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1. 发明授权

US07863347B2 Resin composition, varnish, resin film and semiconductor device using the same 失效
标题翻译：树脂组合物，清漆，树脂膜和使用其的半导体器件
公开(公告)号：US07863347B2
公开(公告)日：2011-01-04
申请号：US12294592
申请日：2007-03-16
申请人： Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
发明人： Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
IPC分类号： C08G63/44 , C08G63/52 , C08G65/50 , C08G69/26 , C08G73/10 , C08G73/22 , C08L101/02
CPC分类号： H01L21/02118 , C08G63/19 , C08L65/00 , H01L21/02282 , H01L21/312
摘要： A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond, —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.
摘要翻译：提供一种树脂组合物，其包含具有由式（1）表示的结构的化合物和交联剂：其中在式（1）中，R 0为单键或具有由式（2）表示的结构; R1至R8分别是氢，具有脂环结构的基团，除具有脂环结构，羟基和羧基的基团以外的具有1〜10个碳原子的有机基团中的任一个。 “X”为-O-，-NHCO-，-CONH - ， - COO-和-OCO-; 此外，式（2）中，“Ar”为芳香族基团， “Y”为单键，-O - ， - S - ， - OCO-和-COO-; “q”为1以上的整数，当“q”为2以上的整数时，R 9为氢或碳原子数为1以上的有机基团，可以相同或不同，当R 0为单键时，R 1至R 8中的至少一个为具有脂环结构的基团; 当R 0具有由式（2）表示的结构时，R 1至R 9中的至少一个为具有脂环结构的基团。 “*”和“**”表示与不同化学结构键合的位置。

2. 发明申请

US20090118431A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME 失效
标题翻译：树脂组合物，VARNISH，树脂膜和使用其的半导体器件
公开(公告)号：US20090118431A1
公开(公告)日：2009-05-07
申请号：US12294592
申请日：2007-03-16
申请人： Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
发明人： Kazuyoshi Fujita , Atsushi Izumi , Yumiko Yamanoi , Takahiro Harada , Hiromi Oki , Yukiharu Ono
IPC分类号： C08G69/48 , C08F283/00 , C08F16/00 , C08F126/06 , C08F8/32
CPC分类号： H01L21/02118 , C08G63/19 , C08L65/00 , H01L21/02282 , H01L21/312
摘要： A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same.In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.
摘要翻译：本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，其树脂膜和使用其的半导体器件。在本发明中，通过包含具有式（1）所示结构的化合物和交联剂的树脂组合物实现目的：其中在式（1）中，R 0为单键或具有由式 2）; R1至R8分别是氢，具有脂环结构的基团，除具有脂环结构，羟基和羧基的基团以外的具有1〜10个碳原子的有机基团中的任一个。 “X”为-O-，-NHCO-，-CONH - ， - COO-和-OCO-; 此外，式（2）中，“Ar”为芳香族基团， “Y”是单键-O - ， - S - ， - OCO-和-COO-; “q”为1以上的整数，当“q”为2以上的整数时，R 9为氢或碳原子数为1以上的有机基团，可以相同或不同，当R 0为单键时，R 1至R 8中的至少一个为具有脂环结构的基团; 当R 0具有由式（2）表示的结构时，R 1至R 9中的至少一个为具有脂环结构的基团。 “*”和“**”表示与不同化学结构键合的位置。

