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1. 发明授权

US07388192B2 Image sensing module and process for packaging the same 失效
标题翻译：图像传感模块及其包装过程
公开(公告)号：US07388192B2
公开(公告)日：2008-06-17
申请号：US11483779
申请日：2006-07-11
申请人： Chia-Shuai Chang , Chia-Ming Wu
发明人： Chia-Shuai Chang , Chia-Ming Wu
IPC分类号： H01J5/02 , H01J40/14 , H04N5/225 , G03B17/02 , H01L23/02
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/00014
摘要： An image sensing module includes: a substrate provided with at least two holes at corners and along edges thereof, a plurality of electrically conductive pads arranged in parallel along the edges of the substrate, a plurality of component mounting areas arranged in parallel on the substrate, a plurality of surface mounting components, each of which is mounted on each of the plurality of component mounting areas, an image sensing component mounted on the substrate and surrounded by the plurality of electrically conductive pads and the plurality of the component mounting areas, a cover provided with at least two positioning posts on one face thereof in correspondence with the holes to form a cavity enclosing the plurality of the electrically conductive pads and the plurality of the component mounting areas, the cover being further provided with at least two holes at corners and along edges on the other face thereof, a window fixed on the cover for isolating the module from its surroundings and allowing light to transmit there through, and a lens holder provided with at least two positioning posts for connecting with the holes of the cover.
摘要翻译：图像感测模块包括：在拐角和边缘处设置有至少两个孔的基板，沿着基板的边缘平行布置的多个导电焊盘，平行布置在基板上的多个部件安装区域，多个表面安装部件，每个表面安装部件安装在多个部件安装区域中的每一个上;安装在基板上并由多个导电焊盘和多个部件安装区域包围的图像传感部件，在其一个表面上设置有至少两个与所述孔对应的定位柱，以形成封闭所述多个导电垫和所述多个部件安装区域的空腔，所述盖还在拐角处设置有至少两个孔，沿着另一面的边缘，固定在盖上的窗口，用于将模块与其周边隔离并且允许光通过其传输，以及透镜保持器，其设置有至少两个用于与盖的孔连接的定位柱。

2. 发明申请

US20080099866A1 Image sensing module and method for packaging the same 审中-公开
标题翻译：图像传感模块及其封装方法
公开(公告)号：US20080099866A1
公开(公告)日：2008-05-01
申请号：US11585917
申请日：2006-10-25
申请人： Chia-Shuai Chang , Cheng-Lung Chuang , Chia-Ming Wu
发明人： Chia-Shuai Chang , Cheng-Lung Chuang , Chia-Ming Wu
IPC分类号： H01L31/0203 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14685 , H01L2924/0002 , H04N5/2253 , H04N5/2257 , H01L2924/00
摘要： An image sensing module and a method for packaging the same are disclosed. Meanwhile, the packaging method includes the steps of a) providing a substrate; b) forming plural passive devices on the substrate; c) adhering a chip on the substrate and bonding thereon; d) providing a ring frame, wherein the ring frame includes an opening window and plural pillars for contacting with the substrate; e) adhering a glass piece on the opening window to form a lid assembly; f) covering the lid assembly on the substrate, wherein the plural pillars contacting with the substrate, the plural passive devices and the chip are covered by the lid assembly, and plural gaps are formed between the ring frame and edges of the substrate; and g) filling a filler into the plural gaps to seal the plural passive devices and the chip in the lid assembly and the substrate.
摘要翻译：公开了一种图像感测模块及其封装方法。同时，包装方法包括以下步骤：a）提供衬底; b）在衬底上形成多个无源器件; c）将芯片粘附在基板上并在其上粘接; d）提供环形框架，其中所述环形框架包括开口窗和用于与所述基板接触的多个柱; e）将玻璃片粘贴在开口窗上以形成盖组件; f）覆盖基板上的盖组件，其中与基板接触的多个支柱，多个无源装置和芯片被盖组件覆盖，并且在框架和基板的边缘之间形成多个间隙; 并且g）将填充物填充到所述多个间隙中以密封所述盖组件和所述基板中的所述多个被动装置和所述芯片。

3. 发明申请

US20100025793A1 Assembly for image sensing chip and assembling method thereof 审中-公开
标题翻译：图像传感芯片组装及其组装方法
公开(公告)号：US20100025793A1
公开(公告)日：2010-02-04
申请号：US12222094
申请日：2008-08-01
申请人： Chia-Shuai Chang , Chia-Ming Wu
发明人： Chia-Shuai Chang , Chia-Ming Wu
IPC分类号： H01L33/00 , H01J5/02 , H05K3/30
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , Y10T29/4913 , H01L2224/0401
摘要： An assembly for an image sensing chip to reduce the entire thickness and an assembling method thereof are disclosed. Meanwhile, the electro-optical assembly includes an image sensing chip; and a multi-layer printed circuit board having a recess to accommodate the image sensing chip, thereby decreasing the entire electro-optical assembly in thickness. The image sensing chip further includes a holder mounted on the multi-layer printed circuit board for protecting the image sensing chip and a lens mounted on the holder for being pervious to light.
摘要翻译：公开了一种用于减小整个厚度的图像感测芯片的组件及其组装方法。同时，电光学组件包括图像感测芯片; 以及具有用于容纳图像感测芯片的凹部的多层印刷电路板，从而使整个电光学组件的厚度减小。图像感测芯片还包括安装在多层印刷电路板上用于保护图像感测芯片的保持器和安装在保持器上用于透过光的透镜。

