B24B722
CPC分类号： B24B45/00 , B24B7/228
摘要： The abrasive machine of the present invention is capable of controlling a shape of an abrasive face of a small abrasive plate. The abrasive machine comprises: a plate holder holding an abrasive plate; a fixed engaging member being fixed to the plate holder and engaging with the abrasive plate; a first O-ring being provided between the fixed engaging member and the abrasive plate; a second O-ring being provided between the plate holder and the abrasive plate; and a fluid supply-discharge mechanism for supplying a fluid to and discharging the same from a zone enclosed by the abrasive plate, the plate holder and the second O-ring. An outer circumferential face of the abrasive plate is separated from an inner circumferential face of the fixed engaging member.
摘要翻译：本发明的研磨机能够控制小型研磨板的研磨面的形状。研磨机包括：保持研磨板的板夹; 固定的接合构件固定到所述板保持器并与所述研磨板接合; 第一O形环设置在固定接合构件和研磨板之间; 第二O形环设置在板支架和研磨板之间; 以及流体供给 - 排出机构，用于从由研磨板，板保持器和第二O形环包围的区域提供流体并将其排出。研磨板的外周面与固定接合构件的内周面分离。

4. 发明授权

US08092281B2 Polishing head and polishing apparatus 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US08092281B2
公开(公告)日：2012-01-10
申请号：US12311690
申请日：2007-10-18
申请人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
发明人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B5/35
CPC分类号： B24B37/30
摘要： The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the template is 26% or more and 45% or less. Thereby, a polishing head and the like that can obtain constant flatness stably can be provided.
摘要翻译：本发明是一种抛光头，其具有环形刚性环，橡胶膜以均匀的张力粘合到刚性环上，中间板与刚性环接合并与橡胶膜和刚性环一起形成空间部分，以及环形模板，其与所述刚性环同心地设置在所述橡胶膜的下表面部分上的周边部分中，并且具有大于所述刚性环的内径的外径，其中所述空间部分的压力可以通过压力调节机构，工件的背面被保持在橡胶膜的下表面部分上，并且工件的表面与附着在用于抛光的转台上的抛光垫滑动接触，并且内部模板的直径小于刚性环的内径，刚性环与模板之间的内径差与内径与外径之间的差模板的直径为26％以上且45％以下。由此，可以提供能够稳定地获得恒定的平坦度的抛光头等。

5. 发明授权

US09278425B2 Polishing head and polishing apparatus 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US09278425B2
公开(公告)日：2016-03-08
申请号：US13522370
申请日：2011-01-20
申请人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
发明人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B37/30 , B24B37/32 , H01L21/02
CPC分类号： B24B37/30 , B24B37/32 , H01L21/02024
摘要： A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.
摘要翻译：一种抛光头，其包括在抛光头本体下面的由盘形中间板保持的橡胶膜和设置在橡胶膜周围的橡胶膜周围的环形引导环，橡胶膜在橡胶膜的下表面部分上保持工件的后表面。抛光头还包括通过弹性膜联接到抛光头本体并且保持引导环和中间板的基部构件，使得在抛光期间导向环的下表面不接触抛光垫。抛光头和抛光装置可以在粗抛光工艺和最终抛光工艺中操作，可以稳定地实现工件抛光中预定的高平整度和高抛光余料去除均匀性，并且可以获得具有更少的具有直径为45nm以上。

6. 发明授权

US08021210B2 Polishing head and polishing apparatus having the same 有权
标题翻译：具有相同的抛光头和抛光装置
公开(公告)号：US08021210B2
公开(公告)日：2011-09-20
申请号：US12733535
申请日：2008-10-20
申请人： Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
发明人： Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B41/06
摘要： The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.
摘要翻译：本发明是一种研磨头，其中橡胶膜形成为靴形，其中橡胶膜由中间板保持的位置远离工件保持部分; 靴形橡胶膜的端部形成为O形环，使得橡胶膜由中间板保持，尽可能地减小中间板和橡胶膜之间的接触面积。结果，提供了一种具有橡胶卡盘方法的抛光头，其中尽可能地抑制了在工件的表面上发生诸如划痕的表面缺陷，并且可以将工件均匀且稳定地抛光到外围。

7. 发明申请

US20050221733A1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US20050221733A1
公开(公告)日：2005-10-06
申请号：US11088191
申请日：2005-03-23
申请人： Tadakazu Miyashita , Hiromi Kishida
发明人： Tadakazu Miyashita , Hiromi Kishida
IPC分类号： B24B37/005 , B24B37/30 , B24B37/32 , B24B49/16 , H01L21/304 , B24B5/00
CPC分类号： B24B49/16 , B24B37/30
摘要： The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid into a first fluid chamber and pressing a main head section downward; second pressing means for introducing a pressurized fluid into a second fluid chamber and pressing a press plate downward; and third pressing means for introducing a pressurized fluid into a third fluid chamber and pressing the workpiece downward. With this structure, the workpiece is held on the lower side of an elastic sheet member, and the lower face of the workpiece can be polished by a polishing plate.
摘要翻译：抛光装置能够精确地控制抛光压力，正确定位压板并均匀抛光工件。在抛光装置中，保持头包括：第一加压装置，用于将加压流体引入第一流体室并向下按压主头部; 第二加压装置，用于将加压流体引入第二流体室并向下按压压板; 以及用于将加压流体引入第三流体室并向下按压工件的第三加压装置。利用这种结构，工件被保持在弹性片构件的下侧，并且工件的下表面可以通过抛光板进行抛光。

