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81. 发明授权

US08200058B2 Light guide and light guide structure 有权
标题翻译：光导和导光结构
公开(公告)号：US08200058B2
公开(公告)日：2012-06-12
申请号：US12447355
申请日：2006-11-16
申请人： Koji Choki , Tetsuya Mori , Keizo Takahama , Makoto Fujiwara , Kei Watanabe , Hiroshi Owari
发明人： Koji Choki , Tetsuya Mori , Keizo Takahama , Makoto Fujiwara , Kei Watanabe , Hiroshi Owari
IPC分类号： G02B6/10 , G02B6/00
CPC分类号： G02B6/1221 , C08L51/003 , C08L53/00 , G02B1/045 , G02B6/138 , G02B6/43 , C08L2666/02
摘要： An optical waveguide structure has excellent heat resistance and a low water absorbing property and can be manufactured with a low material cost. Such an optical waveguide structure includes: an optical waveguide having two surfaces, a core layer including core portions and cladding portions each having a refractive index lower than that of each of the core portions, the core layer having two surfaces, and cladding layers provided so as to make contact with the two surfaces of the core layer and having a refractive index lower than that of each of the core portions; and conductor layers provided on the two surfaces of the optical waveguide. In the optical waveguide structure, each of the cladding layers is formed of a norbornene-based polymer as a major component thereof. Further, it is preferred that the norbornene-based polymer is composed of molecules each represented by the following formula 1 as a major component thereof: wherein R is an alkyl group having a carbon number of 1 to 10, “a” is an integer of 0 to 3, “b” is an integer of 1 to 3, and “p”/“q” is 20 or less.
摘要翻译：光波导结构具有优异的耐热性和低吸水性，并且可以以低的材料成本制造。这种光波导结构包括：具有两个表面的光波导，芯层包括芯部和折射率低于每个芯部的折射率的包层部分，芯层具有两个表面，并且包层设置为与核心层的两个表面接触并具有比每个芯部的折射率低的折射率; 以及设置在光波导的两个表面上的导体层。在光波导结构中，每个包覆层由降冰片烯系聚合物作为其主要成分构成。此外，降冰片烯系聚合物优选由以下式1表示的分子作为其主要成分：其中，R为碳数为1〜10的烷基，“a”为 0〜3，“b”为1〜3的整数，“p”/“q”为20以下。

82. 发明授权

US08186613B2 Device and method for cutting and winding a tubular resin film 失效
标题翻译：用于切割和卷绕管状树脂膜的装置和方法
公开(公告)号：US08186613B2
公开(公告)日：2012-05-29
申请号：US11991298
申请日：2006-06-06
申请人： Toyotaro Maruyama , Masanori Ikenaga , Takeshi Takeuchi
发明人： Toyotaro Maruyama , Masanori Ikenaga , Takeshi Takeuchi
IPC分类号： B65H23/24
CPC分类号： B26D3/162 , B26D5/00 , B26D7/086 , B29C55/285 , B65H18/00 , B65H35/00 , B65H67/0405 , B65H2701/11214 , B65H2701/1752
摘要： A device and method are provided for continuously manufacturing a thermoplastic resin film product of any width having a small film thickness and uniform flat surface at an excellent yield.A tubular resin film cutting and winding device for cutting a tubular resin film 1a into a helical shape and winding a long film 1b, comprising a cutting device having a cutting member 2 for cutting a tubular resin film 1a; a winding device 4 for winding the cut long film 1b; and a guide rollers 3 for guiding the cut long film to the winding device, wherein the cutting member 2 and the guide rollers 3 have a mechanism for rotation in the circumferential direction of the tubular resin film.
摘要翻译：提供一种以优异的产率连续制造具有薄膜厚度和均匀平坦表面的任何宽度的热塑性树脂薄膜产品的装置和方法。一种用于将管状树脂膜1a切割成螺旋形并卷绕长膜1b的管状树脂膜切割和卷绕装置，包括具有用于切割管状树脂膜1a的切割构件2的切割装置; 用于缠绕切割的长膜1b的卷绕装置4; 以及用于将切割的长膜引导到卷绕装置的导辊3，其中切割构件2和导辊3具有用于在管状树脂膜的周向上旋转的机构。

