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    • 5. 发明申请
    • MANUALLY OPERATED SOLDERING APPARATUS
    • 手动操作的焊接设备
    • WO2009027651A1
    • 2009-03-05
    • PCT/GB2008/002869
    • 2008-08-26
    • PILLARHOUSE INTERNATIONAL LIMITEDHARVEY, Darren
    • HARVEY, Darren
    • B23K3/06B23K1/08B23K3/08H05K13/04
    • B23K3/0653B23K1/085
    • A manually operable soldering apparatus comprising a solder bath having a nozzle (92) which is raised to solder a lead or PCB track positioned above the nozzle. A movable frame (28) carries the PCB (30) to be soldered and is mounted to be moved in a plane above the nozzle by manual operation of an operator. A reference board (36) is positioned above board (36) and laser beam (72a) is used to align the reference board, board (36) and nozzle (90) so that an operator works by positioning the board (36) under the beam (72a). A frame carrying the board is pivotable to a maintenance position and can also be held at an angle to the horizontal for a wave soldering operation.
    • 一种手动操作的焊接装置,其包括具有喷嘴(92)的焊料槽,所述喷嘴(92)被升高以焊接位于喷嘴上方的引线或PCB轨道。 可移动框架(28)承载要焊接的PCB(30),并通过操作者的手动操作安装成在喷嘴上方的平面中移动。 参考板(36)位于板(36)上方,并且激光束(72a)用于对准参考板,板(36)和喷嘴(90),使得操作者通过将板(36)定位在 梁(72a)。 承载板的框架可枢转到维护位置,并且也可以与水平面保持一定角度进行波峰焊接操作。