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1. 发明专利

JP2006052421A Lead-free tin-bismuth based alloy electroplating bath 有权
标题翻译：无铅锡合金电镀浴
公开(公告)号：JP2006052421A
公开(公告)日：2006-02-23
申请号：JP2004232959
申请日：2004-08-10
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To effectively prevent the substitute precipitation of bismuth to the surface of a tin or tin alloy anode at the time of plating treatment in a lead-free tin-bismuth based alloy electroplating bath.
SOLUTION: Regarding the lead-free tin-bismuth based alloy electroplating bath, in a tin-bismuth binary alloy electroplating bath comprising: a stannous salt; a bismuth salt; and various acids, a nonionic surfactant composed of an alkylene oxide adduct of a specified chemical structural species having a prescribed HLB (Hydrophile-Lypophile-Balance) such as distyrenated phenol polyalkoxylate having an HLB of 7.3 to 15.6 and a cis-9-octadecenylamine polyalkoxylate having an HLB of 2.8 to 16.6 or composed of the polyalkoxylate of ethylenediamine having a cloud point of 15 to 30°C is added. Since the nonionic surfactant of a specified chemical structure species having a prescribed HLB or cloud point is selectively added, the substitute precipitation of bismuth on the surface of an anode is prevented, and the consumption of bismuth in the bath is suppressed, thus the composition in the plating bath can be stabilized.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了在无铅锡 - 铋基合金电镀浴中有效地防止在电镀处理时锡或锡合金阳极的表面上的铋替代沉淀。解决方案：关于无铅锡 - 铋基合金电镀浴，在含有亚锡盐的锡 - 铋二元合金电镀浴中，铋盐和各种酸，具有规定的具有规定HLB（亲水亲油平衡）的化学结构物的烯化氧加合物如HLB为7.3至15.6的二苯乙烯化苯酚聚烷氧基化物和顺式-9-十八碳烯胺聚烷氧基化物的非离子表面活性剂 HLB为2.8〜16.6，或者由浊点为15〜30℃的乙二胺的聚烷氧基化物构成。由于选择性地添加具有规定的HLB或浊点的特定化学结构种类的非离子表面活性剂，因此可以防止铋在阳极表面上的替代沉淀，并且抑制沐浴中的铋的消耗，电镀液可以稳定。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006144073A Lead-free tin-silver based alloy or tin-copper based alloy electroplating bath 有权
标题翻译：无铅锡银合金或锡铜合金电镀浴
公开(公告)号：JP2006144073A
公开(公告)日：2006-06-08
申请号：JP2004335506
申请日：2004-11-19
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60
摘要： PROBLEM TO BE SOLVED: To effectively prevent the substitute precipitation of silver or copper onto the surface of a tin or tin alloy anode at the time of plating treatment in a lead-free tin-silver based alloy or tin-copper based alloy electroplating bath. SOLUTION: The lead-free tin-silver based alloy or tin-copper based alloy electroplating bath is obtained by adding a nonionic surfactant(s) selected from distyrenated phenol polyalkoxylate whose HLB(Hydrophile-Lypophile Balance) is 7.3 to 15.2, tristyrenated phenol polyalkoxylate whose HLB is 7.0 to 10.4, distyrenated cresol polyalkoxylate whose HLB is 8.2 to 15.0, and a tristyrenated cresol polyalkoxylate whose HLB is 7.7 to 13.9 to a tin-silver based alloy or tin-copper based alloy electroplating bath comprising a stannous salt, a silver or copper salt and various acids. Since the nonionic surfactant(s) with the specified chemical structural species having the prescribed HLB is selectively added, the substitute precipitation of silver or copper onto an anode surface is prevented, and the consumption of silver or copper in the bath is suppressed, thus the composition of the plating bath can be stabilized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了有效地防止在无铅锡 - 银基合金或锡 - 铜基合金中电镀处理时锡或铜在锡或锡合金阳极的表面上的替代沉淀电镀浴
解决方案：通过添加选自其中HLB（亲水亲油平衡平衡）为7.3〜15.2的二苯乙烯化苯酚聚烷氧基化物的非离子表面活性剂，得到无铅锡 - 银基合金或锡 - 铜基合金电镀浴， HLB为7.0〜10.4的三苯乙烯化苯酚聚烷氧基化物，HLB为8.2〜15.0的二苯乙烯化甲醇溶液，HLB为7.7〜13.9的三苯乙烯化甲醇溶液，其含锡亚锡盐或锡 - 铜系合金电镀浴，银或铜盐和各种酸。由于选择性地添加具有规定的HLB的特定化学结构种类的非离子表面活性剂，所以可以防止银或铜在阳极表面上的替代沉淀，并且抑制浴中的银或铜的消耗，因此镀液的组成可以稳定。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006104500A Electroless tinning method and pretreatment liquid for the tinning 有权
标题翻译：电熨斗方法和预处理液体
公开(公告)号：JP2006104500A
公开(公告)日：2006-04-20
申请号：JP2004289632
申请日：2004-10-01
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： INAI SHOYA , TANAKA KAORU
IPC分类号： C23C18/18 , C23C18/31
摘要： PROBLEM TO BE SOLVED: To improve a film appearance at the time of electroless tinning.