3. 发明申请

US20080255335A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same 失效
标题翻译：树脂组合物，聚酰亚胺树脂组合物，聚苯并恶唑树脂组合物，清漆，树脂膜和使用其的半导体装置
公开(公告)号：US20080255335A1
公开(公告)日：2008-10-16
申请号：US11663854
申请日：2005-09-29
申请人： Takashi Enoki , Atsushi Izumi , Yumiko Yamamoto , Takahiro Harada
发明人： Takashi Enoki , Atsushi Izumi , Yumiko Yamamoto , Takahiro Harada
IPC分类号： C08G65/40
CPC分类号： C08L79/08 , C08L79/04 , C09D179/04 , C09D179/08 , H01L51/052
摘要： A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.
摘要翻译：通过具有由通式（1）表示的结构的化合物的树脂组合物提供热处理后的耐热性和介电常数低的树脂组合物，其清漆和使用该树脂组合物的半导体装置：其中“Ar “是一个芳香族群; “a”为0或1; R 11是具有一个或多个碳原子的有机基团，并且至少一个是具有脂环结构的基团; 当“q”为2以上的整数时，R 11彼此可以相同也可以不同， R 1至R 5中的至少一个和相应苯上的R 6至R 10中的至少一个环是Ar结合位点或R 11-11结合位点，其它R 1至R 5和R 6结合位点， R 1至R 10各自为氢，具有脂环结构的基团，具有1-10个碳原子的有机基团，羟基或羧基; 当“a”为0时，R 1至R 5和R 6至R 10中的至少一个为至少一个，是具有脂环结构的基团; “q”为1以上的整数， “X”是-O-，-NHCO-，-COHN-，-COO-和-OCO-中的任何一个。

4. 发明授权

US07652125B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same 失效
标题翻译：树脂组合物，聚酰亚胺树脂组合物，聚苯并恶唑树脂组合物，清漆，树脂膜和使用其的半导体器件
公开(公告)号：US07652125B2
公开(公告)日：2010-01-26
申请号：US11663854
申请日：2005-09-29
申请人： Takashi Enoki , Atsushi Izumi , Yumiko Yamamoto , Takahiro Harada
发明人： Takashi Enoki , Atsushi Izumi , Yumiko Yamamoto , Takahiro Harada
IPC分类号： C08G65/40 , C08G65/38
CPC分类号： C08L79/08 , C08L79/04 , C09D179/04 , C09D179/08 , H01L51/052
摘要： A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.
摘要翻译：通过具有由通式（1）表示的结构的化合物的树脂组合物提供热处理后的耐热性和介电常数低的树脂组合物，其清漆和使用该树脂组合物的半导体装置：其中“Ar “是一个芳香族群; “a”为0或1; R11是具有一个或多个碳原子的有机基团，并且至少一个是具有脂环结构的基团; 当“q”为2以上的整数时，R 11可以相同也可以不同， R 1〜R 5中的至少一个和各苯环上的R 6〜R 10中的至少一个为Ar结合位点或R 11结合位点，其中R 1〜R 5，R 6〜R 10为氢，具有脂环结构具有1-10个碳原子的有机基团，羟基或羧基; 当“a”为0时，R 1至R 5和R 6至R 10中的至少一个为具有脂环结构的基团; “q”为1以上的整数， “X”是-O-，-NHCO-，-COHN-，-COO-和-OCO-中的任何一个。

5. 发明授权

US08347497B2 Processing method, processing jig for cylinder block and the cylinder block 有权
标题翻译：加工方法，缸体加工夹具和气缸体
公开(公告)号：US08347497B2
公开(公告)日：2013-01-08
申请号：US12527642
申请日：2008-02-15
申请人： Takahiro Harada , Kazuhiro Asayama
发明人： Takahiro Harada , Kazuhiro Asayama
IPC分类号： B21K3/00 , F02F1/10 , F02B75/18
CPC分类号： B24B33/10 , B24B33/02 , F02F1/102 , Y10T29/49231 , Y10T29/4927 , Y10T29/49272 , Y10T29/5397
摘要： In a processing method for processing a cylinder block, a finish processing for the cylinder bore is performing, by pressing the portion of the bolt phase for fastening the cylinder head on the cylinder portion outer peripheral surface forming the inside surface of a water jacket, on the condition that the rigidity of the pressed portion on the cylinder portion toward the pressure from the side of the cylinder bore (the surface pressure from the grinding stones by honing process) is enhanced compared with the other portions.
摘要翻译：在用于处理气缸体的处理方法中，通过将用于将气缸盖紧固在形成水套的内表面的气缸部分外周面上的螺栓相的部分按压，进行气缸孔的精加工，条件是，与其他部分相比，气缸部分上的按压部分朝向气缸孔侧面的压力（来自珩磨过程中的磨石的表面压力）的刚度增强。

