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1. 发明申请

US20110070813A1 METHOD FOR MANUFACTURING POLISHING HEAD AND POLISHING APPARATUS 审中-公开
标题翻译：制造抛光头和抛光装置的方法
公开(公告)号：US20110070813A1
公开(公告)日：2011-03-24
申请号：US12992782
申请日：2009-06-02
申请人： Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
发明人： Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B41/00 , B24D18/00
CPC分类号： B24B37/32 , B24B37/042 , B24B37/24
摘要： A method for manufacturing a polishing head having an annular rigid ring; a rubber film bonded to the rigid ring with uniform tension; a mid plate joined to the rigid ring, forming a space together with the rubber film and the rigid ring; and a mechanism for changing pressure of the space, the method including performing a tensile test on the rubber film according to JIS K6251 before bonding the rubber film to the rigid ring, and selecting the rubber film having a value of 10 MPa or less of an inclination obtained by a linear approximation of a stress-strain curve within a strain value of 5%; and bonding the selected rubber film having a value of 10 MPa or less of the inclination to the rigid ring to manufacture the polishing head.
摘要翻译：一种用于制造具有环形刚性环的抛光头的方法; 橡胶膜与刚性环结合，张力均匀; 连接到刚性环的中间板，与橡胶膜和刚性环一起形成空间; 以及用于改变空间压力的机构，所述方法包括在将橡胶膜粘合到刚性环之前根据JIS K6251在橡胶膜上进行拉伸试验，并且选择值为10MPa以下的橡胶膜通过在应变值5％内的应力 - 应变曲线的线性近似获得的倾斜度; 并将所述倾斜度为10MPa以下的所选橡胶膜与所述刚性环接合，制造所述研磨头。

2. 发明授权

US08636561B2 Polishing head and polishing apparatus 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US08636561B2
公开(公告)日：2014-01-28
申请号：US13056249
申请日：2009-08-07
申请人： Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
发明人： Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B37/04 , H01L21/304
CPC分类号： B24B37/30
摘要： A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.
摘要翻译：抛光工件的抛光头，抛光工件的表面和设置有抛光头的抛光装置，特别是用于将工件保持在橡胶膜上的抛光头和设置有抛光头的抛光装置。抛光头和抛光装置具有抛光头，该抛光头可以在研磨前基于工件的形状调节抛光轮廓并且可以稳定地获得良好的平坦度。

3. 发明申请

US20110136414A1 POLISHING HEAD AND POLISHING APPARATUS 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US20110136414A1
公开(公告)日：2011-06-09
申请号：US13056249
申请日：2009-08-07
申请人： Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
发明人： Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B37/04 , H01L21/304 , B24B37/00
CPC分类号： B24B37/30
摘要： A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.
摘要翻译：抛光工件的抛光头，抛光工件的表面和设置有抛光头的抛光装置，特别是用于将工件保持在橡胶膜上的抛光头和设置有抛光头的抛光装置。抛光头和抛光装置具有抛光头，该抛光头可以在研磨前基于工件的形状调节抛光轮廓并且可以稳定地获得良好的平坦度。

4. 发明申请

US20100291838A1 POLISHING HEAD AND POLISHING APPARATUS HAVING THE SAME 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US20100291838A1
公开(公告)日：2010-11-18
申请号：US12733535
申请日：2008-10-20
申请人： Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
发明人： Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
IPC分类号： B24B49/00 , B24B37/04 , B24B7/22 , B24B41/06
CPC分类号： B24B37/30 , B24B41/06
摘要： The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.
摘要翻译：本发明是一种研磨头，其中橡胶膜形成为靴形，其中橡胶膜由中间板保持的位置远离工件保持部分; 靴形橡胶膜的端部形成为O形环，使得橡胶膜由中间板保持，尽可能地减小中间板和橡胶膜之间的接触面积。结果，提供了一种具有橡胶卡盘方法的抛光头，其中尽可能地抑制了在工件的表面上发生诸如划痕的表面缺陷，并且可以将工件均匀且稳定地抛光到外围。

