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1. 发明授权

US08906263B2 Red nitride phosphors 有权
标题翻译：红色氮化物荧光粉
公开(公告)号：US08906263B2
公开(公告)日：2014-12-09
申请号：US13152863
申请日：2011-06-03
申请人： Harry A. Seibel, II , Brian Thomas Collins , David Todd Emerson
发明人： Harry A. Seibel, II , Brian Thomas Collins , David Todd Emerson
IPC分类号： H01L33/50 , C09K11/77 , C09K11/08
CPC分类号： C09K11/7734 , C09K11/0883 , H01L2224/48465
摘要： Provided according to embodiments of the invention are phosphor compositions that include Ca1-x-ySrxEuyAlSiN3, wherein x is in a range of 0.50 to 0.99 and y is less than 0.013. Also provided according to embodiments of the invention are phosphor compositions that include Ca1-x-ySrxEuyAlSiN3, wherein x is in a range of 0.70 to 0.99 and y is in a range of 0.001 and 0.025. Also provided are methods of making phosphors and light emitting devices that include a phosphor composition according to an embodiment of the invention.
摘要翻译：根据本发明的实施方案提供的是包含Ca1-x-ySrxEuyAlSiN3的荧光体组合物，其中x在0.50至0.99的范围内，y小于0.013。根据本发明的实施方案还提供了包含Ca1-x-ySrxEuyAlSiN3的荧光体组合物，其中x在0.70至0.99的范围内，y在0.001和0.025的范围内。还提供了制造荧光体和发光器件的方法，其包括根据本发明的实施方案的荧光体组合物。

2. 发明授权

US08772757B2 Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices 有权
标题翻译：深紫外光发射装置及其制造深紫外光发射装置的方法
公开(公告)号：US08772757B2
公开(公告)日：2014-07-08
申请号：US12030539
申请日：2008-02-13
申请人： David Todd Emerson , Michael John Bergmann , Amber Abare , Kevin Haberern
发明人： David Todd Emerson , Michael John Bergmann , Amber Abare , Kevin Haberern
IPC分类号： H01L29/06
CPC分类号： H01L33/12 , B82Y20/00 , H01L33/06 , H01L33/32
摘要： Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 360 nm with wall plug efficiencies of at least than 4% are provided. Wall plug efficiencies may be at least 5% or at least 6%. Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 345 nm with wall plug efficiencies of at least than 2% are also provided. Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 330 nm with wall plug efficiencies of at least than 0.4% are provided. Light emitting devices and methods of fabricating light emitting devices having a peak output wavelength of not greater than 360 nm and an output power of at least 5 mW, having a peak output wavelength of 345 nm or less and an output power of at least 3 mW and/or a peak output wavelength of 330 nm or less and an output power of at least 0.3 mW at a current density of less than about 0.35 μA/μm2 are also provided. The semiconductor light emitting devices may have a direct current lifetime of at least 100 hours, at least 500 hours or at least 1000 hours.
摘要翻译：提供发光装置和制造发射波长小于360nm，壁塞效率至少为4％的发光装置的方法。墙壁插头效率可以至少为5％或至少为6％。还提供了发光装置和制造发射波长小于345nm并具有至少2％壁塞效率的发光装置的方法。提供发光装置和制造发射波长小于330nm，壁塞效率至少为0.4％的发光器件的方法。具有峰值输出波长不大于360nm和输出功率至少为5mW的发光器件的发光器件和方法，具有345nm或更小的峰值输出波长和至少3mW的输出功率还提供了在小于约0.35μA/μm2的电流密度下的330nm或更小的峰值输出波长和至少0.3mW的输出功率。半导体发光器件可以具有至少100小时，至少500小时或至少1000小时的直流电寿命。

