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    • 1. 发明授权
    • Power management and control module and liquid crystal display device
    • 电源管理和控制模块及液晶显示装置
    • US08624524B2
    • 2014-01-07
    • US13278276
    • 2011-10-21
    • Kang-Yi LiuChao-Chieh ChenChia-Ming WuChao-Kai Huang
    • Kang-Yi LiuChao-Chieh ChenChia-Ming WuChao-Kai Huang
    • G05F1/00
    • G09G3/3406G09G3/3648G09G2330/02
    • A power management and control module adapted for a liquid crystal display device includes a boost-type DC/DC topology circuit, a LED dimming control circuit and a multiplexer. The boost-type DC/DC topology circuit has a voltage output terminal electrically connected with a logic high power supply terminal of a gate driving circuit and a power supply terminal of a LED backlight source. The LED dimming control circuit is electrically connected with the LED backlight source for dimming operation. A first and second data input terminals of the multiplexer are electrically connected to the voltage output terminal through a first and second feedback networks respectively. The LED backlight source is electrically connected in the second feedback network. A data output terminal of the multiplexer is electrically connected to the boost-type DC/DC topology circuit and alternatively communicated with the first or second data input terminal to provide a feedback input voltage.
    • 适用于液晶显示装置的电源管理和控制模块包括升压型DC / DC拓扑电路,LED调光控制电路和多路复用器。 升压型DC / DC拓扑电路具有与栅极驱动电路的逻辑高电源端子和LED背光源的电源端子电连接的电压输出端子。 LED调光控制电路与LED背光源电连接,用于调光操作。 复用器的第一和第二数据输入端分别通过第一和第二反馈网络电连接到电压输出端子。 LED背光源在第二反馈网络中电连接。 多路复用器的数据输出端电连接到升压型DC / DC拓扑电路,或者与第一或第二数据输入端通信以提供反馈输入电压。
    • 2. 发明申请
    • POWER MANAGEMENT AND CONTROL MODULE AND LIQUID CRYSTAL DISPLAY DEVICE
    • 电源管理和控制模块和液晶显示设备
    • US20120146520A1
    • 2012-06-14
    • US13278276
    • 2011-10-21
    • Kang-Yi LIUChao-Chieh ChenChia-Ming WuChao-Kai Huang
    • Kang-Yi LIUChao-Chieh ChenChia-Ming WuChao-Kai Huang
    • H05B37/02
    • G09G3/3406G09G3/3648G09G2330/02
    • A power management and control module adapted for a liquid crystal display device includes a boost-type DC/DC topology circuit, a LED dimming control circuit and a multiplexer. The boost-type DC/DC topology circuit has a voltage output terminal electrically connected with a logic high power supply terminal of a gate driving circuit and a power supply terminal of a LED backlight source. The LED dimming control circuit is electrically connected with the LED backlight source for dimming operation. A first and second data input terminals of the multiplexer are electrically connected to the voltage output terminal through a first and second feedback networks respectively. The LED backlight source is electrically connected in the second feedback network. A data output terminal of the multiplexer is electrically connected to the boost-type DC/DC topology circuit and alternatively communicated with the first or second data input terminal to provide a feedback input voltage.
    • 适用于液晶显示装置的电源管理和控制模块包括升压型DC / DC拓扑电路,LED调光控制电路和多路复用器。 升压型DC / DC拓扑电路具有与栅极驱动电路的逻辑高电源端子和LED背光源的电源端子电连接的电压输出端子。 LED调光控制电路与LED背光源电连接,用于调光操作。 复用器的第一和第二数据输入端分别通过第一和第二反馈网络电连接到电压输出端子。 LED背光源在第二反馈网络中电连接。 多路复用器的数据输出端电连接到升压型DC / DC拓扑电路,或者与第一或第二数据输入端通信以提供反馈输入电压。
    • 4. 发明授权
    • Dynamic hard disk mapping method and server using the same
    • 动态硬盘映射方法和服务器使用相同
    • US08856441B2
    • 2014-10-07
    • US13441936
    • 2012-04-09
    • Chia-Ming WuWen-Cheng Huang
    • Chia-Ming WuWen-Cheng Huang
    • G06F12/00
    • G06F3/0607G06F3/0632G06F3/0683
    • A dynamic hard disk mapping method and a server using the same are disclosed. The server includes a first motherboard, a second motherboard, a first disk group corresponding to the first motherboard, and a second disk group corresponding to the second motherboard. In the dynamic hard disk mapping method, at first, a disk redistributing instruction is received and stored. Thereafter, a reset instruction is received and performed. Then, the number of hard disks of the first disk group and the number of hard disks of the second disk group are summed up to obtain a total hard disk number N, wherein N is a positive integer greater than zero. Thereafter, the disk redistributing instruction is read, and a redistribution computation is performed in accordance with the disk redistributing instruction to obtain a third disk group corresponding to the first motherboard and a fourth disk group corresponding to the second motherboard.