6. 发明申请

US20120142879A1 COMPOSITION FOR FILM FORMATION, INSULATING FILM AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于膜形成的组合物，绝缘膜和半导体器件
公开(公告)号：US20120142879A1
公开(公告)日：2012-06-07
申请号：US13386286
申请日：2010-06-25
申请人： Michio Nakajima , Hidenori Saito , Takahiro Harada , Mihoko Matsutani , Masahiro Tada , Koji Nakatani
发明人： Michio Nakajima , Hidenori Saito , Takahiro Harada , Mihoko Matsutani , Masahiro Tada , Koji Nakatani
IPC分类号： C08F238/00
CPC分类号： H01L23/5329 , H01L21/02118 , H01L21/02282 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A composition for film formation according to the present invention includes polymerizable compounds each having at least one polymerizable functional group, and the polymerizable compound includes a partial structure containing an adamantane type cage structure and at least one polymerizable reactive group contributing to polymerization reaction in one molecule thereof. Further, the polymerizable reactive group contains an aromatic ring and at least one ethynyl or vinyl group directly bonded to the aromatic ring as the polymerizable functional group, and the number of carbon atoms derived from the aromatic ring is in the range of 15 to 38% with respect to the number of total carbon atoms of the polymerizable compound.
摘要翻译：根据本发明的用于成膜的组合物包括各自具有至少一个可聚合官能团的可聚合化合物，并且可聚合化合物包括含有金刚烷型笼结构的部分结构和在一个分子中有助于聚合反应的至少一个可聚合反应基其中。此外，可聚合反应性基团含有芳香环和至少一个与芳环直接键合的乙炔基或乙烯基作为可聚合官能团，并且来自芳环的碳原子数在15至38％的范围内，相对于可聚合化合物的总碳原子数。

7. 发明申请

US20100171769A1 DISPLAY APPARATUS AND METHOD FOR DRIVING THE SAME 有权
标题翻译：显示装置及其驱动方法
公开(公告)号：US20100171769A1
公开(公告)日：2010-07-08
申请号：US12498961
申请日：2009-07-07
申请人： Tomomi Kamio , Takahiro Harada
发明人： Tomomi Kamio , Takahiro Harada
IPC分类号： G09G5/10
CPC分类号： G09G3/2085 , G02F1/134336 , G02F1/13624 , G02F1/136286 , G02F2001/134345 , G09G3/3648 , G09G2300/0426 , G09G2300/0443 , G09G2310/0205
摘要： A display apparatus according to an aspect of the invention includes a first scanning line disposed in a first direction, a second scanning line disposed to accompany the first scanning line, and a first signal line crossing the first and second scanning lines. The display apparatus also includes a first pixel electrode connected to the first signal line via a first switching element having a terminal that is connected to the first scanning line so that the first pixel electrode is applied with a gray scale signal under control of the first switching element, and a second pixel electrode connected to the first pixel electrode via a second switching element having a terminal that is connected to the second scanning line so that the second pixel electrode is applied with a gray scale signal through the first pixel electrode under control of the first switching element and the second switching element.
摘要翻译：根据本发明的一个方面的显示装置包括：沿第一方向设置的第一扫描线，设置成伴随第一扫描线的第二扫描线和与第一扫描线和第二扫描线交叉的第一信号线。显示装置还包括经由具有连接到第一扫描线的端子的第一开关元件连接到第一信号线的第一像素电极，使得第一像素电极在第一开关的控制下被施加灰度信号元件和第二像素电极，第二像素电极经由具有连接到第二扫描线的端子的第二开关元件连接到第一像素电极，使得第二像素电极通过第一像素电极施加灰度信号，在第一像素电极的控制下第一开关元件和第二开关元件。

