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1. 发明授权

US06217440B1 Air mover system with reduced reverse air flow 失效
标题翻译：具有减少反向气流的气动系统
公开(公告)号：US06217440B1
公开(公告)日：2001-04-17
申请号：US09182273
申请日：1998-10-29
申请人： Mark William Wessel , Grant M. Smith
发明人： Mark William Wessel , Grant M. Smith
IPC分类号： H05K720
CPC分类号： H05K7/20172
摘要： An air mover system is provided having plural air movers each mounted along an air flow path. Each of the air movers includes means mounted for forward rotation to generate forward air flow. Each of the air movers also includes means for preventing reverse rotation of the air flow generating means, thereby reducing reverse air flow.
摘要翻译：提供具有多个沿空气流动路径安装的空气推动器的鼓风机系统。每个促动器包括安装成正向旋转以产生向前空气流的装置。每个升降机还包括用于防止气流发生装置的反向旋转的装置，从而减少反向气流。

2. 发明授权

US06992894B1 Method and apparatus for EMI shielding 失效
标题翻译： EMI屏蔽方法和装置
公开(公告)号：US06992894B1
公开(公告)日：2006-01-31
申请号：US10390419
申请日：2003-03-17
申请人： Keith D. Mease , Mark W. Wessel , Grant M. Smith , Terry W. Louth , Daniel A. Jochym , Ronald T. Gibbs
发明人： Keith D. Mease , Mark W. Wessel , Grant M. Smith , Terry W. Louth , Daniel A. Jochym , Ronald T. Gibbs
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H05K9/0016 , G06F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.
摘要翻译：提供了一种用于从安装在导电外壳中的电子部件散热并用于屏蔽由电子部件产生的电磁辐射的装置和方法。散热器被配置成与电子部件热接触地安装。电导体可操作地连接到散热器并且被配置为在散热器和导电外壳的表面之间提供电接触，从而至少部分地屏蔽由电子部件产生的电磁辐射。

3. 发明授权

US06847525B1 Forced convection heat sink system with fluid vector control 失效
标题翻译：带流体矢量控制的强制对流散热系统
公开(公告)号：US06847525B1
公开(公告)日：2005-01-25
申请号：US10155266
申请日：2002-05-24
申请人： Grant M. Smith , Mark W. Wessel
发明人： Grant M. Smith , Mark W. Wessel
IPC分类号： F28F3/02 , H01L23/467 , H05K1/02 , H05K7/20
CPC分类号： H01L23/467 , F28F3/02 , H01L2924/0002 , H05K1/0272 , H01L2924/00
摘要： A heat sink is provided for transferring heat to air flowing from an upstream path. The heat sink includes a support portion and a plurality of fins extending from the support portion. The fins and the support portion together define channels at least one of which has a portion angled with respect to the upstream path of flowing air. Redirection of the flowing air from the upstream path to at least one downstream path is thereby facilitated.
摘要翻译：提供散热器用于将热量传递到从上游路径流动的空气。散热器包括支撑部分和从支撑部分延伸的多个翅片。翅片和支撑部分一起限定通道，其中至少一个具有相对于流动空气的上游路径成角度的部分。流动空气从上游路径重新定向到至少一个下游路径从而便利。

4. 发明授权

US06664463B1 Apparatus and method for shielding electromagnetic radiation 失效
标题翻译：用于屏蔽电磁辐射的装置和方法
公开(公告)号：US06664463B1
公开(公告)日：2003-12-16
申请号：US09525411
申请日：2000-03-15
申请人： Mark R. Treiber , Peter Klein , Grant M. Smith
发明人： Mark R. Treiber , Peter Klein , Grant M. Smith
IPC分类号： H05K900
CPC分类号： H01L23/552 , G06F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is provided for dissipating heat from an electronic component, such as a processor, that is mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. The apparatus includes a heat sink that is configured to be mounted to a surface of the electronic component. The apparatus also includes a conductor connected to the heat sink. The conductor is configured to provide electrical contact between the heat sink and a surface of the conductive enclosure. Accordingly, the apparatus at least partially shields the electromagnetic radiation generated by the electronic component. A corresponding method is also provided.
摘要翻译：提供一种用于从诸如处理器的电子部件散热的装置，其安装在导电外壳中并用于屏蔽由电子部件产生的电磁辐射。该装置包括被配置为安装到电子部件的表面的散热器。该装置还包括连接到散热器的导体。导体被配置为在散热器和导电外壳的表面之间提供电接触。因此，该装置至少部分地屏蔽由电子部件产生的电磁辐射。还提供了相应的方法。

