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    • 6. 发明申请
    • EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR
    • 制造半导体设备
    • US20140209024A1
    • 2014-07-31
    • US14235901
    • 2012-07-31
    • Young Dae KimJun Jin HyonSang Ho WooSeung Woo ShinHai Won Kim
    • Young Dae KimJun Jin HyonSang Ho WooSeung Woo ShinHai Won Kim
    • H01L21/67
    • H01L21/67184C30B25/08C30B29/06C30B35/005H01L21/02046H01L21/67051H01L21/67178H01L21/67757
    • Provided is an equipment for manufacturing a semiconductor. The equipment for manufacturing a semiconductor includes a cleaning chamber in which a cleaning process is performed on substrates, an epitaxial chamber in which an epitaxial process for forming an epitaxial layer on each of the substrates is performed, a buffer chamber having a storage space for storing the substrates, and a transfer chamber to which the cleaning chamber, the buffer chamber, and the epitaxial chamber are connected to side surfaces thereof, the transfer chamber comprising a substrate handler for transferring the substrates between the cleaning chamber, the buffer chamber, and the epitaxial chamber. The substrate handler successively transfers the substrates, on which the cleaning process is completed, into the buffer chamber, transfers the substrates stacked within the buffer chamber the epitaxial chamber, and successively transfers the substrates, on which the epitaxial layers are respectively formed, into the buffer chamber.
    • 提供了一种用于制造半导体的设备。 用于制造半导体的设备包括其中对基板进行清洁处理的清洁室,其中执行在每个基板上形成外延层的外延工艺的外延室,具有用于存储的存储空间的缓冲室 所述基板和所述清洁室,所述缓冲室和所述外延室连接到其侧表面的传送室,所述传送室包括用于在所述清洁室,所述缓冲室和所述缓冲室之间传送所述基板的基板处理器 外延室。 衬底处理器将完成清洁处理的衬底连续地传送到缓冲室中,将堆叠在缓冲室内的衬底传送到外延室,并且将分别形成有外延层的衬底依次传送到 缓冲室。
    • 10. 发明授权
    • Method for fabricating contact plug with low contact resistance
    • 具有低接触电阻的接触插头的制造方法
    • US06869874B2
    • 2005-03-22
    • US10330303
    • 2002-12-30
    • Hai-Won KimSu-Jin Chae
    • Hai-Won KimSu-Jin Chae
    • H01L21/28H01L21/60H01L21/768H01L21/8242H01L21/44
    • H01L27/10888H01L21/76897
    • The present invention provides a method for forming a contact plug of a semiconductor device with a low contact resistance. The inventive method includes the steps of: forming a contact hole in an inter-layer insulating layer formed on a silicon substrate; removing a native oxide layer formed in the contact hole; forming a single crystal silicon layer on a surface of the silicon substrate in the contact hole, wherein the single crystal silicon layer is formed by an epitaxial growth performed at a first reaction chamber of which pressure is maintained less than approximately 10−6 Torr; and filling the contact hole with polysilicon, wherein the polysilicon layer is formed at a second reaction chamber.
    • 本发明提供一种形成具有低接触电阻的半导体器件的接触插塞的方法。 本发明的方法包括以下步骤:在形成在硅衬底上的层间绝缘层中形成接触孔; 去除形成在接触孔中的自然氧化物层; 在所述接触孔中的所述硅衬底的表面上形成单晶硅层,其中所述单晶硅层通过外延生长形成,所述外延生长在第一反应室中进行,其中所述第一反应室的压力保持在小于约10 -6 Torr ; 以及用多晶硅填充所述接触孔,其中所述多晶硅层在第二反应室处形成。