83. 发明申请

US20120068106A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME 失效
标题翻译：树脂组合物和使用它的半导体器件
公开(公告)号：US20120068106A1
公开(公告)日：2012-03-22
申请号：US13307289
申请日：2011-11-30
申请人： Hikaru OKUBO , Nobuki Tanaka , Itaru Watanabe
发明人： Hikaru OKUBO , Nobuki Tanaka , Itaru Watanabe
IPC分类号： C09J4/06 , C09J9/02 , C09J9/00
CPC分类号： C08F220/58 , C08F234/02 , C08G73/12 , C08K3/08 , C08K3/26 , C08K5/0025 , C08K5/14 , C08L79/085 , C09J179/08 , C09J201/025 , H01L23/145 , H01L23/3737 , H01L24/29 , H01L24/83 , H01L2224/29111 , H01L2224/2919 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/1579 , H01L2924/181 , H01L2924/30105 , H01L2924/00 , H01L2924/3512 , H01L2924/00015
摘要： A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property.A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
摘要翻译：用于快速固化并可用于常规使用的烘箱中的固化的树脂组合物，以及当树脂组合物用作半导体芯片附着材料时，具有优异的可焊性抗裂性等可靠性的半导体器件。进一步优选具有足够的低应力性，良好的粘合性和优异的渗出性的树脂组合物。一种树脂组合物，其包含填料（A），包含由式（1）表示的结构的化合物（B）和由式（2）表示的官能团和热自由基引发剂（C），并且基本上不含光聚合引发剂。

84. 发明授权

US08088580B2 RNA detection method 有权
标题翻译： RNA检测方法
公开(公告)号：US08088580B2
公开(公告)日：2012-01-03
申请号：US12227904
申请日：2007-06-01
申请人： Kenji Kinoshita , Kanehisa Yokoyama , Kentaro Fujimoto , Toru Yakabe , Shin Saito , Kazuhiko Fujiwara
发明人： Kenji Kinoshita , Kanehisa Yokoyama , Kentaro Fujimoto , Toru Yakabe , Shin Saito , Kazuhiko Fujiwara
IPC分类号： C12Q1/68 , C12P19/34 , C07H21/02 , C07H21/04
CPC分类号： C12Q1/6837
摘要： The present invention provides an RNA detection method detecting, from a reaction system containing a target sample, a target RNA chain originated from the target sample, using a surface having on the surface thereof a polymer substance which contains a first unit having a group derived from a phosphate ester composing the hydrophilic portion of a phospholipid and a second unit having a carboxylic acid derivative group composed of an electron-attractive substitutional group bound to a carbonyl group, while being provided with at least one reaction space, the reaction space having an immobilized nucleic acid primer immobilized therein.
摘要翻译：本发明提供一种RNA检测方法，其从含有目标样品的反应体系中检测源自目标样品的靶RNA链，其表面上具有含有第一单元的表面，该第一单元含有来自构成磷脂的亲水部分的磷酸酯和具有由与羰基结合的吸电子取代基组成的羧酸衍生物基团的第二单元，同时具有至少一个反应空间，所述反应空间具有固定化的固定在其中的核酸引物。

85. 发明授权

US07964687B2 Oxylamino group-containing compound and polymer 有权
标题翻译：含氧基氨基的化合物和聚合物
公开(公告)号：US07964687B2
公开(公告)日：2011-06-21
申请号：US11660985
申请日：2005-07-07
申请人： Shinichiro Nishimura , Hideyuki Shimaoka
发明人： Shinichiro Nishimura , Hideyuki Shimaoka
IPC分类号： C08F120/58
CPC分类号： C08F220/60 , C07C291/04 , C08F222/1006
摘要： An oxylamino group-containing compound represented by the following formula: R1—B-A-B—R2, wherein R1 represents a polymerizable group, R2 represents an oxylamino group-containing group or an oxylamino derivative-containing group, B represents an ester linkage or an amide linkage, and A represents an optionally substituted alkylene group having 2 to 12 carbon atoms.
摘要翻译：由下式表示的含氧基氨基的化合物：R1-BAB-R2，其中R1表示可聚合基团，R2表示含氧基氨基的基团或含氧基氨基衍生物的基团，B表示酯键或酰胺键 A表示任选取代的碳原子数2〜12的亚烷基。