5. 发明授权

US08021210B2 Polishing head and polishing apparatus having the same 有权
标题翻译：具有相同的抛光头和抛光装置
公开(公告)号：US08021210B2
公开(公告)日：2011-09-20
申请号：US12733535
申请日：2008-10-20
申请人： Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
发明人： Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B41/06
摘要： The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.
摘要翻译：本发明是一种研磨头，其中橡胶膜形成为靴形，其中橡胶膜由中间板保持的位置远离工件保持部分; 靴形橡胶膜的端部形成为O形环，使得橡胶膜由中间板保持，尽可能地减小中间板和橡胶膜之间的接触面积。结果，提供了一种具有橡胶卡盘方法的抛光头，其中尽可能地抑制了在工件的表面上发生诸如划痕的表面缺陷，并且可以将工件均匀且稳定地抛光到外围。

6. 发明申请

US20120289129A1 POLISHING HEAD AND POLISHING APPARATUS 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US20120289129A1
公开(公告)日：2012-11-15
申请号：US13522370
申请日：2011-01-20
申请人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
发明人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B41/06 , B24B37/10
CPC分类号： B24B37/30 , B24B37/32 , H01L21/02024
摘要： A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.
摘要翻译：一种抛光头，其包括在抛光头本体下面的由盘形中间板保持的橡胶膜和设置在橡胶膜周围的橡胶膜周围的环形引导环，橡胶膜在橡胶膜的下表面部分上保持工件的后表面。抛光头还包括通过弹性膜联接到抛光头本体并且保持引导环和中间板的基部构件，使得导向环的下表面在抛光期间不接触抛光垫。抛光头和抛光装置可以在粗抛光工艺和最终抛光工艺中操作，可以稳定地实现工件抛光中预定的高平整度和高抛光余料去除均匀性，并且可以获得具有更少的具有直径为45nm以上。

7. 发明授权

US09278425B2 Polishing head and polishing apparatus 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US09278425B2
公开(公告)日：2016-03-08
申请号：US13522370
申请日：2011-01-20
申请人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
发明人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B37/30 , B24B37/32 , H01L21/02
CPC分类号： B24B37/30 , B24B37/32 , H01L21/02024
摘要： A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.
摘要翻译：一种抛光头，其包括在抛光头本体下面的由盘形中间板保持的橡胶膜和设置在橡胶膜周围的橡胶膜周围的环形引导环，橡胶膜在橡胶膜的下表面部分上保持工件的后表面。抛光头还包括通过弹性膜联接到抛光头本体并且保持引导环和中间板的基部构件，使得在抛光期间导向环的下表面不接触抛光垫。抛光头和抛光装置可以在粗抛光工艺和最终抛光工艺中操作，可以稳定地实现工件抛光中预定的高平整度和高抛光余料去除均匀性，并且可以获得具有更少的具有直径为45nm以上。

8. 发明授权

US06729941B2 Process for manufacturing semiconductor wafer and semiconductor wafer 有权
标题翻译：制造半导体晶片和半导体晶片的工艺
公开(公告)号：US06729941B2
公开(公告)日：2004-05-04
申请号：US09926731
申请日：2001-12-10
申请人： Junichi Ueno , Hisashi Masumura , Hiromasa Hashimoto
发明人： Junichi Ueno , Hisashi Masumura , Hiromasa Hashimoto
IPC分类号： B24B722
CPC分类号： H01L21/02008 , B24B37/042 , B24B37/24 , B24D3/28 , H01L21/02024
摘要： The present invention provides a process for manufacturing a semiconductor wafer capable of effectively reducing unevenness having a wavelength of 0.5 mm or more which remains on a surface of the semiconductor wafer after a first polishing step and improving flatness thereof; and a semiconductor wafer manufactured by the manufacturing process. The manufacturing process comprises: plural polishing steps including a first polishing step and a final polishing step; and a corrective polishing step performed after the first polishing step using a polishing cloth harder than that used in the first polishing step.
摘要翻译：本发明提供一种半导体晶片的制造方法，其能够有效地减少在第一研磨工序后残留在半导体晶片的表面上的波长为0.5mm以上的波长的凹凸，并提高其平坦度。以及通过制造工艺制造的半导体晶片。制造方法包括：多个抛光步骤，包括第一抛光步骤和最终抛光步骤; 以及在第一抛光步骤之后使用比在第一抛光步骤中使用的抛光布更硬的抛光布进行的校正抛光步骤。

