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1. 发明授权

US07054155B1 Fan tray assembly 失效
标题翻译：风扇盘组件
公开(公告)号：US07054155B1
公开(公告)日：2006-05-30
申请号：US10390369
申请日：2003-03-17
申请人： Keith D. Mease , Grant M. Smith , John Ruscitelli
发明人： Keith D. Mease , Grant M. Smith , John Ruscitelli
IPC分类号： H05K7/20
CPC分类号： H05K7/20581
摘要： A fan tray assembly. The assembly comprises a module, housing electronic components that require cooling, and one or more fan trays having fans that direct a cooling air flow through the module. The assembly facilitates easy and fast removal and replacement of the fan trays with respect to the module. These desirable attributes are achieved by five main features of the assembly: (1) a retaining slot-and-tab engagement pivotally attaching each fan tray to one side of the module, (2) a channel-in-track automatically aligning each fan tray as it closes against the module, (3) a leaf spring releasably locking each fan tray into a closed position, (4) a floating power-and-signal connector on each fan tray electrically and mechanically engaging a corresponding receptacle on the module, and (5) a pull ring facilitating manipulation of each fan tray.
摘要翻译：风扇盘组件。组件包括模块，容纳需要冷却的电子部件，以及一个或多个风扇盘，其具有引导冷却空气流通过模块的风扇。该组件有助于相对于模块容易且快速地移除和更换风扇盘。这些所需的属性通过组件的五个主要特征来实现：（1）保持槽和接头接合枢转地将每个风扇盘连接到模块的一侧，（2）通道在轨道中自动对准每个风扇盘（3）可释放地将每个风扇盘片锁定到关闭位置的板簧，（4）每个风扇盘上的浮动电源和信号连接器电气和机械地接合模块上的相应插座，以及（5）拉环，便于操纵每个风扇盘。

2. 发明授权

US06970348B2 Modular packaging configuration and system and method of use for a computer system adapted for operating multiple operating systems in different partitions 失效
标题翻译：模块化封装配置以及适用于在不同分区中操作多个操作系统的计算机系统的系统和方法
公开(公告)号：US06970348B2
公开(公告)日：2005-11-29
申请号：US10242163
申请日：2002-09-12
申请人： Mark R. Treiber , Peter P. Klein , N. Kenneth Newman , Grant M. Smith
发明人： Mark R. Treiber , Peter P. Klein , N. Kenneth Newman , Grant M. Smith
IPC分类号： G06F1/18 , G06F1/16
CPC分类号： G06F1/185 , G06F1/181 , G06F1/183 , G06F1/184 , G06F1/186
摘要： A packaging configuration is provided for a computer system that is adapted for operating multiple operating systems in different partitions of the computer system. The packaging configuration includes a main chassis having a main circuit board. The packaging configuration also includes a processor assembly configured for insertion into the main chassis. The processor assembly has a circuit board for connection to the main circuit board upon insertion of the processor assembly. The packaging configuration also includes a processor subassembly configured for insertion into the processor assembly. The processor subassembly includes a circuit board and a processor and is configured for connection with a circuit board in the processor assembly upon insertion of the processor subassembly. The processor assembly is removable from the main chassis without powering down the computer system, and the processor subassembly is removable from the processor assembly without powering down the computer system.
摘要翻译：为适用于在计算机系统的不同分区中操作多个操作系统的计算机系统提供包装配置。封装结构包括具有主电路板的主机架。包装配置还包括配置成插入主机架的处理器组件。处理器组件具有用于在插入处理器组件时连接到主电路板的电路板。该包装配置还包括配置成插入到处理器组件中的处理器子组件。处理器子组件包括电路板和处理器，并且被配置为在插入处理器子组件时与处理器组件中的电路板连接。处理器组件可从主机架拆卸而不关闭计算机系统，并且处理器子组件可从处理器组件移除而不关闭计算机系统电源。