    • 公开了动态硬盘映射方法和使用其的服务器。 服务器包括第一主板,第二主板,对应于第一主板的第一磁盘组以及对应于第二主板的第二磁盘组。 在动态硬盘映射方法中,首先接收并存储磁盘重分发指令。 此后,接收并执行复位指令。 然后,将第一磁盘组的硬盘数和第二磁盘组的硬盘数相加,以获得总硬盘数N,其中N是大于零的正整数。 此后,读取盘再分配指令,并根据盘再分配指令执行再分配计算,以获得对应于第一主板的第三盘组和对应于第二主板的第四盘组。
    • 6. 发明申请
    • Chip package and chip packaging method
    • 芯片封装和芯片封装方法
    • US20080087975A1
    • 2008-04-17
    • US11581444
    • 2006-10-17
    • Chia-Shuai ChangCheng-Lung ChuangChia-Ming Wu
    • Chia-Shuai ChangCheng-Lung ChuangChia-Ming Wu
    • H01L31/0203H01L21/00
    • H04N5/2257H01L27/14618H01L31/0203H01L31/02325H01L2224/48091H01L2224/48227H04N5/2253H04N5/2254H01L2924/00014
    • A chip package and a chip packaging method for use in optical applications are disclosed. The packaging method includes the steps of: a) providing a substrate having a first surface and a second surface; b) bonding first passive devices on the first surface; c) adhering a first chip to the first surface; d) forming a protection cover over the first surface for covering the first passive devices and the first chip; e) bonding second passive devices on the second surface; f) adhering a second chip to the second surface; g) providing a lid assembly having a frame with an opening window and pillars for contacting with the second surface; h) laminating the lid assembly on the second passive devices and the second chip such that gaps are formed between the frame and edges of the second surface; and i) filling a filler into the gaps to seal the second passive devices and the second chip in the lid assembly.
    • 公开了一种用于光学应用的芯片封装和芯片封装方法。 包装方法包括以下步骤:a)提供具有第一表面和第二表面的基底; b)在第一表面上粘合第一无源器件; c)将第一芯片粘附到第一表面; d)在所述第一表面上形成用于覆盖所述第一无源器件和所述第一芯片的保护盖; e)在第二表面上粘合第二无源器件; f)将第二芯片粘附到第二表面; g)提供具有带有开口窗的框架和用于与第二表面接触的支柱的盖组件; h)将盖组件层叠在第二无源器件和第二芯片上,使得在框架和第二表面的边缘之间形成间隙; 以及i)将填料填充到间隙中以密封盖组件中的第二无源器件和第二芯片。
    • 7. 发明申请
    • Image sensing module and process for packaging the same
    • 图像传感模块及其包装过程
    • US20070029466A1
    • 2007-02-08
    • US11483779
    • 2006-07-11
    • Chia-Shuai ChangChia-Ming Wu
    • Chia-Shuai ChangChia-Ming Wu
    • H01L27/00
    • H01L27/14618H01L27/14625H01L31/0203H01L2224/48091H01L2224/48227H01L2924/19105H01L2924/00014
    • An image sensing module includes: a substrate provided with at least two holes at comers and along edges thereof, a plurality of electrically conductive pads arranged in parallel along the edges of the substrate, a plurality of component mounting areas arranged in parallel on the substrate, a plurality of surface mounting components, each of which is mounted on each of the plurality of component mounting areas, an image sensing component mounted on the substrate and surrounded by the plurality of electrically conductive pads and the plurality of the component mounting areas, a cover provided with at least two positioning posts on one face thereof in correspondence with the holes to form a cavity enclosing the plurality of the electrically conductive pads and the plurality of the component mounting areas, the cover being further provided with at least two holes at comers and along edges on the other face thereof, a window fixed on the cover for isolating the module from its surroundings and allowing light to transmit there through, and a lens holder provided with at least two positioning posts for connecting with the holes of the cover.