3. 发明授权

US08669565B2 LED devices with narrow viewing angle and an LED display including same 有权
标题翻译：具有窄视角的LED装置和包括其的LED显示器
公开(公告)号：US08669565B2
公开(公告)日：2014-03-11
申请号：US13161245
申请日：2011-06-15
申请人： Chi Keung Chan , Zhi Kuan Zhang , Xiang Fei , Hao Liu , Ju Zuo Sheng , David Todd Emerson
发明人： Chi Keung Chan , Zhi Kuan Zhang , Xiang Fei , Hao Liu , Ju Zuo Sheng , David Todd Emerson
IPC分类号： H01L33/02
CPC分类号： G02B6/0073 , G02B6/0023 , G02B6/0068 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： LED devices includes a lead frame having a reflector cup with a round bottom surface and a wall surface having a variable inclination with respect to the bottom surface and defining an opening at an upper end thereof. An LED is mounted on the bottom surface of the reflector cup, and an LED module includes first and second LED device that emit different colors. The first and second LED devices have substantially matched far field patterns in a first and second direction, where a first viewing angle in the first direction is less than about 99°.
摘要翻译： LED装置包括具有圆形底表面的反射杯和具有相对于底表面可变倾斜并且在其上端限定开口的壁表面的引线框架。一个LED安装在反射杯底面上，一个LED模块包括发射不同颜色的第一和第二LED装置。第一和第二LED器件在第一和第二方向具有基本匹配的远场图案，其中第一方向上的第一视角小于约99°。

4. 外观设计

USD684545S1 Miniature surface mount device 有权
标题翻译：微型表面贴装装置
公开(公告)号：USD684545S1
公开(公告)日：2013-06-18
申请号：US29386582
申请日：2011-03-02
申请人： Chi Keung Chan , Chak Hau Pang , Fei Hong Li , David Todd Emerson
设计人： Chi Keung Chan , Chak Hau Pang , Fei Hong Li , David Todd Emerson

5. 发明授权

US08436368B2 Methods of forming light emitting devices having current reducing structures 有权
标题翻译：形成具有电流还原结构的发光器件的方法
公开(公告)号：US08436368B2
公开(公告)日：2013-05-07
申请号：US13406251
申请日：2012-02-27
申请人： David Todd Emerson , Kevin Haberern , Michael John Bergmann , David B. Slater, Jr. , Matthew Donofrio , John Edmond
发明人： David Todd Emerson , Kevin Haberern , Michael John Bergmann , David B. Slater, Jr. , Matthew Donofrio , John Edmond
IPC分类号： H01L27/15
CPC分类号： H01L33/145 , H01L24/05 , H01L33/14 , H01L33/38 , H01L2224/49107 , H01L2933/0016
摘要： A light emitting device includes a p-type semiconductor layer, an n-type semiconductor layer, and an active region between the n-type semiconductor layer and the p-type semiconductor layer. A non-transparent feature, such as a wire bond pad, is on the p-type semiconductor layer or on the n-type semiconductor layer opposite the p-type semiconductor layer, and a reduced conductivity region is in the p-type semiconductor layer or the n-type semiconductor layer and is aligned with the non-transparent feature. The reduced conductivity region may extend from a surface of the p-type semiconductor layer opposite the n-type semiconductor layer towards the active region and/or from a surface of the n-type semiconductor layer opposite the p-type semiconductor layer towards the active region.
摘要翻译：发光器件包括p型半导体层，n型半导体层和n型半导体层和p型半导体层之间的有源区。 p型半导体层或与p型半导体层相对的n型半导体层上的非透明特性，例如引线接合焊盘，在p型半导体层中具有导电性降低的区域或n型半导体层并且与非透明特征对准。导电性降低区域可以从与n型半导体层相对的p型半导体层的表面朝向有源区域和/或从与p型半导体层相对的n型半导体层的表面朝向有源区域地区。

6. 发明申请

US20110042698A1 EMITTER PACKAGE WITH ANGLED OR VERTICAL LED 有权
标题翻译：带有直角或垂直LED的发光二极管
公开(公告)号：US20110042698A1
公开(公告)日：2011-02-24
申请号：US12868567
申请日：2010-08-25
申请人： Alex Chi Keung Chan , David Todd Emerson
发明人： Alex Chi Keung Chan , David Todd Emerson
IPC分类号： H01L33/08 , H01L33/10
CPC分类号： H01L33/48 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/50 , H01L33/52 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis. LED displays according to the present invention comprise a plurality of LED packages, at least some of which have an LED chip mounted in a reflective cup at different angles to achieve the desired display FFP.
摘要翻译：本发明涉及使用LED封装的LED封装和LED显示器，其中封装内的LED芯片以独特的取向布置以提供所需的封装或显示器FFP。根据本发明的一个LED封装包括安装在反射杯中的反射杯和LED芯片。反射杯具有与第一轴正交的第一轴和第二轴，其中LED芯片在反射杯内旋转，使得LED芯片与所述第一轴线不对准。一些LED封装可以包括具有芯片纵向轴线的矩形LED芯片和具有杯纵向轴线的椭圆形反射杯。 LED芯片安装在反射杯内，其芯片纵向轴线从杯纵向轴线成角度。根据本发明的LED显示器包括多个LED封装，其至少其中一些具有以不同角度安装在反射杯中的LED芯片以实现期望的显示器FFP。