SOLUTION: In the electroless tinning method, the object to be plated is dipped into a neutral or weakly basic pretreatment liquid which contains a sulfur-based complexing agent(s) and does not contain acids, and thereafter, electroless plating is performed to the object to be plated using an electroless tinning liquid which contains a soluble stannous salt, an acid(s) and a sulfur-based complexing agent(s). Since the object to be plated is beforehand subjected to the dipping treatment using the pretreatment liquid which contains a sulfur-based complexing agent(s) such as thioureas and does not contain acids, the generation of stains and the unevenness in the color tone of a tin film obtained by the electroless plating can be effectively prevented, and, in particular, an excellent film appearance can be imparted even in the case of thick plating.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提高无电镀锡时的膜外观。解决方案：在无电镀方法中，将待镀物体浸入含有硫基络合剂且不含酸的中性或弱碱性预处理液体中，然后进行无电镀使用含有可溶性亚锡盐，酸和硫基络合剂的化学镀锡液体对被镀物体。由于要使用含硫基络合剂如硫脲的预处理液预先对待镀物进行浸渍处理，并且不含酸，因此产生污渍和色调不均匀可以有效地防止通过无电镀获得的锡膜，特别是即使在厚电镀的情况下也能赋予优异的膜外观。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2003342743A Electroless tinning bath 有权
标题翻译：电熨斗浴
公开(公告)号：JP2003342743A
公开(公告)日：2003-12-03
申请号：JP2002149257
申请日：2002-05-23
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： OKADA TAKASHI , INAI SHOYA
IPC分类号： C23C18/52
摘要： PROBLEM TO BE SOLVED: To effectively prevent the conversion of a thin film into abnormal grains and the excessive precipitation thereof in an electroless tinning bath consisting essentially of organic sulfonic acid, soluble stannous salt and tioureas.
SOLUTION: As for organic sulfonic acid, the anion part of organic sulfonic acid having a hydroxyl group in the molecule is not contained, also, the anion part of alkanesulfonic acid is not contained, organic acid having a hydroxyl group is a mixture satisfying the molar ratio of aromatic oxysulfonic acid/ alkanolsulfonic acid = 0 to 0.1 expressed in terms of anions, and the contained molar quantities per unit liter of soluble stannous salt and alkanolsulfonic acid (expressed in terms of anions) and thioureas satisfy Sn
2+ /alkanolsulfonic acid/ thioureas = 0.01 to 2/1.4 to 8/0.6 to 5. The occurrence of the abnormal grains of a tin film and the excessive precipitation thereof can be prevented since the anion part of alkanesulfonic acid is not present in a plating bath, and alkanolsulfonic acid or aromatic oxysulfonic acid in the range of a small amount with this are contained, and also, the three essential compositions are controlled to the prescribed contained molar quantities (per unit litre).
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了有效地防止在基本上由有机磺酸，可溶性亚锡盐和硫脲组成的化学镀锡浴中将薄膜转化成异常晶粒和过度沉淀。解决方案：对于有机磺酸，不包含分子中具有羟基的有机磺酸的阴离子部分，也不含烷基磺酸的阴离子部分，具有羟基的有机酸为混合物满足以阴离子表示的芳香族磺基磺酸/烷醇磺酸= 0〜0.1的摩尔比，每单位升可溶性亚锡盐和链烷醇磺酸（以阴离子表示）和硫脲的摩尔量满足Sn 2 + /链烷醇磺酸/硫脲= 0.01〜2 / 1.4〜8 / 0.6〜5。可以防止锡膜异常晶粒的发生及其过度析出，因为烷烃磺酸的阴离子部分为不存在于电镀槽中，并且含有少量的烷醇磺酸或芳香族磺基磺酸，并且将三种必需组合物控制为规定的含摩尔量（单位升）。版权所有（C）2004，JPO

5. 发明专利

JP2007169746A Post-processing method for electroless tin plating 有权
标题翻译：电镀镀层的后处理方法
公开(公告)号：JP2007169746A
公开(公告)日：2007-07-05
申请号：JP2005371697
申请日：2005-12-26
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： TANAKA KAORU , INAI SHOYA , ASAHI HIROSHI
IPC分类号： C23C18/31 , C23C18/16
摘要： PROBLEM TO BE SOLVED: To provide a post-processing method for electroless tin plating capable of preventing generation of white fine particles on a plated surface during the water rinsing after the tin plating without impairing the storage stability of the plated surface.