4. 发明申请

US20080308889A1 Image sensing module and method for packaging the same 审中-公开
公开(公告)号：US20080308889A1
公开(公告)日：2008-12-18
申请号：US12153198
申请日：2008-05-15
申请人： Chia-Shuai CHANG , Cheng-Lung CHUANG , Chia-Ming WU
发明人： Chia-Shuai CHANG , Cheng-Lung CHUANG , Chia-Ming WU
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14685 , H01L2924/0002 , H04N5/2253 , H04N5/2257 , H01L2924/00
摘要： An image sensing module and a method for packaging the same are disclosed. Meanwhile, the packaging method includes the steps of a) providing a substrate; b) forming plural passive devices on the substrate; c) adhering a chip on the substrate and bonding thereon; d) providing a ring frame, wherein the ring frame includes an opening window and plural pillars for contacting with the substrate; e) adhering a glass piece on the opening window to form a lid assembly; f) covering the lid assembly on the substrate, wherein the plural pillars contacting with the substrate, the plural passive devices and the chip are covered by the lid assembly, and plural gaps are formed between the ring frame and edges of the substrate; and g) filling a filler into the plural gaps to seal the plural passive devices and the chip in the lid assembly and the substrate.

5. 发明申请

US20080087975A1 Chip package and chip packaging method 审中-公开
标题翻译：芯片封装和芯片封装方法
公开(公告)号：US20080087975A1
公开(公告)日：2008-04-17
申请号：US11581444
申请日：2006-10-17
申请人： Chia-Shuai Chang , Cheng-Lung Chuang , Chia-Ming Wu
发明人： Chia-Shuai Chang , Cheng-Lung Chuang , Chia-Ming Wu
IPC分类号： H01L31/0203 , H01L21/00
CPC分类号： H04N5/2257 , H01L27/14618 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H04N5/2253 , H04N5/2254 , H01L2924/00014
摘要： A chip package and a chip packaging method for use in optical applications are disclosed. The packaging method includes the steps of: a) providing a substrate having a first surface and a second surface; b) bonding first passive devices on the first surface; c) adhering a first chip to the first surface; d) forming a protection cover over the first surface for covering the first passive devices and the first chip; e) bonding second passive devices on the second surface; f) adhering a second chip to the second surface; g) providing a lid assembly having a frame with an opening window and pillars for contacting with the second surface; h) laminating the lid assembly on the second passive devices and the second chip such that gaps are formed between the frame and edges of the second surface; and i) filling a filler into the gaps to seal the second passive devices and the second chip in the lid assembly.
摘要翻译：公开了一种用于光学应用的芯片封装和芯片封装方法。包装方法包括以下步骤：a）提供具有第一表面和第二表面的基底; b）在第一表面上粘合第一无源器件; c）将第一芯片粘附到第一表面; d）在所述第一表面上形成用于覆盖所述第一无源器件和所述第一芯片的保护盖; e）在第二表面上粘合第二无源器件; f）将第二芯片粘附到第二表面; g）提供具有带有开口窗的框架和用于与第二表面接触的支柱的盖组件; h）将盖组件层叠在第二无源器件和第二芯片上，使得在框架和第二表面的边缘之间形成间隙; 以及i）将填料填充到间隙中以密封盖组件中的第二无源器件和第二芯片。

6. 发明申请

US20070029466A1 Image sensing module and process for packaging the same 失效
标题翻译：图像传感模块及其包装过程
公开(公告)号：US20070029466A1
公开(公告)日：2007-02-08
申请号：US11483779
申请日：2006-07-11
申请人： Chia-Shuai Chang , Chia-Ming Wu
发明人： Chia-Shuai Chang , Chia-Ming Wu
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/00014
摘要： An image sensing module includes: a substrate provided with at least two holes at comers and along edges thereof, a plurality of electrically conductive pads arranged in parallel along the edges of the substrate, a plurality of component mounting areas arranged in parallel on the substrate, a plurality of surface mounting components, each of which is mounted on each of the plurality of component mounting areas, an image sensing component mounted on the substrate and surrounded by the plurality of electrically conductive pads and the plurality of the component mounting areas, a cover provided with at least two positioning posts on one face thereof in correspondence with the holes to form a cavity enclosing the plurality of the electrically conductive pads and the plurality of the component mounting areas, the cover being further provided with at least two holes at comers and along edges on the other face thereof, a window fixed on the cover for isolating the module from its surroundings and allowing light to transmit there through, and a lens holder provided with at least two positioning posts for connecting with the holes of the cover.
摘要翻译：图像感测模块包括：基板，其沿着边缘设置有至少两个孔，沿着所述基板的边缘平行布置的多个导电焊盘，平行布置在所述基板上的多个部件安装区域，多个表面安装部件，每个表面安装部件安装在多个部件安装区域中的每一个上;安装在基板上并由多个导电焊盘和多个部件安装区域包围的图像传感部件，在其一个表面上设置有与所述孔对应的至少两个定位柱，以形成封闭所述多个导电垫和所述多个部件安装区域的空腔，所述盖还在所述角部处设置有至少两个孔，沿着另一面的边缘，固定在盖上用于将模块与其周围隔离的窗口并且允许光通过其透射;以及透镜保持器，其设置有至少两个用于与盖的孔连接的定位柱。

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