7. 发明申请

US20110037080A1 METHODS FOR COMBINING LIGHT EMITTING DEVICES IN A PACKAGE AND PACKAGES INCLUDING COMBINED LIGHT EMITTING DEVICES 有权
标题翻译：用于将发光装置组合在包装中的方法和包括组合的发光装置的包装
公开(公告)号：US20110037080A1
公开(公告)日：2011-02-17
申请号：US12838677
申请日：2010-07-19
申请人： David Todd Emerson , Bernd P. Keller , Mark McOlear , Peter S. Andrews
发明人： David Todd Emerson , Bernd P. Keller , Mark McOlear , Peter S. Andrews
IPC分类号： H01L33/48 , H01L21/00
CPC分类号： H05B33/0857 , F21K9/00 , F21Y2105/10 , F21Y2105/12 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： Methods of forming a light emitting device package assembly include defining a chromaticity region in a two dimensional chromaticity space within a 10-step MacAdam ellipse of a target chromaticity point, and subdividing the defined chromaticity region into at least three chromaticity subregions, providing a plurality of light emitting devices that emit light having a chromaticity that falls within the defined chromaticity region, selecting at least three of the plurality of light emitting devices, wherein each of the three light emitting devices emits light from a different one of the chromaticity subregions. The at least three light emitting devices are selected from chromaticity subregions that are complementary relative to the target chromaticity point to at least one other chromaticity subregion from which a light emitting device is selected.
摘要翻译：形成发光器件封装组件的方法包括在目标色度点的10步MacAdam椭圆内限定二维色度空间中的色度区域，并将定义的色度区域细分为至少三个色度子区域，提供多个发射具有落入规定色度区域内的色度的光的发光装置，选择所述多个发光装置中的至少三个，其中，所述三个发光装置中的每一个从所述色度子区域中的不同一个发射光。从至少一个其他色度子区域相对于目标色度点互补的色度子区域中选择至少三个发光器件，从其选择发光器件。

8. 发明授权

US07613219B2 Semiconductor devices having self aligned semiconductor mesas and contact layers 有权
标题翻译：具有自对准半导体台面和接触层的半导体器件
公开(公告)号：US07613219B2
公开(公告)日：2009-11-03
申请号：US11520383
申请日：2006-09-13
申请人： Kevin Ward Haberern , Raymond Rosado , Michael John Bergman , David Todd Emerson
发明人： Kevin Ward Haberern , Raymond Rosado , Michael John Bergman , David Todd Emerson
IPC分类号： H01S5/028 , H01L29/06 , H01L51/50
CPC分类号： H01L33/145 , H01S5/021 , H01S5/0421 , H01S5/0425 , H01S5/22 , H01S5/2205 , H01S5/2206 , H01S5/2214 , H01S5/2231 , H01S5/2275 , H01S5/32341 , H01S2301/176
摘要： Methods of forming a semiconductor device can include forming a semiconductor structure on a substrate, the semiconductor structure having mesa sidewalls and a mesa surface opposite the substrate. A contact layer can be formed on the mesa surface wherein the contact layer has sidewalls and a contact surface opposite the mesa surface and wherein the contact layer extends across substantially an entirety of the mesa surface. A passivation layer can be formed on the mesa sidewalls and on portions of the contact layer sidewalls adjacent the mesa surface, and the passivation layer can expose substantially an entirety of the contact surface of the contact layer. Related devices are also discussed.
摘要翻译：形成半导体器件的方法可以包括在衬底上形成半导体结构，半导体结构具有台面侧壁和与衬底相对的台面。接触层可以形成在台面表面上，其中接触层具有侧壁和与台面表面相对的接触表面，并且其中接触层延伸穿过基本上整个台面表面。可以在台面侧壁和邻近台面表面的接触层侧壁的部分上形成钝化层，并且钝化层可以暴露接触层的基本上整个接触表面。还讨论了相关设备。

