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1. 发明授权

US10431567B2 White ceramic LED package 有权
公开(公告)号：US10431567B2
公开(公告)日：2019-10-01
申请号：US12939096
申请日：2010-11-03
申请人： Alex Chi Keung Chan , Charles Chak Hau Pang , Victor Yue Kwong Lau
发明人： Alex Chi Keung Chan , Charles Chak Hau Pang , Victor Yue Kwong Lau
IPC分类号： H01L33/50 , H01L25/075 , H01L33/48 , H01L33/62
摘要： The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes. In some embodiments, the structural integrity of the package can also be attributed to indentations along its sides, which do not enable as much plating material to accumulate at the sides and helps package cutting processes during manufacture. The indentations can also contribute to displays having more tightly and densely packed LED arrays.

2. 发明授权

US08748915B2 Emitter package with angled or vertical LED 有权
标题翻译：发光二极管，带角度或垂直LED
公开(公告)号：US08748915B2
公开(公告)日：2014-06-10
申请号：US12868567
申请日：2010-08-25
申请人： Alex Chi Keung Chan , David Todd Emerson
发明人： Alex Chi Keung Chan , David Todd Emerson
IPC分类号： H01L33/08
CPC分类号： H01L33/48 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/50 , H01L33/52 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis. LED displays according to the present invention comprise a plurality of LED packages, at least some of which have an LED chip mounted in a reflective cup at different angles to achieve the desired display FFP.
摘要翻译：本发明涉及使用LED封装的LED封装和LED显示器，其中封装内的LED芯片以独特的取向布置以提供所需的封装或显示器FFP。根据本发明的一个LED封装包括安装在反射杯中的反射杯和LED芯片。反射杯具有与第一轴正交的第一轴和第二轴，其中LED芯片在反射杯内旋转，使得LED芯片与所述第一轴线不对准。一些LED封装可以包括具有芯片纵向轴线的矩形LED芯片和具有杯纵向轴线的椭圆形反射杯。 LED芯片安装在反射杯内，其芯片纵向轴线从杯纵向轴线成角度。根据本发明的LED显示器包括多个LED封装，其至少其中一些具有以不同角度安装在反射杯中的LED芯片以实现期望的显示器FFP。

3. 发明授权

US08901583B2 Surface mount device thin package 有权
标题翻译：表面贴装器件薄封装
公开(公告)号：US08901583B2
公开(公告)日：2014-12-02
申请号：US12758702
申请日：2010-04-12
申请人： Alex Chi Keung Chan , Charles Chak Hau Pang , Ruan Fei Fei
发明人： Alex Chi Keung Chan , Charles Chak Hau Pang , Ruan Fei Fei
IPC分类号： H01L33/62 , H01L33/48 , H01L25/075 , H01L33/64
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/486 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/09701 , H01L2924/00014 , H01L2924/00
摘要： The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.
摘要翻译：本发明涉及利用具有改进的结构完整性，发射特性和可定制属性的薄/低轮廓LED封装的LED封装和LED显示器。在一些实施例中，改进的结构完整性由引线框架中的与壳体配合以用于更强封装的各种特征提供。此外，在一些实施例中，改进的发射特性由诸如形状和深度的空腔特征提供，其分别提供用于多个LED芯片的增加的表面结合面积和增加的视角。一些实施例还提供了具有可定制的用于使用较小封装的应用的顶部的分级封装，其底部包括与常规机械/电气支撑兼容的尺寸。

4. 发明申请

US20120104426A1 WHITE CERAMIC LED PACKAGE 审中-公开
标题翻译：白色陶瓷LED包装
公开(公告)号：US20120104426A1
公开(公告)日：2012-05-03
申请号：US12939096
申请日：2010-11-03
申请人： Alex Chi Keung Chan , Charles Chak Hau Pang , Victor Yue Kwong Lau
发明人： Alex Chi Keung Chan , Charles Chak Hau Pang , Victor Yue Kwong Lau
IPC分类号： H01L33/08 , H01L33/50 , H01L33/38
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/09701 , H01L2924/00014 , H01L2924/00
摘要： The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes. In some embodiments, the structural integrity of the package can also be attributed to indentations along its sides, which do not enable as much plating material to accumulate at the sides and helps package cutting processes during manufacture. The indentations can also contribute to displays having more tightly and densely packed LED arrays.
摘要翻译：本发明涉及使用白色陶瓷壳体和具有改进的颜色混合和结构完整性的薄/薄型封装的无引线LED封装和LED显示器。在一些实施例中，改进的颜色混合部分地由白色陶瓷封装壳体提供，其可以帮助将来自每个LED的光从许多方向反射离开设备。 LED的非线性布置也可以有助于改进色混合。改进的结构完整性可以通过与壳体配合以用于更强的封装结构的接合焊盘中的各种特征来提供。此外，在一些实施例中，每个封装的薄度/薄度归因于其无引线结构，其中焊盘和电极通过通孔电连接。在一些实施例中，包装的结构完整性也可以归因于其侧面的凹痕，其不能使得电镀材料能够在侧面积聚并且有助于在制造期间封装切割工艺。压痕还可以有助于具有更紧密和密集的LED阵列的显示器。