9. 发明申请

US20080254720A1 Polishing Head, Polishing Apparatus and Polishing Method for Semiconductor Wafer 有权
标题翻译：半导体晶圆抛光头，抛光装置和抛光方法
公开(公告)号：US20080254720A1
公开(公告)日：2008-10-16
申请号：US11884833
申请日：2006-03-01
申请人： Hiromasa Hashimoto , Yasuharu Ariga , Hisashi Masumura , Kouzi Kitagawa , Toshimasa Kubota , Takahiro Matsuda
发明人： Hiromasa Hashimoto , Yasuharu Ariga , Hisashi Masumura , Kouzi Kitagawa , Toshimasa Kubota , Takahiro Matsuda
IPC分类号： B24B29/00 , B24B9/00 , H01L21/302
CPC分类号： B24B37/30
摘要： The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.
摘要翻译：本发明提供了一种抛光头1，其包括载体3，导向环4，连接环5和头部主体2，其中头部主体2可旋转，并且保持载体3，导向环4和连衣裙5; 头体2具有倒碗形状并具有中空部8; 连接环，并且至少导向环或载体通过隔膜6联接到头本体的下边缘; 头体的中空被密封。在抛光期间，通过与中空部连通的压力调节机构9来调节密封空心的压力，从而使隔膜弹性变形。结果，晶片W可以被抛光，同时通过旋转由载体和连接环保持的晶片，在给定的压力下对转台12上的抛光垫11施加压力。因此，提供了可以防止在半导体晶片的外周中进行过度抛光并且可以有效地防止在晶片的边缘部分产生印模或划痕的抛光头等。

10. 发明授权

US07740521B2 Polishing head, polishing apparatus and polishing method for semiconductor wafer 有权
标题翻译：半导体晶片的抛光头，抛光装置和抛光方法
公开(公告)号：US07740521B2
公开(公告)日：2010-06-22
申请号：US11884833
申请日：2006-03-01
申请人： Hiromasa Hashimoto , Yasuharu Ariga , Hisashi Masumura , Kouzi Kitagawa , Toshimasa Kubota , Takahiro Matsuda
发明人： Hiromasa Hashimoto , Yasuharu Ariga , Hisashi Masumura , Kouzi Kitagawa , Toshimasa Kubota , Takahiro Matsuda
IPC分类号： B24B1/00 , B24B21/18
CPC分类号： B24B37/30
摘要： The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.
摘要翻译：本发明提供了一种抛光头1，其包括载体3，导向环4，连接环5和头部主体2，其中头部主体2可旋转，并且保持载体3，导向环4和连衣裙5; 头体2具有倒碗形状并具有中空部8; 连接环，并且至少导向环或载体通过隔膜6联接到头本体的下边缘; 头体的中空被密封。在抛光期间，通过与中空部连通的压力调节机构9来调节密封空心的压力，从而使隔膜弹性变形。结果，晶片W可以被抛光，同时通过旋转由载体和连接环保持的晶片，在给定的压力下对转台12上的抛光垫11施加压力。因此，提供了可以防止在半导体晶片的外周中进行过度抛光并且可以有效地防止在晶片的边缘部分产生印模或划痕的抛光头等。

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