SOLUTION: The post-processing method for electroless tin plating performs the post-processing of cleaning a plated surface with an acid electroless tin plating liquid without any degradation different from a plating liquid used in a plating step after the plating step with the acid electroless tin plating liquid and before the water rinsing step in an electroless tin plating method for immersing an object to be plated in the acid electroless tin plating liquid, and water-rinsing and drying the object. Since the object is not water-rinsed immediately after the plating but cleaned with the electroless plating liquid without degradation, quadrivalent tin salt on a coating film is dissolved in the acid plating liquid, and removed from the coating film, and coagulation of white fine particles after water rinsing can be excellently prevented.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种无电镀锡的后处理方法，其能够在镀锡后的水洗过程中防止在电镀表面上产生白色细颗粒而不损害电镀表面的储存稳定性。解决方案：无电镀锡的后处理方法进行用酸性无电镀锡液清洗电镀表面的后处理，与电镀步骤中使用的电镀液相比，与酸性无电解锡电镀液，并且在用于将待镀物体浸渍在酸性无电镀锡液中的无电镀锡方法之前的水洗步骤之前，对该物体进行水洗和干燥。由于物体在电镀后立即不进行水洗，而是用化学镀液清洗而不会降解，涂膜上的四价锡盐溶解在镀酸液中，从涂膜上除去，白色细颗粒凝结水洗后可以很好地防止。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006206946A Silver plating bath for cuprous material 有权
标题翻译：用于铜质材料的镀银浴
公开(公告)号：JP2006206946A
公开(公告)日：2006-08-10
申请号：JP2005019187
申请日：2005-01-27
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA
IPC分类号： C23C18/42 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide a silver plating bath for cuprous material capable of depositing a white and dense silver film during the substitution silver plating on a copper-based material.
SOLUTION: The substitution silver plating bath contains soluble silver salt and base acid, and specified thioamino-carboxylic acid or its salt (methionine or the like), aliphatic mercapt carboxylic acid or its salt (mercapt succinic acid or the like), sulfides (2-(2-hydroxy ethyl thio) ethane sulphonic acid, 3, 6, 9-trithiaundecane-1, 11-disulphonic acid or the like), and thiourea derivatives (1,3-bis (3-pyridyl methyl)-2-thiourea or the like) are selected as a complexing agent. Since the specified sulfur-containing compound is used for the complexing agent, the electric potential difference of electrodes between the complexed copper ions and silver ions can be adequately adjusted, and a white and dense silver film can be obtained thereby.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为在铜基材料上的替代镀银期间提供能够沉积白色和致密银膜的亚铜材料的镀银浴。取代银镀液含有可溶性银盐和碱式酸，特定的硫代氨基羧酸或其盐（甲硫氨酸等），脂肪族硫醇羧酸或其盐（硫醇琥珀酸等），硫化物（2-（2-羟基乙基硫代）乙烷磺酸，3,6,9-三硫代十一烷-1,11-二磺酸等）和硫脲衍生物（1,3-双（3-吡啶基甲基） - 2-硫脲等）作为络合剂。由于使用规定的含硫化合物作为络合剂，所以可以适当地调整配位铜离子与银离子之间的电极的电位差，由此可以得到白色致密的银膜。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2004068056A Electroless tinning bath 有权
公开(公告)号：JP2004068056A
公开(公告)日：2004-03-04
申请号：JP2002226530
申请日：2002-08-02
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： OKADA TAKASHI , INAI SHOYA
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To prevent the conversion of a tin film into abnormal grains and the excessive precipitation thereof in an electroless tinning bath fundamentally consisting of organic sulfonic acid, soluble stannous salt and thioureas.
SOLUTION: The organic sulfonic acid which comprises the anion part of an organic sulfonic acid having a hydroxyl group in the molecule, also does not comprise the anion part of alkane sulfonic acid, and has a hydroxyl group is a mixture satisfying aromatic oxysulfonic acid/alkanol sulfonic acid=0 to 0.44 molar ratio expressed in terms of an anion. Hypophosphorous acids are comprised in a bath, and the content molar ratio between soluble stannous salt (Sn
2+ ) and hypophosphorous acids, Sn
2+ /hypophosphorous acids≥0.21. In the plating bath, alkane sulfonic acid is not present, and alkanol sulfonic acid or aromatic oxysulfonic acid within a prescribed range are comprised, and also, the content molar ratio between hypophosphorous acids and Sn
2+ is controlled to the prescribed one, so that the production of the abnormal grains of a thin film and the excessive precipitation thereof can be prevented.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2007084875A Bath for displacement silver plating 有权
标题翻译：浴位置镀银
公开(公告)号：JP2007084875A
公开(公告)日：2007-04-05
申请号：JP2005274715
申请日：2005-09-21
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： INAI SHOYA , HAGA MASAKI , TANAKA KAORU
IPC分类号： C23C18/42
摘要： PROBLEM TO BE SOLVED: To provide a plated silver film which shows an attractive appearance of a silvery white color with luster, by a process of displacement silver plating.