8. 发明申请

US20110070813A1 METHOD FOR MANUFACTURING POLISHING HEAD AND POLISHING APPARATUS 审中-公开
标题翻译：制造抛光头和抛光装置的方法
公开(公告)号：US20110070813A1
公开(公告)日：2011-03-24
申请号：US12992782
申请日：2009-06-02
申请人： Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
发明人： Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B41/00 , B24D18/00
CPC分类号： B24B37/32 , B24B37/042 , B24B37/24
摘要： A method for manufacturing a polishing head having an annular rigid ring; a rubber film bonded to the rigid ring with uniform tension; a mid plate joined to the rigid ring, forming a space together with the rubber film and the rigid ring; and a mechanism for changing pressure of the space, the method including performing a tensile test on the rubber film according to JIS K6251 before bonding the rubber film to the rigid ring, and selecting the rubber film having a value of 10 MPa or less of an inclination obtained by a linear approximation of a stress-strain curve within a strain value of 5%; and bonding the selected rubber film having a value of 10 MPa or less of the inclination to the rigid ring to manufacture the polishing head.
摘要翻译：一种用于制造具有环形刚性环的抛光头的方法; 橡胶膜与刚性环结合，张力均匀; 连接到刚性环的中间板，与橡胶膜和刚性环一起形成空间; 以及用于改变空间压力的机构，所述方法包括在将橡胶膜粘合到刚性环之前根据JIS K6251在橡胶膜上进行拉伸试验，并且选择值为10MPa以下的橡胶膜通过在应变值5％内的应力 - 应变曲线的线性近似获得的倾斜度; 并将所述倾斜度为10MPa以下的所选橡胶膜与所述刚性环接合，制造所述研磨头。

9. 发明申请

US20100210192A1 POLISHING HEAD AND POLISHING APPARATUS 审中-公开
标题翻译：抛光头和抛光装置
公开(公告)号：US20100210192A1
公开(公告)日：2010-08-19
申请号：US12682458
申请日：2007-11-20
申请人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
发明人： Hisashi Masumura , Koji Kitagawa , Kouji Morita , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B7/00
CPC分类号： B24B37/30 , B24B41/002 , B24B57/02
摘要： The present invention is a polishing head having at least: an approximately discoid mid plate; a rubber film covering at least a lower face portion and a side face portion of the mid plate; and a space portion surrounded by the mid plate and the rubber film; in which pressure of the space portion can be changed by a pressure adjustment mechanism, a back surface of a workpiece is held on a lower face portion of the rubber film and a front surface of the workpiece is brought into sliding contact with a polishing pad attached onto a turn table for performing polishing; wherein the mid plate and the rubber film do not contact one another to have a gap at least throughout a whole of the lower face portion of the mid plate. As a result, there is provided a polishing head etc by a rubber chuck method in which a uniform polishing load is applied over the workpiece without influence of stiffness or flatness of the mid plate.
摘要翻译：本发明是至少具有：近似盘状的中间板的抛光头; 覆盖所述中间板的至少下表面部分和侧面部分的橡胶膜; 以及由中间板和橡胶膜包围的空间部分; 其中空间部分的压力可以通过压力调节机构改变，工件的后表面被保持在橡胶膜的下表面部分上，并且工件的前表面与附接的抛光垫滑动接触在转台上进行抛光; 其中中间板和橡胶膜彼此不接触以至少在整个中板的下表面部分中具有间隙。结果，通过橡胶卡盘方法提供了抛光头等，其中在工件上施加均匀的研磨载荷而不影响中间板的刚度或平坦度。

10. 发明授权

US07247083B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US07247083B2
公开(公告)日：2007-07-24
申请号：US11088191
申请日：2005-03-23
申请人： Tadakazu Miyashita , Hiromi Kishida
发明人： Tadakazu Miyashita , Hiromi Kishida
IPC分类号： B24B1/00
CPC分类号： B24B49/16 , B24B37/30
摘要： The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid into a first fluid chamber and pressing a main head section downward; second pressing means for introducing a pressurized fluid into a second fluid chamber and pressing a press plate downward; and third pressing means for introducing a pressurized fluid into a third fluid chamber and pressing the workpiece downward. With this structure, the workpiece is held on the lower side of an elastic sheet member, and the lower face of the workpiece can be polished by a polishing plate.
摘要翻译：抛光装置能够精确地控制抛光压力，正确定位压板并均匀抛光工件。在抛光装置中，保持头包括：第一加压装置，用于将加压流体引入第一流体室并向下按压主头部; 第二加压装置，用于将加压流体引入第二流体室并向下按压压板; 以及用于将加压流体引入第三流体室并向下按压工件的第三加压装置。利用这种结构，工件被保持在弹性片构件的下侧，并且工件的下表面可以通过抛光板进行抛光。

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