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1. 发明授权

US10431567B2 White ceramic LED package 有权
公开(公告)号：US10431567B2
公开(公告)日：2019-10-01
申请号：US12939096
申请日：2010-11-03
申请人： Alex Chi Keung Chan , Charles Chak Hau Pang , Victor Yue Kwong Lau
发明人： Alex Chi Keung Chan , Charles Chak Hau Pang , Victor Yue Kwong Lau
IPC分类号： H01L33/50 , H01L25/075 , H01L33/48 , H01L33/62
摘要： The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes. In some embodiments, the structural integrity of the package can also be attributed to indentations along its sides, which do not enable as much plating material to accumulate at the sides and helps package cutting processes during manufacture. The indentations can also contribute to displays having more tightly and densely packed LED arrays.

2. 发明申请

US20120104427A1 MINIATURE SURFACE MOUNT DEVICE WITH LARGE PIN PADS 有权
标题翻译：微型表面安装装置，具有大的PIN PADS
公开(公告)号：US20120104427A1
公开(公告)日：2012-05-03
申请号：US13153888
申请日：2011-06-06
申请人： Chi Keung Chan , Chak Hau Pang , Fei Hong Li , Yue Kwong Lau , Jun Zhang , David Todd Emerson
发明人： Chi Keung Chan , Chak Hau Pang , Fei Hong Li , Yue Kwong Lau , Jun Zhang , David Todd Emerson
IPC分类号： H01L33/08
CPC分类号： H01L33/486 , H01L23/49861 , H01L25/0753 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00012 , H01L2924/00014
摘要： One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.
摘要翻译：表面贴装LED封装的一个实施例包括引线框架和至少部分地封装引线框架的塑料外壳。引线框架包括多个导电芯片载体。设置在多个导电芯片载体的每一个上的LED。表面贴装LED封装的外形高度小于约1.0mm。

3. 发明授权

US07701055B2 Light emitter assembly 有权
标题翻译：发光器组件
公开(公告)号：US07701055B2
公开(公告)日：2010-04-20
申请号：US11700349
申请日：2007-01-30
申请人： Kai Chiu Wu , Ming Lu , Chak Hau Pang
发明人： Kai Chiu Wu , Ming Lu , Chak Hau Pang
IPC分类号： H01L23/34
CPC分类号： F21K9/23 , F21V29/767 , F21V29/773 , F21V29/83 , F21Y2107/60 , F21Y2115/10 , H05K1/0203 , H05K1/144 , H05K2201/09027 , H05K2201/09063 , H05K2201/10295
摘要： A plurality of disc-shaped substrates carry light emitters and are axially stacked, spaced apart, in a metal housing to dissipate the heat produced by the light emitters. The housing comprises mutually connected elongate planar ribs that abut the light emitters or substrates for thermally connecting the light emitters to the housing. The ribs have shoulders. The substrates are received between the ribs and abut the shoulders. The shoulders are positioned proximate each light emitter in intimate contact with the substrate for efficient heat dissipation.
摘要翻译：多个盘状基板携带发光体并且在金属壳体中轴向堆叠间隔开以散发由发光体产生的热量。壳体包括相互连接的细长平面肋，其邻接发光器或基板，用于将发光体热连接到壳体。肋骨有肩膀。基板被接收在肋之间并且邻接肩部。肩部位于每个光发射器附近，与基板紧密接触以有效散热。

4. 发明授权

US07663229B2 Lighting device 有权
标题翻译：照明装置
公开(公告)号：US07663229B2
公开(公告)日：2010-02-16
申请号：US11727929
申请日：2007-03-29
申请人： Ming Lu , Kai Chiu Wu , Chak Hau Pang
发明人： Ming Lu , Kai Chiu Wu , Chak Hau Pang
IPC分类号： H01L23/34
CPC分类号： F21V29/89 , F21K9/233 , F21V29/507 , F21V29/767 , F21V29/777 , F21V29/83 , F21Y2115/10 , H01L2224/48091 , H01L2924/00014
摘要： A lighting device contains a plurality of light emitting sources mounted on a thermally conductive housing and electrically connected to a circuit board. The housing includes a base portion which is spaced apart from the circuit board, and an intermediate heat dissipation structure which is disposed between the circuit board and the base portion of the housing, for promoting cooling by convection. The plurality of light emitting sources are in thermal communication with the intermediate heat dissipation structure.
摘要翻译：照明装置包括安装在导热壳体上并电连接到电路板的多个发光源。壳体包括与电路板间隔开的基部，以及设置在电路板和壳体的基部之间的中间散热结构，用于通过对流促进冷却。多个发光源与中间散热结构热连通。