5. 发明授权

US06862181B1 Apparatus and method for shielding a circuit board 失效
标题翻译：屏蔽电路板的装置和方法
公开(公告)号：US06862181B1
公开(公告)日：2005-03-01
申请号：US10390461
申请日：2003-03-17
申请人： Grant M. Smith , Daniel A. Jochym , Mark W. Wessel
发明人： Grant M. Smith , Daniel A. Jochym , Mark W. Wessel
IPC分类号： H05K7/20 , H05K9/00
CPC分类号： H05K9/0022 , H05K7/20154
摘要： An apparatus directs airflow adjacent a circuit board to provide cooling and provides shielding for the circuit board to reduce EMI. The apparatus comprises a barrier for directing airflow and a conductive layer, electrically grounded and physical associated with the barrier, for providing shielding for the circuit board to reduce EMI.
摘要翻译：一种装置引导邻近电路板的气流以提供冷却并为电路板提供屏蔽以减少EMI。该装置包括用于引导气流的屏障和导电层，电接地并且与屏障相关联的物理，用于为电路板提供屏蔽以降低EMI。

6. 发明授权

US6049467A Stackable high density RAM modules 有权
标题翻译：可堆叠高密度RAM模块
公开(公告)号：US6049467A
公开(公告)日：2000-04-11
申请号：US144322
申请日：1998-08-31
申请人： Vladimir K. Tamarkin , Grant M. Smith
发明人： Vladimir K. Tamarkin , Grant M. Smith
IPC分类号： H01L25/10 , H05K1/14 , H05K7/02
CPC分类号： H05K1/144 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/0002
摘要： A stacked circuit assembly is provided for mounting memory modules in close proximity to an integrated circuit. The assembly includes an integrated circuit mounted on a printed circuit board and at least one stacked printed circuit board mounted in substantially parallel arrangement with respect to the printed circuit board on which the integrated circuit is mounted. A memory module is mounted for electrical connection on a surface of the stacked printed circuit board and an interface connector is mounted on facing surfaces of the printed circuit board and the stacked printed circuit board, thereby providing means for both mechanical and electrical connection between the boards. The integrated circuit and the memory module are mounted in parallel relationship with respect to one another for electrical interconnection through the boards and the interface connectors, thereby reducing the physical distance between the integrated circuit and the memory module.
摘要翻译：提供了用于将存储器模块安装在紧密集成电路的堆叠电路组件。组件包括安装在印刷电路板上的集成电路和至少一个堆叠的印刷电路板，该印刷电路板相对于其上安装集成电路的印刷电路板基本上平行地布置。安装存储器模块用于在堆叠的印刷电路板的表面上电连接，并且接口连接器安装在印刷电路板和堆叠的印刷电路板的相对表面上，由此提供用于板之间的机械和电连接的装置。集成电路和存储器模块相对于彼此并联安装，以通过电路板和接口连接器进行电互连，从而减小集成电路和存储器模块之间的物理距离。

7. 发明授权

US4647852A Contact probe assembly 失效
标题翻译：接触探头组件
公开(公告)号：US4647852A
公开(公告)日：1987-03-03
申请号：US782949
申请日：1985-09-25
申请人： Grant M. Smith , George J. Sprenkle
发明人： Grant M. Smith , George J. Sprenkle
IPC分类号： G01R31/28 , G01R31/02 , G01R1/06
CPC分类号： H01R12/714 , G01R31/2808
摘要： The present disclosure describes an assembly which has particular application in the testing of printed circuit boards. More specifically, the assembly is comprised of an apertured holding plate which is registered with the board under test, and a probe subassembly. The latter includes a body member having a spring-actuated plunger type probe and a hook-like member. In operation, the body member is advanced toward the plate and the probe and hook-like member enter respective plate apertures. As electrical contact is made by the probe with a desired test location on the board, the hook-like member locks the body onto the plate. The body member is so formed that subsequent pressure applied thereto will release it from its locked condition.
摘要翻译：本公开描述了在印刷电路板的测试中具有特殊应用的组件。更具体地，该组件包括与被测试板配准的多孔保持板和探针子组件。后者包括具有弹簧致动柱塞型探针和钩状构件的主体构件。在操作中，主体部件朝向板前进，探针和钩状部件进入相应的板孔。由于通过探针在板上具有期望的测试位置进行电接触，钩状构件将身体锁定在板上。主体构件形成为随后施加的压力将其从其锁定状态释放。