    • 图像感测模块包括:基板,其沿着边缘设置有至少两个孔,沿着所述基板的边缘平行布置的多个导电焊盘,平行布置在所述基板上的多个部件安装区域, 多个表面安装部件,每个表面安装部件安装在多个部件安装区域中的每一个上;安装在基板上并由多个导电焊盘和多个部件安装区域包围的图像传感部件, 在其一个表面上设置有与所述孔对应的至少两个定位柱,以形成封闭所述多个导电垫和所述多个部件安装区域的空腔,所述盖还在所述角部处设置有至少两个孔, 沿着另一面的边缘,固定在盖上用于将模块与其周围隔离的窗口 并且允许光通过其透射;以及透镜保持器,其设置有至少两个用于与盖的孔连接的定位柱。
    • 8. 发明授权
    • Method for forming contact hole
    • 形成接触孔的方法
    • US08709946B2
    • 2014-04-29
    • US13364252
    • 2012-02-01
    • Meng-Feng TsaiYi-Shiang ChangChia-Chi LinI-Hsin ChenChia-Ming Wu
    • Meng-Feng TsaiYi-Shiang ChangChia-Chi LinI-Hsin ChenChia-Ming Wu
    • H01L21/44
    • H01L21/76816H01L21/0273H01L21/0337H01L21/0338H01L21/31144
    • A method for forming contact holes includes following steps. A substrate including a dense region and an isolation region is provided. A material layer is formed on the substrate. Sacrificed patterns are formed on the material layer in the dense region, wherein there is a first opening between the two adjacent sacrificed patterns. A spacer is formed on each of two sides of each of the sacrificed patterns, wherein the spacers are separated from each other. The sacrificed patterns are removed to form a second opening between two adjacent spacers. A planar layer is formed to fill up the second openings. A first slit is formed in the planar layer, wherein the first slit exposes a portion of the material layer under the second openings. The portion of the material layer exposed by the first slit is removed to form third openings in the material layer.
    • 形成接触孔的方法包括以下步骤。 提供了包括密集区域和隔离区域的衬底。 在基板上形成材料层。 牺牲图案形成在致密区域的材料层上,其中在两个相邻的牺牲图案之间存在第一开口。 在每个牺牲图案的两侧的每一侧上形成间隔件,其中间隔件彼此分离。 去除牺牲的图案以在两个相邻间隔物之间​​形成第二开口。 形成平面层以填充第二开口。 第一狭缝形成在平面层中,其中第一狭缝暴露第二开口下方的材料层的一部分。 去除由第一狭缝暴露的材料层的部分以在材料层中形成第三开口。
    • 9. 发明申请
    • METHOD FOR FORMING CONTACT HOLE
    • 形成接触孔的方法
    • US20130137270A1
    • 2013-05-30
    • US13364252
    • 2012-02-01
    • Meng-Feng TsaiYi-Shiang ChangChia-Chi LinI-Hsin ChenChia-Ming Wu
    • Meng-Feng TsaiYi-Shiang ChangChia-Chi LinI-Hsin ChenChia-Ming Wu
    • H01L21/32
    • H01L21/76816H01L21/0273H01L21/0337H01L21/0338H01L21/31144
    • A method for forming contact holes includes following steps. A substrate including a dense region and an isolation region is provided. A material layer is formed on the substrate. Sacrificed patterns are formed on the material layer in the dense region, wherein there is a first opening between the two adjacent sacrificed patterns. A spacer is formed on each of two sides of each of the sacrificed patterns, wherein the spacers are separated from each other. The sacrificed patterns are removed to form a second opening between two adjacent spacers. A planar layer is formed to fill up the second openings. A first slit is formed in the planar layer, wherein the first slit exposes a portion of the material layer under the second openings. The portion of the material layer exposed by the first slit is removed to form third openings in the material layer.
    • 形成接触孔的方法包括以下步骤。 提供了包括密集区域和隔离区域的衬底。 在基板上形成材料层。 牺牲图案形成在致密区域的材料层上,其中在两个相邻的牺牲图案之间存在第一开口。 在每个牺牲图案的两侧的每一侧上形成间隔件,其中间隔件彼此分离。 去除牺牲的图案以在两个相邻间隔物之间​​形成第二开口。 形成平面层以填充第二开口。 第一狭缝形成在平面层中,其中第一狭缝暴露第二开口下方的材料层的一部分。 去除由第一狭缝暴露的材料层的部分以在材料层中形成第三开口。