3. 发明授权

US06288899B1 Method and apparatus for heat dissipation in a multi-processor module 有权
标题翻译：多处理器模块中散热的方法和装置
公开(公告)号：US06288899B1
公开(公告)日：2001-09-11
申请号：US09500879
申请日：2000-02-09
申请人： Grant M. Smith
发明人： Grant M. Smith
IPC分类号： H05K720
CPC分类号： H05K7/20909
摘要： This invention provides a heat sink for dissipating heat from an electronic component to be cooled by air flow. The heat sink includes a base configured to be mounted to the electronic component to receive heat transferred from the electronic component. The base has a center extending along the direction of air flow. The heat sink also includes a plurality of fins projecting from the base. Each of two adjacent fins is positioned on opposite sides of the center of the base and is spaced laterally from the center of the base. The adjacent fins define a gap extending across the center of the base. The gap between the adjacent fins reduces the temperature increase of air flowing adjacent the center of the base. This invention also provides a circuit assembly and a method for cooling an electronic component.
摘要翻译：本发明提供一种用于从通过气流冷却的电子部件散热的散热器。散热器包括被配置为安装到电子部件以接收从电子部件传送的热量的基座。基座具有沿气流方向延伸的中心。散热器还包括从基座突出的多个翅片。两个相邻翅片中的每一个定位在基部的中心的相对侧上并且与基部的中心横向间隔开。相邻的翅片限定跨越基座的中心延伸的间隙。相邻翅片之间的间隙减小了靠近基座中心的空气的温度升高。本发明还提供一种用于冷却电子部件的电路组件和方法。

4. 发明授权

US06217440B1 Air mover system with reduced reverse air flow 失效
标题翻译：具有减少反向气流的气动系统
公开(公告)号：US06217440B1
公开(公告)日：2001-04-17
申请号：US09182273
申请日：1998-10-29
申请人： Mark William Wessel , Grant M. Smith
发明人： Mark William Wessel , Grant M. Smith
IPC分类号： H05K720
CPC分类号： H05K7/20172
摘要： An air mover system is provided having plural air movers each mounted along an air flow path. Each of the air movers includes means mounted for forward rotation to generate forward air flow. Each of the air movers also includes means for preventing reverse rotation of the air flow generating means, thereby reducing reverse air flow.
摘要翻译：提供具有多个沿空气流动路径安装的空气推动器的鼓风机系统。每个促动器包括安装成正向旋转以产生向前空气流的装置。每个升降机还包括用于防止气流发生装置的反向旋转的装置，从而减少反向气流。

5. 发明授权

US4421161A Heat exchanger for integrated circuit packages 失效
标题翻译：用于集成电路封装的热交换器
公开(公告)号：US4421161A
公开(公告)日：1983-12-20
申请号：US375491
申请日：1982-05-06
申请人： Samuel R. Romania , Grant M. Smith
发明人： Samuel R. Romania , Grant M. Smith
IPC分类号： H01L23/467 , F28F7/00
CPC分类号： H01L23/467 , H01L2924/0002
摘要： The present disclosure describes a heat exchange device for attachment to the external surface of a package containing an integrated circuit chip or die. The device has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present device is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically, the device is an integral structure comprised of a generally helical wire form affixed to a metallic frame-like member. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the device is attached.
摘要翻译：本公开描述了用于附接到包含集成电路芯片或管芯的封装的外表面的热交换装置。该装置在高密度电子封装配置中具有特殊应用，其中空间限制严重地限制了由此可以占用的体积。本装置的结构使得每给定体积的有效冷却面积和传热系数都最大化。基本上，该装置是整体结构，其包括固定在金属框架状构件上的大致螺旋形线形式。导线形式提供多个平行紧密间隔开的圆柱形部分，其能够设置在空气流中，用于耗散在装置所附接的集成电路封装中产生的热量。

6. 发明授权

US06992894B1 Method and apparatus for EMI shielding 失效
标题翻译： EMI屏蔽方法和装置
公开(公告)号：US06992894B1
公开(公告)日：2006-01-31
申请号：US10390419
申请日：2003-03-17
申请人： Keith D. Mease , Mark W. Wessel , Grant M. Smith , Terry W. Louth , Daniel A. Jochym , Ronald T. Gibbs
发明人： Keith D. Mease , Mark W. Wessel , Grant M. Smith , Terry W. Louth , Daniel A. Jochym , Ronald T. Gibbs
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H05K9/0016 , G06F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.
摘要翻译：提供了一种用于从安装在导电外壳中的电子部件散热并用于屏蔽由电子部件产生的电磁辐射的装置和方法。散热器被配置成与电子部件热接触地安装。电导体可操作地连接到散热器并且被配置为在散热器和导电外壳的表面之间提供电接触，从而至少部分地屏蔽由电子部件产生的电磁辐射。