8. 发明授权

US4447835A Method and apparatus for single frame recording on video tape 失效
标题翻译：在录像带上单帧录制的方法和装置
公开(公告)号：US4447835A
公开(公告)日：1984-05-08
申请号：US338360
申请日：1982-01-11
申请人： Grant M. Smith
发明人： Grant M. Smith
IPC分类号： H04N5/7826 , G11B5/588 , G11B27/024 , H04N5/783 , H04N5/92 , H04N5/78 , G11B21/02
CPC分类号： G11B5/588 , G11B27/024 , H04N5/783
摘要： A method and an apparatus for frame-by-frame recording of an RF signal on a magnetic tape uses a video tape recorder (VTR) having a dynamic tracking head. While the tape is stopped, the tracking control voltage generated by the VTR during the playback of a prerecorded tape segment is stored. The tape is then moved to the desired location and stopped. The stored tracking control voltage is then applied to the dynamic tracking head during the recording of a new set of RF signals representative of a video frame.
摘要翻译：用于在磁带上逐帧记录RF信号的方法和装置使用具有动态跟踪头的磁带录像机（VTR）。当磁带停止时，存储在预先记录的磁带段的重放期间由VTR产生的跟踪控制电压。然后将磁带移动到所需的位置并停止。在记录代表视频帧的一组新的RF信号期间，存储的跟踪控制电压被施加到动态跟踪头。

9. 发明授权

US07054155B1 Fan tray assembly 失效
标题翻译：风扇盘组件
公开(公告)号：US07054155B1
公开(公告)日：2006-05-30
申请号：US10390369
申请日：2003-03-17
申请人： Keith D. Mease , Grant M. Smith , John Ruscitelli
发明人： Keith D. Mease , Grant M. Smith , John Ruscitelli
IPC分类号： H05K7/20
CPC分类号： H05K7/20581
摘要： A fan tray assembly. The assembly comprises a module, housing electronic components that require cooling, and one or more fan trays having fans that direct a cooling air flow through the module. The assembly facilitates easy and fast removal and replacement of the fan trays with respect to the module. These desirable attributes are achieved by five main features of the assembly: (1) a retaining slot-and-tab engagement pivotally attaching each fan tray to one side of the module, (2) a channel-in-track automatically aligning each fan tray as it closes against the module, (3) a leaf spring releasably locking each fan tray into a closed position, (4) a floating power-and-signal connector on each fan tray electrically and mechanically engaging a corresponding receptacle on the module, and (5) a pull ring facilitating manipulation of each fan tray.
摘要翻译：风扇盘组件。组件包括模块，容纳需要冷却的电子部件，以及一个或多个风扇盘，其具有引导冷却空气流通过模块的风扇。该组件有助于相对于模块容易且快速地移除和更换风扇盘。这些所需的属性通过组件的五个主要特征来实现：（1）保持槽和接头接合枢转地将每个风扇盘连接到模块的一侧，（2）通道在轨道中自动对准每个风扇盘（3）可释放地将每个风扇盘片锁定到关闭位置的板簧，（4）每个风扇盘上的浮动电源和信号连接器电气和机械地接合模块上的相应插座，以及（5）拉环，便于操纵每个风扇盘。

10. 发明授权

US06970348B2 Modular packaging configuration and system and method of use for a computer system adapted for operating multiple operating systems in different partitions 失效
标题翻译：模块化封装配置以及适用于在不同分区中操作多个操作系统的计算机系统的系统和方法
公开(公告)号：US06970348B2
公开(公告)日：2005-11-29
申请号：US10242163
申请日：2002-09-12
申请人： Mark R. Treiber , Peter P. Klein , N. Kenneth Newman , Grant M. Smith
发明人： Mark R. Treiber , Peter P. Klein , N. Kenneth Newman , Grant M. Smith
IPC分类号： G06F1/18 , G06F1/16
CPC分类号： G06F1/185 , G06F1/181 , G06F1/183 , G06F1/184 , G06F1/186
摘要： A packaging configuration is provided for a computer system that is adapted for operating multiple operating systems in different partitions of the computer system. The packaging configuration includes a main chassis having a main circuit board. The packaging configuration also includes a processor assembly configured for insertion into the main chassis. The processor assembly has a circuit board for connection to the main circuit board upon insertion of the processor assembly. The packaging configuration also includes a processor subassembly configured for insertion into the processor assembly. The processor subassembly includes a circuit board and a processor and is configured for connection with a circuit board in the processor assembly upon insertion of the processor subassembly. The processor assembly is removable from the main chassis without powering down the computer system, and the processor subassembly is removable from the processor assembly without powering down the computer system.
摘要翻译：为适用于在计算机系统的不同分区中操作多个操作系统的计算机系统提供包装配置。封装结构包括具有主电路板的主机架。包装配置还包括配置成插入主机架的处理器组件。处理器组件具有用于在插入处理器组件时连接到主电路板的电路板。该包装配置还包括配置成插入到处理器组件中的处理器子组件。处理器子组件包括电路板和处理器，并且被配置为在插入处理器子组件时与处理器组件中的电路板连接。处理器组件可从主机架拆卸而不关闭计算机系统，并且处理器子组件可从处理器组件移除而不关闭计算机系统电源。

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