SOLUTION: In a bath for displacement silver plating containing a soluble silver salt and a complexing agent formed of a sulfur-containing compound such as a thiourea, a sulfide and a mercaptan, the bath for displacement silver plating further includes at least one phosphoric acid selected from the group consisting of orthophosphoric acid, condensed phosphoric acid and salts thereof, in an amount of 0.5 mol/L or more. Thereby obtained silver film shows the attractive appearance of a silvery white color with luster, because the particular phosphoric acid of a predetermined concentration or higher contained in the bath prevents the silver film from blackening or causing the unevenness of a color tone.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过置换镀银的方法来提供镀银银膜，其通过光泽显示出银白色的有吸引力的外观。解决方案：在含有可溶性银盐和由硫脲，硫化物和硫醇等含硫化合物形成的络合剂的置换镀覆浴中，位移镀银用浴还包括至少一种选自正磷酸，缩合磷酸及其盐的磷酸的用量为0.5mol / L以上。由此得到的银膜由于具有光泽的银白色的吸引人的外观，因为包含在浴中的预定浓度或更高的特定磷酸防止银膜变黑或引起色调不均匀。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2004277814A Method for division-preserving electroless tinning bath 有权
公开(公告)号：JP2004277814A
公开(公告)日：2004-10-07
申请号：JP2003070858
申请日：2003-03-14
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： TANAKA KAORU , INAI SHOYA
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To preserve an electroless tinning bath while maintaining excellent long-term stability during preservation and excellent secular stability during the tinning operation. SOLUTION: In the division-preserving method to preserve electroless tinning bath, tinning solution is divided into first solution containing decomposable elements and second solution containing remaining elements, or decomposable elements are divided into first solution and second solution. The first solution is preserved by adding only decomposable elements thereto or further adding other elements thereto, and the second solution is preserved by further adding remaining bath elements. When the bath is used, the first solution and the second solution are mixed to realize the bath. Preferably, hypophosphorous acids as decomposable elements of small amount (for example, 0.01-0.15 mole/L) not less than the optimum lower limit are added in the first solution together with soluble stannous salt, and remaining thick hypophosphorous acids and remaining bath elements are preserved in the second solution. Thioureas can be applied in place of hypophosphorous acids in this division preservation. COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2004176139A Pretreatment method to electroless tin based plating, and method for preventing abnormal precipitation of tin based plating film 有权
标题翻译：电镀锡基镀层的预处理方法及防止锡基镀膜异常退火的方法
公开(公告)号：JP2004176139A
公开(公告)日：2004-06-24
申请号：JP2002344624
申请日：2002-11-27
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： INAI SHOYA , TANAKA KAORU
IPC分类号： C23C18/18 , C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide a method for preventing the occurrence of abnormal grains and surplus precipitation in an obtained tin based film when an object to be plated is dipped into a pretreatment liquid, and thereafter, electroless tin based plating is applied.
SOLUTION: In the pretreatment to electroless tin based plating, a pretreatment liquid comprising (A) phosphoric acids selected from orthophosphoric acid, metaphosphoric acid, pyrophosphoric acid, polyphosphoric acid, hypophosphoric acid, phosphorous acid or their salts, (B) an aliphatic carboxylic acid, and (C) an organic sulfonic acid is prepared, and the object to be plated is dipped into the pretreatment liquid. Since the object to be plated is dipped beforehand into the pretreatment liquid comprising specified phosphoric acids, aliphatic carboxylic acid and organic sulfonic acid, and is then subjected to the electroless tin based plating, by the simple treatment of the dipping, the abnormality in the precipitation of a tinning film or a tin alloy plating film such as a tin-silver alloy and a tin-bismuth alloy can effectively be prevented.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种当将待镀物体浸入预处理液体时，在获得的锡基膜中防止发生异常晶粒和多余析出的方法，然后施加无电镀锡基电镀。（A）选自正磷酸，偏磷酸，焦磷酸，多磷酸，次磷酸，亚磷酸或它们的盐中的磷酸的预处理液，（B）脂肪族羧酸和（C）有机磺酸，将被镀物浸入预处理液中。由于要镀覆的物体预先浸入包含特定磷酸，脂族羧酸和有机磺酸的预处理液中，然后通过简单处理浸渍进行无电镀锡，镀层中的沉淀异常的镀锡膜或锡合金镀膜如锡 - 银合金和锡 - 铋合金可以有效地防止。版权所有（C）2004，JPO

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