7. 发明授权

US06847525B1 Forced convection heat sink system with fluid vector control 失效
标题翻译：带流体矢量控制的强制对流散热系统
公开(公告)号：US06847525B1
公开(公告)日：2005-01-25
申请号：US10155266
申请日：2002-05-24
申请人： Grant M. Smith , Mark W. Wessel
发明人： Grant M. Smith , Mark W. Wessel
IPC分类号： F28F3/02 , H01L23/467 , H05K1/02 , H05K7/20
CPC分类号： H01L23/467 , F28F3/02 , H01L2924/0002 , H05K1/0272 , H01L2924/00
摘要： A heat sink is provided for transferring heat to air flowing from an upstream path. The heat sink includes a support portion and a plurality of fins extending from the support portion. The fins and the support portion together define channels at least one of which has a portion angled with respect to the upstream path of flowing air. Redirection of the flowing air from the upstream path to at least one downstream path is thereby facilitated.
摘要翻译：提供散热器用于将热量传递到从上游路径流动的空气。散热器包括支撑部分和从支撑部分延伸的多个翅片。翅片和支撑部分一起限定通道，其中至少一个具有相对于流动空气的上游路径成角度的部分。流动空气从上游路径重新定向到至少一个下游路径从而便利。

8. 发明授权

US06664463B1 Apparatus and method for shielding electromagnetic radiation 失效
标题翻译：用于屏蔽电磁辐射的装置和方法
公开(公告)号：US06664463B1
公开(公告)日：2003-12-16
申请号：US09525411
申请日：2000-03-15
申请人： Mark R. Treiber , Peter Klein , Grant M. Smith
发明人： Mark R. Treiber , Peter Klein , Grant M. Smith
IPC分类号： H05K900
CPC分类号： H01L23/552 , G06F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is provided for dissipating heat from an electronic component, such as a processor, that is mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. The apparatus includes a heat sink that is configured to be mounted to a surface of the electronic component. The apparatus also includes a conductor connected to the heat sink. The conductor is configured to provide electrical contact between the heat sink and a surface of the conductive enclosure. Accordingly, the apparatus at least partially shields the electromagnetic radiation generated by the electronic component. A corresponding method is also provided.
摘要翻译：提供一种用于从诸如处理器的电子部件散热的装置，其安装在导电外壳中并用于屏蔽由电子部件产生的电磁辐射。该装置包括被配置为安装到电子部件的表面的散热器。该装置还包括连接到散热器的导体。导体被配置为在散热器和导电外壳的表面之间提供电接触。因此，该装置至少部分地屏蔽由电子部件产生的电磁辐射。还提供了相应的方法。

9. 发明授权

US1005362A Speed-regulator for gas-engines. 失效
公开(公告)号：US1005362A
公开(公告)日：1911-10-10
申请号：US1905262787
申请日：1905-05-29
申请人： GRANT M SMITH , CHARLES W FOSTER , THOMAS ALBERT H
发明人： THOMAS ALBERT H
CPC分类号： F02D2041/001

10. 发明授权

US06987667B1 Computer system and method configured for improved cooling 失效
标题翻译：配置为改善冷却的计算机系统和方法
公开(公告)号：US06987667B1
公开(公告)日：2006-01-17
申请号：US10390370
申请日：2003-03-17
申请人： Keith D. Mease , Grant M. Smith
发明人： Keith D. Mease , Grant M. Smith
IPC分类号： G06F1/20
CPC分类号： H05K7/20727 , G06F1/183 , G06F1/20
摘要： A computer subassembly is configured to be mounted within a rack along an insertion axis. The computer subassembly includes a chassis configured for insertion into and removal from the rack along the insertion axis, wherein the chassis at least partially defines an interior. An interconnect assembly is mounted within or adjacent the interior of the chassis, and the interconnect assembly is oriented along a plane that is substantially parallel to the insertion axis. At lease one circuit assembly is positioned at least partially within the interior of the chassis and is connected to the interconnect assembly. The circuit assembly is oriented in a plane substantially parallel to the insertion axis. A source of cooling air is positioned to direct cooling air through the interior of the chassis along the insertion axis.
摘要翻译：计算机子组件被配置为沿着插入轴线安装在机架内。计算机子组件包括被配置为沿着插入轴线插入和移出齿条的底盘，其中底盘至少部分地限定内部。互连组件安装在底座内部或附近，并且互连组件沿着基本上平行于插入轴线的平面定向。至少一个电路组件至少部分地定位在机架的内部并且连接到互连组件。电路组件在基本上平行于插入轴线的平面中取向。冷却空气源被定位成沿着插入轴线引导冷却空气通过底盘的内部。

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