5. 发明申请

US20080121900A1 Light emitter assembly 有权
标题翻译：发光器组件
公开(公告)号：US20080121900A1
公开(公告)日：2008-05-29
申请号：US11700349
申请日：2007-01-30
申请人： Kai Chiu Wu , Ming Lu , Chak Hau Pang
发明人： Kai Chiu Wu , Ming Lu , Chak Hau Pang
IPC分类号： H01L33/00
CPC分类号： F21K9/23 , F21V29/767 , F21V29/773 , F21V29/83 , F21Y2107/60 , F21Y2115/10 , H05K1/0203 , H05K1/144 , H05K2201/09027 , H05K2201/09063 , H05K2201/10295
摘要： A plurality of disc-shaped substrates carry light emitters and are axially stacked, spaced apart, in a metal housing to dissipate the heat produced by the light emitters. The housing comprises mutually connected elongate planar ribs that abut the light emitters or substrates for thermally connecting the light emitters to the housing. The ribs have shoulders. The substrates are received between the ribs and abut the shoulders. The shoulders are positioned proximate each light emitter in intimate contact with the substrate for efficient heat dissipation.
摘要翻译：多个盘状基板携带发光体并且在金属壳体中轴向堆叠间隔开以散发由发光体产生的热量。壳体包括相互连接的细长平面肋，其邻接发光器或基板，用于将发光体热连接到壳体。肋骨有肩膀。基板被接收在肋之间并且邻接肩部。肩部位于每个光发射器附近，与基板紧密接触以有效散热。

6. 外观设计

USD684545S1 Miniature surface mount device 有权
标题翻译：微型表面贴装装置
公开(公告)号：USD684545S1
公开(公告)日：2013-06-18
申请号：US29386582
申请日：2011-03-02
申请人： Chi Keung Chan , Chak Hau Pang , Fei Hong Li , David Todd Emerson
设计人： Chi Keung Chan , Chak Hau Pang , Fei Hong Li , David Todd Emerson

7. 发明申请

US20120132937A1 WATERPROOF SURFACE MOUNT DEVICE PACKAGE AND METHOD 有权
标题翻译：防水表面安装设备包装和方法
公开(公告)号：US20120132937A1
公开(公告)日：2012-05-31
申请号：US12957225
申请日：2010-11-30
申请人： ALEX CHI KEUNG CHAN , Charles Chak Hau Pang , Li Fei Hong
发明人： ALEX CHI KEUNG CHAN , Charles Chak Hau Pang , Li Fei Hong
IPC分类号： H01L27/15 , H01L33/56
CPC分类号： H01L25/0753 , H01L24/73 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48097 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/09701 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.
摘要翻译：本发明涉及使用具有改进的结构完整性的防水和抗UV封装的LED封装和方法。在一些实施例中，通过引线框架中的各种特征来提供改进的结构完整性，即壳体材料包围以改善引线框架和套管之间的粘合性，用于更强的防水封装。而且，在一些实施例中，改进的结构完整性和防水性通过改善密封剂与外壳之间的粘合力进一步提供。一些实施方案还提供了改进的引线键合，其中控制和优化的引线键的长度，厚度和环路高度用于改善引线键合和密封剂之间的粘合性以及改进的可靠性。