5. 发明申请

US20120025227A1 WATER RESISTANT SURFACE MOUNT DEVICE PACKAGE 有权
标题翻译：防水表面安装设备包装
公开(公告)号：US20120025227A1
公开(公告)日：2012-02-02
申请号：US13192293
申请日：2011-07-27
申请人： ALEX CHI KEUNG CHAN , Charles Chak Hau Pang
发明人： ALEX CHI KEUNG CHAN , Charles Chak Hau Pang
IPC分类号： H01L33/62
CPC分类号： H01L33/486 , H01L24/73 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/09701 , H01L2924/1815 , H01L2933/0033 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.
摘要翻译：本发明涉及使用具有改进的结构完整性和可定制属性的防水包装的LED封装和LED显示器。在一些实施例中，改进的结构完整性由引线框架中的各种特征提供，壳体材料包围以提高引线框架和套管之间的粘合性，以实现更强的防水封装。而且，在一些实施例中，改进的结构完整性和耐水性由腔体特征进一步提供，腔特征改善腔体和保护性密封剂之间的粘附性。一些实施例还提供具有比其侧面暴露的焊接引脚的长度更大的总体高度的封装，这改善了相邻封装之间的侧面暴露的焊接引脚的凝胶覆盖。

6. 发明申请

US20110037083A1 LED PACKAGE WITH CONTRASTING FACE 审中-公开
标题翻译： LED包装与对比表面
公开(公告)号：US20110037083A1
公开(公告)日：2011-02-17
申请号：US12875873
申请日：2010-09-03
申请人： ALEX CHI KEUNG CHAN , DAVID EMERSON , CHAK HAU PANG , JUN ZHANG
发明人： ALEX CHI KEUNG CHAN , DAVID EMERSON , CHAK HAU PANG , JUN ZHANG
IPC分类号： H01L33/08 , H01L33/10
CPC分类号： H01L33/486 , H01L23/49861 , H01L25/0753 , H01L33/62 , H01L33/64 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： LED packages and LED displays utilizing the LED packages are disclosed, with the LED packages arranged to provide good contrast between the different pixels in an LED display while not reducing the perceived luminous flux or brightness of the display. One embodiment of an LED package comprises an LED chip and conversion material arranged to convert at least some light emitted from the LED chip. The package emits light from the conversion material or a combination of light from the conversion material and the LED chip. A reflective area is included around the LED chip that substantially reflects the package light and a contrasting area is included outside the reflective area and has a color that contrasts with the package light. LED displays according to the present invention comprise a plurality of LED packages arranged in relation to one another to produce messages or images, with the package providing improved pixel contrast.
摘要翻译：公开了使用LED封装的LED封装和LED显示器，其中LED封装被布置成在LED显示器中的不同像素之间提供良好的对比度，而不降低显示器的感知光通量或亮度。 LED封装的一个实施例包括LED芯片和转换材料，其被布置成转换从LED芯片发射的至少一些光。该封装从转换材料发射光或者从转换材料和LED芯片组合的光。在LED芯片周围包含反射区域，其基本上反射封装光，并且反射区域外部包括对比区域，并且具有与封装光成对比的颜色。根据本发明的LED显示器包括相对于彼此布置的多个LED封装件以产生消息或图像，其中封装提供改善的像素对比度。

7. 发明授权

US09831393B2 Water resistant surface mount device package 有权
公开(公告)号：US09831393B2
公开(公告)日：2017-11-28
申请号：US13192293
申请日：2011-07-27
申请人： Alex Chi Keung Chan , Charles Chak Hau Pang
发明人： Alex Chi Keung Chan , Charles Chak Hau Pang
IPC分类号： H01L29/22 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/00
CPC分类号： H01L33/486 , H01L24/73 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/09701 , H01L2924/1815 , H01L2933/0033 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.