86. 发明授权

US07964410B2 Method for preparing analysis sample, analysis sample and sugar chain capture agent 失效
标题翻译：分析样品，分析样品和糖链捕获剂的制备方法
公开(公告)号：US07964410B2
公开(公告)日：2011-06-21
申请号：US12224953
申请日：2007-03-13
申请人： Hideyuki Shimaoka , Hiromitsu Kuramoto , Shinichiro Nishimura , Yasuro Shinohara , Yoshiaki Miura , Jun-ichi Furukawa
发明人： Hideyuki Shimaoka , Hiromitsu Kuramoto , Shinichiro Nishimura , Yasuro Shinohara , Yoshiaki Miura , Jun-ichi Furukawa
IPC分类号： G01N33/00
CPC分类号： C07K1/22 , C07B2200/05 , C07B2200/11 , C07C323/60 , C07K5/0806 , Y10T436/143333 , Y10T436/17 , Y10T436/18 , Y10T436/182 , Y10T436/25 , Y10T436/25125
摘要： A method for preparing an analysis sample which involves the sugar chain capture step comprising a reaction of capturing a sugar chain and/or a sugar derivative from a biological sample by using a sugar chain capture agent and the excision step comprising excising a compound containing a moiety capturing the sugar chain and/or the sugar derivative from the sugar chain capture agent after the completion of the sugar chain capture reaction and releasing the compound.
摘要翻译：一种制备包含糖链捕获步骤的分析样品的方法，其包括通过使用糖链捕获剂从生物样品捕获糖链和/或糖衍生物的反应，并且所述切除步骤包括切除含有部分的化合物在糖链捕获反应完成后从糖链捕获剂捕获糖链和/或糖衍生物并释放该化合物。

87. 发明授权

US07893542B2 Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board 失效
标题翻译：倒装芯片半导体封装，堆积层材料，密封树脂组合物和电路板的连接结构
公开(公告)号：US07893542B2
公开(公告)日：2011-02-22
申请号：US12309110
申请日：2008-03-28
申请人： Kenya Tachibana , Masahiro Wada , Takuya Hatao
发明人： Kenya Tachibana , Masahiro Wada , Takuya Hatao
IPC分类号： H01L23/29
CPC分类号： H05K1/0271 , H01L21/563 , H01L23/293 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L2224/16 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K3/305 , H05K3/4602 , H05K2201/068 , H05K2201/10674 , H05K2201/10977 , H01L2924/00
摘要： The invention provides a connecting structure for a flip-chip semiconductor package in which cracking and delamination are inhibited or reduced to improve reliability, and in which the potential range of designs is expanded for the inner circuitry of circuit boards and the inductance is reduced. The invention is a connecting structure for a flip-chip semiconductor package, including: a circuit board having a core layer and at least one build-up layer; a semiconductor element connected via metal bumps to the circuit board; and a sealing resin composition with which gaps between the semiconductor element and circuit board are filled, wherein a cured product of the sealing resin composition has a glass transition temperature between 60° C. and 150° C. and a coefficient of linear expansion from room temperature to the glass transition temperature being between 15 ppm/° C. and 35 ppm/° C., a cured product of the build-up layer has a the glass transition temperature of at least 170° C. and a coefficient of linear expansion in the in-plane direction up to the glass transition temperature being not more than 40 ppm/° C., and stacked vias are provided in the build-up layer on at least one side of the core layer.
摘要翻译：本发明提供了一种用于倒装芯片半导体封装的连接结构，其中抑制或减少裂纹和分层以提高可靠性，并且其中电路板的内部电路扩展了设计的电位范围并且电感被减小。本发明是用于倒装芯片半导体封装的连接结构，包括：具有芯层和至少一个堆积层的电路板; 通过金属凸块连接到电路板的半导体元件; 以及密封树脂组合物，其中填充有半导体元件和电路板之间的间隙，其中密封树脂组合物的固化产物的玻璃化转变温度为60℃至150℃，并且室内线性膨胀系数温度至玻璃化转变温度在15ppm /℃至35ppm /℃之间，积聚层的固化产物的玻璃化转变温度至少为170℃，线膨胀系数在面内方向直到玻璃化转变温度为40ppm /℃以下，堆积通孔设置在芯层的至少一侧上的堆积层中。