8. 发明授权

US08901583B2 Surface mount device thin package 有权
标题翻译：表面贴装器件薄封装
公开(公告)号：US08901583B2
公开(公告)日：2014-12-02
申请号：US12758702
申请日：2010-04-12
申请人： Alex Chi Keung Chan , Charles Chak Hau Pang , Ruan Fei Fei
发明人： Alex Chi Keung Chan , Charles Chak Hau Pang , Ruan Fei Fei
IPC分类号： H01L33/62 , H01L33/48 , H01L25/075 , H01L33/64
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/486 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/09701 , H01L2924/00014 , H01L2924/00
摘要： The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.
摘要翻译：本发明涉及利用具有改进的结构完整性，发射特性和可定制属性的薄/低轮廓LED封装的LED封装和LED显示器。在一些实施例中，改进的结构完整性由引线框架中的与壳体配合以用于更强封装的各种特征提供。此外，在一些实施例中，改进的发射特性由诸如形状和深度的空腔特征提供，其分别提供用于多个LED芯片的增加的表面结合面积和增加的视角。一些实施例还提供了具有可定制的用于使用较小封装的应用的顶部的分级封装，其底部包括与常规机械/电气支撑兼容的尺寸。

9. 发明申请

US20120104426A1 WHITE CERAMIC LED PACKAGE 审中-公开
标题翻译：白色陶瓷LED包装
公开(公告)号：US20120104426A1
公开(公告)日：2012-05-03
申请号：US12939096
申请日：2010-11-03
申请人： Alex Chi Keung Chan , Charles Chak Hau Pang , Victor Yue Kwong Lau
发明人： Alex Chi Keung Chan , Charles Chak Hau Pang , Victor Yue Kwong Lau
IPC分类号： H01L33/08 , H01L33/50 , H01L33/38
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/09701 , H01L2924/00014 , H01L2924/00
摘要： The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes. In some embodiments, the structural integrity of the package can also be attributed to indentations along its sides, which do not enable as much plating material to accumulate at the sides and helps package cutting processes during manufacture. The indentations can also contribute to displays having more tightly and densely packed LED arrays.
摘要翻译：本发明涉及使用白色陶瓷壳体和具有改进的颜色混合和结构完整性的薄/薄型封装的无引线LED封装和LED显示器。在一些实施例中，改进的颜色混合部分地由白色陶瓷封装壳体提供，其可以帮助将来自每个LED的光从许多方向反射离开设备。 LED的非线性布置也可以有助于改进色混合。改进的结构完整性可以通过与壳体配合以用于更强的封装结构的接合焊盘中的各种特征来提供。此外，在一些实施例中，每个封装的薄度/薄度归因于其无引线结构，其中焊盘和电极通过通孔电连接。在一些实施例中，包装的结构完整性也可以归因于其侧面的凹痕，其不能使得电镀材料能够在侧面积聚并且有助于在制造期间封装切割工艺。压痕还可以有助于具有更紧密和密集的LED阵列的显示器。

10. 发明申请

US20120025227A1 WATER RESISTANT SURFACE MOUNT DEVICE PACKAGE 有权
标题翻译：防水表面安装设备包装
公开(公告)号：US20120025227A1
公开(公告)日：2012-02-02
申请号：US13192293
申请日：2011-07-27
申请人： ALEX CHI KEUNG CHAN , Charles Chak Hau Pang
发明人： ALEX CHI KEUNG CHAN , Charles Chak Hau Pang
IPC分类号： H01L33/62
CPC分类号： H01L33/486 , H01L24/73 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/09701 , H01L2924/1815 , H01L2933/0033 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.
摘要翻译：本发明涉及使用具有改进的结构完整性和可定制属性的防水包装的LED封装和LED显示器。在一些实施例中，改进的结构完整性由引线框架中的各种特征提供，壳体材料包围以提高引线框架和套管之间的粘合性，以实现更强的防水封装。而且，在一些实施例中，改进的结构完整性和耐水性由腔体特征进一步提供，腔特征改善腔体和保护性密封剂之间的粘附性。一些实施例还提供具有比其侧面暴露的焊接引脚的长度更大的总体高度的封装，这改善了相邻封装之间的侧面暴露的焊接引脚的凝胶覆盖。

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