8. 发明授权

US09240395B2 Waterproof surface mount device package and method 有权
标题翻译：防水表面贴装装置封装及方法
公开(公告)号：US09240395B2
公开(公告)日：2016-01-19
申请号：US12957225
申请日：2010-11-30
申请人： Alex Chi Keung Chan , Charles Chak Hau Pang , Li Fei Hong
发明人： Alex Chi Keung Chan , Charles Chak Hau Pang , Li Fei Hong
IPC分类号： H01L27/15 , H01L33/56 , H01L25/075 , H01L33/62
CPC分类号： H01L25/0753 , H01L24/73 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48097 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/09701 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.
摘要翻译：本发明涉及使用具有改进的结构完整性的防水和抗UV封装的LED封装和方法。在一些实施例中，通过引线框架中的各种特征来提供改进的结构完整性，即壳体材料包围以改善引线框架和套管之间的粘合性，用于更强的防水封装。而且，在一些实施例中，改进的结构完整性和防水性通过改善密封剂与外壳之间的粘合力进一步提供。一些实施方案还提供了改进的引线键合，其中控制和优化的引线键的长度，厚度和环路高度用于改善引线键合和密封剂之间的粘合性以及改进的可靠性。

9. 发明申请

US20110248293A1 SURFACE MOUNT DEVICE THIN PACKAGE 有权
标题翻译：表面安装设备薄包装
公开(公告)号：US20110248293A1
公开(公告)日：2011-10-13
申请号：US12758702
申请日：2010-04-12
申请人： Alex Chi Keung Chan , Charles Chak Hau Pang , Ruan Fei Fei
发明人： Alex Chi Keung Chan , Charles Chak Hau Pang , Ruan Fei Fei
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/486 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/09701 , H01L2924/00014 , H01L2924/00
摘要： The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.
摘要翻译：本发明涉及利用具有改进的结构完整性，发射特性和可定制属性的薄/低轮廓LED封装的LED封装和LED显示器。在一些实施例中，改进的结构完整性由引线框架中的与壳体配合以用于更强封装的各种特征提供。此外，在一些实施例中，改进的发射特性由诸如形状和深度的空腔特征提供，其分别提供用于多个LED芯片的增加的表面结合面积和增加的视角。一些实施例还提供了具有可定制的用于使用较小封装的应用的顶部的分级封装，其底部包括与常规机械/电气支撑兼容的尺寸。

10. 发明申请

US20090072251A1 LED surface-mount device and LED display incorporating such device 审中-公开
标题翻译： LED表面贴装器件和LED显示屏结合这样的器件
公开(公告)号：US20090072251A1
公开(公告)日：2009-03-19
申请号：US12002410
申请日：2007-12-14
申请人： Alex Chi Keung Chan , Xuan Wang
发明人： Alex Chi Keung Chan , Xuan Wang
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/4809 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/09701 , H01L2924/00 , H01L2924/00014
摘要： In one embodiment, a surface-mount device comprises a casing having opposed, first and second main surfaces, side surfaces, and end surfaces. A lead frame partially encased by the casing comprises (1) an electrically conductive LED chip carrier part having a surface carrying a linear array of three LEDs adapted to be energized to produce in combination a substantially full range of colors, each LED having a first electrical terminal and a second electrical terminal, the first terminal of each of the three LEDs being electrically and thermally coupled to the chip carrying surface of the chip carrier part; and (2) three electrically conductive connection parts separate from the chip carrier part, each of the three connection parts having a connection pad, the second terminal of each of the three LEDs being electrically coupled to the connection pad of a corresponding one of the three connection parts with a single wire bond. The linear array of LEDs extends in a first direction, and each of the chip carrier part and three connection parts has a lead. The leads are disposed in parallel relationship with each other and extend through the end surfaces of the casing in a second direction, the second direction being orthogonal to the first direction. An array of the surface-mount devices may be used in an LED display such as an indoor LED screen.
摘要翻译：在一个实施例中，表面安装装置包括具有相对的第一和第二主表面，侧表面和端表面的壳体。由壳体部分地包围的引线框架包括（1）导电LED芯片载体部分，其具有承载三个LED的线性阵列的表面，该三个LED适于被激励以组合产生基本上全范围的颜色，每个LED具有第一电端子和第二电端子，三个LED中的每一个的第一端子电耦合到芯片承载部件的芯片承载表面; 和（2）与芯片载体部分分离的三个导电连接部分，三个连接部分中的每一个具有连接焊盘，三个LED中的每一个的第二端子电耦合到三个相应的一个的连接焊盘连接部件具有单线接合。 LED的线性阵列沿第一方向延伸，并且芯片载体部分和三个连接部分中的每一个具有引线。引线彼此平行地设置并且在第二方向上延伸穿过壳体的端面，第二方向与第一方向正交。表面安装器件的阵列可以用在诸如室内LED屏的LED显示器中。

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