88. 发明授权

US07863347B2 Resin composition, varnish, resin film and semiconductor device using the same 失效
标题翻译：树脂组合物，清漆，树脂膜和使用其的半导体器件
公开(公告)号：US07863347B2
公开(公告)日：2011-01-04
申请号：US12294592
申请日：2007-03-16
申请人： Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
发明人： Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
IPC分类号： C08G63/44 , C08G63/52 , C08G65/50 , C08G69/26 , C08G73/10 , C08G73/22 , C08L101/02
CPC分类号： H01L21/02118 , C08G63/19 , C08L65/00 , H01L21/02282 , H01L21/312
摘要： A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond, —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.
摘要翻译：提供一种树脂组合物，其包含具有由式（1）表示的结构的化合物和交联剂：其中在式（1）中，R 0为单键或具有由式（2）表示的结构; R1至R8分别是氢，具有脂环结构的基团，除具有脂环结构，羟基和羧基的基团以外的具有1〜10个碳原子的有机基团中的任一个。 “X”为-O-，-NHCO-，-CONH - ， - COO-和-OCO-; 此外，式（2）中，“Ar”为芳香族基团， “Y”为单键，-O - ， - S - ， - OCO-和-COO-; “q”为1以上的整数，当“q”为2以上的整数时，R 9为氢或碳原子数为1以上的有机基团，可以相同或不同，当R 0为单键时，R 1至R 8中的至少一个为具有脂环结构的基团; 当R 0具有由式（2）表示的结构时，R 1至R 9中的至少一个为具有脂环结构的基团。 “*”和“**”表示与不同化学结构键合的位置。

89. 发明授权

US07851514B2 Process for producing regenerated resin, regenerated resin, processing recovered matter from resin composition, regenerated resin composition and method of regenerating resin composition 有权
标题翻译：生产再生树脂，再生树脂，树脂组合物处理回收物的方法，再生树脂组合物和再生树脂组合物的方法
公开(公告)号：US07851514B2
公开(公告)日：2010-12-14
申请号：US11991729
申请日：2005-09-12
申请人： Junya Goto , Masaki Ishikawa , Kazunori Shimoyachi
发明人： Junya Goto , Masaki Ishikawa , Kazunori Shimoyachi
IPC分类号： C08J11/04 , C08G63/02
CPC分类号： C08J11/18 , C08J11/24 , C08J2361/04 , C08J2361/28 , C08J2363/00 , Y02P20/544 , Y02W30/706
摘要： The invention provides a process for producing a recycled resin, which includes: a first step of decomposing a resin composition containing a thermosetting resin in a supercritical or subcritical solvent having a monomer constituting the thermosetting resin or a derivative thereof as an essential component and a second step of adding a polyfunctional compound thereto to process; a recycled resin or a processed and recovered matter obtained according to the process for producing; a recycled resin composition formed from a recycled resin and/or a processed and recovered matter of the resin composition; and a method for recycling a resin composition, which reuses said recycled resin and/or said processed and recovered matter of a resin composition as a raw material of a recycled resin composition.
摘要翻译：本发明提供一种再生树脂的制造方法，其特征在于，包括：在具有构成所述热固性树脂的单体或其衍生物作为主要成分的超临界或亚临界溶剂中分解含有热固性树脂的树脂组合物的第一工序，向其中加入多官能化合物的步骤; 回收树脂或根据生产方法获得的加工和回收物质; 由树脂组合物的再循环树脂和/或经处理和回收的物质形成的回收树脂组合物; 以及再循环利用树脂组合物作为再生树脂组合物的原料的树脂组合物的再利用方法，该树脂组合物使所述再循环树脂和/或所述加工回收物质再利用。

90. 发明申请

US20090118431A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME 失效
标题翻译：树脂组合物，VARNISH，树脂膜和使用其的半导体器件
公开(公告)号：US20090118431A1
公开(公告)日：2009-05-07
申请号：US12294592
申请日：2007-03-16
申请人： Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
发明人： Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
IPC分类号： C08G69/48 , C08F283/00 , C08F16/00 , C08F126/06 , C08F8/32
CPC分类号： H01L21/02118 , C08G63/19 , C08L65/00 , H01L21/02282 , H01L21/312
摘要： A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same.In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.
摘要翻译：本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，其树脂膜和使用其的半导体器件。在本发明中，通过包含具有式（1）所示结构的化合物和交联剂的树脂组合物实现目的：其中在式（1）中，R 0为单键或具有由式 2）; R1至R8分别是氢，具有脂环结构的基团，除具有脂环结构，羟基和羧基的基团以外的具有1〜10个碳原子的有机基团中的任一个。 “X”为-O-，-NHCO-，-CONH - ， - COO-和-OCO-; 此外，式（2）中，“Ar”为芳香族基团， “Y”是单键-O - ， - S - ， - OCO-和-COO-; “q”为1以上的整数，当“q”为2以上的整数时，R 9为氢或碳原子数为1以上的有机基团，可以相同或不同，当R 0为单键时，R 1至R 8中的至少一个为具有脂环结构的基团; 当R 0具有由式（2）表示的结构时，R 1至R 9中的至少一个为具有脂环结构的基团。 “*”和“**”表示与不同化学结构键合的位置。

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