9. 发明申请

US20090261358A1 EMISSION TUNING METHODS AND DEVICES FABRICATED UTILIZING METHODS 有权
标题翻译：排放调谐方法和装置制造用途方法
公开(公告)号：US20090261358A1
公开(公告)日：2009-10-22
申请号：US12414457
申请日：2009-03-30
申请人： ASHAY CHITNIS , JOHN EDMOND , JEFFREY CARL BRITT , BERND P. KELLER , DAVID TODD EMERSON , MICHAEL JOHN BERGMANN , JASPER S. CABALU
发明人： ASHAY CHITNIS , JOHN EDMOND , JEFFREY CARL BRITT , BERND P. KELLER , DAVID TODD EMERSON , MICHAEL JOHN BERGMANN , JASPER S. CABALU
IPC分类号： H01L33/00 , H01L21/66 , B23B47/00
CPC分类号： H01L33/508 , H01L33/0095 , H01L2224/13 , H01L2933/0041 , Y10T408/47
摘要： A method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs, typically on a wafer, and coating the LEDs with a conversion material so that at least some light from the LEDs passes through the conversion material and is converted. The light emission from the LED chips comprises light from the conversion material, typically in combination with LED light. The emission characteristics of at least some of the LED chips is measured and at least some of the conversion material over the LEDs is removed to alter the emission characteristics of the LED chips. The invention is particularly applicable to fabricating LED chips on a wafer where the LED chips have light emission characteristics that are within a range of target emission characteristics. This target range can fall within an emission region on a CIE curve to reduce the need for binning of the LEDs from the wafer. The emission characteristics of the LED chips in the wafer can be tuned to the desired range by micro-machining the conversion material over the LEDs.
摘要翻译：一种用于制造发光二极管（LED）芯片的方法，包括通常在晶片上提供多个LED，并用转换材料涂覆LED，使得来自LED的至少一些光通过转换材料并被转换。来自LED芯片的光发射包括来自转换材料的光，通常与LED光结合。测量至少一些LED芯片的发射特性，并且除去LED上的至少一些转换材料以改变LED芯片的发射特性。本发明特别适用于在晶片上制造LED芯片，其中LED芯片具有在目标发射特性范围内的发光特性。该目标范围可以落在CIE曲线上的发射区域内，以减少对来自晶片的LED进行合并的需要。晶片上的LED芯片的发射特性可以通过在LED上微转换材料来调节到期望的范围。

10. 发明申请

US20090250716A1 LIGHT EMITTING DEVICES HAVING ROUGHENED/REFLECTIVE CONTACTS AND METHODS OF FABRICATING SAME 有权
标题翻译：具有粗糙/反射性接触的发光装置及其制造方法
公开(公告)号：US20090250716A1
公开(公告)日：2009-10-08
申请号：US12476519
申请日：2009-06-02
申请人： Kevin Haberern , Michael John Bergmann , Van Mieczkowski , David Todd Emerson
发明人： Kevin Haberern , Michael John Bergmann , Van Mieczkowski , David Todd Emerson
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/42 , H01L24/05 , H01L33/405 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： Light emitting devices include an active region of semiconductor material and a first contact on the active region. The first contact is configured such that photons emitted by the active region pass through the first contact. A photon absorbing wire bond pad is provided on the first contact. The wire bond pad has an area less than the area of the first contact. A reflective structure is disposed between the first contact and the wire bond pad such that the reflective structure has substantially the same area as the wire bond pad. A second contact is provided opposite the active region from the first contact. The reflective structure may be disposed only between the first contact and the wire bond pad. Methods of fabricating such devices are also provided.
摘要翻译：发光器件包括半导体材料的有源区和有源区上的第一接触。第一触点配置成使得由有源区域发射的光子通过第一触点。在第一触点上设置光子吸收引线键合焊盘。接线焊盘的面积小于第一接触面积。反射结构设置在第一触点和引线接合焊盘之间，使得反射结构具有与引线接合焊盘基本上相同的面积。与第一触点相对的有源区域提供第二触点。反射结构可以仅设置在第一触点和引线接合焊盘之间。还提供了制造这种装置的方法。

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