8. 发明申请

US20090070079A1 Sliced data structure for particle-based simulation, and method for loading particle-based simulation using sliced data structure into GPU 有权
标题翻译：用于基于粒子的模拟的切片数据结构以及使用切片数据结构加载到GPU中的基于粒子的模拟的方法
公开(公告)号：US20090070079A1
公开(公告)日：2009-03-12
申请号：US12071118
申请日：2008-02-15
申请人： Takahiro Harada
发明人： Takahiro Harada
IPC分类号： G06F17/10
CPC分类号： G06F17/30592 , G06T15/005
摘要： The sliced data structure used for a particle-based simulation using a CPU or GPU is a data structure for a calculation space. The space is a three-dimensional calculation space constructed from numerous voxels; a plurality of slices perpendicular to the Y axis is formed; numerous voxels are divided by a plurality of two-dimensional slices; the respective starting coordinates of the maximum and minimum voxels are calculated for a range of voxels in which particles are present in each of a plurality of two-dimensional slices; the voxel range is determined as a bounding box surrounded by a rectangular shape; and memory is provided for the voxels contained in the bounding boxes of each of the plurality of two-dimensional slices.
摘要翻译：用于使用CPU或GPU的基于粒子的模拟的切片数据结构是计算空间的数据结构。空间是由许多体素构成的三维计算空间; 形成垂直于Y轴的多个切片; 许多体素被多个二维切片分割; 针对在多个二维切片中的每一个中存在粒子的体素的范围来计算最大和最小体素的相应起始坐标; 体素范围被确定为由矩形包围的边界框; 并且为包含在多个二维切片中的每一个的边界框中的体素提供记忆。

9. 发明申请

US20050199800A1 Mass spectrometer 有权
标题翻译：质谱仪
公开(公告)号：US20050199800A1
公开(公告)日：2005-09-15
申请号：US11074833
申请日：2005-03-09
申请人： Takahiro Harada
发明人： Takahiro Harada
IPC分类号： G01N27/62 , G01N30/72 , H01J49/04
CPC分类号： H01J49/167
摘要： The present invention provides a mass spectrometer including an ion source for atomizing a liquid sample into ionized droplets and spraying ions in a predetermined direction. According to the present invention, the ion source includes a gas transport pipe and a liquid supply pipe; the gas transport pipe has an ejection port at its front end and a gas supply passage for sending an assist gas to the ejection port; the inner surface of the gas supply passage has a tapered section located in proximity to the ejection port, where the diameter of the tapered section decreases toward the ejection port; the liquid supply pipe is inserted into the gas supply passage so that the front end of the liquid supply pipe is located in proximity to the ejection port; three or more spheres having the same size are inserted between the inner surface of the gas supply passage and the outer surface of the liquid supply pipe; and a pressing mechanism is used to press the spheres onto the tapered section. Being pressed by the pressing mechanism, the spheres move along the tapered section and come closer to the central axis of the liquid supply passage. The gas transport pipe and the liquid supply pipe form a duplex pipe structure having a high degree of coaxiality, which produces a stable flow of ions sprayed in the predetermined direction.
摘要翻译：本发明提供了一种质谱仪，其包括用于将液体样品雾化成电离液滴并沿预定方向喷射离子的离子源。根据本发明，离子源包括气体输送管和液体供给管; 气体输送管在其前端具有排出口和用于将辅助气体送到排出口的气体供给通道; 气体供给通道的内表面具有位于喷射口附近的锥形部分，其中锥形部分的直径朝向喷射口减小; 液体供给管被插入到供气通道中，使得液体供给管的前端位于排出口附近; 具有相同尺寸的三个或更多个球体插入在气体供应通道的内表面和液体供给管的外表面之间; 并且使用按压机构将球体按压到锥形部分上。通过按压机构按压，球体沿着锥形部分移动并靠近液体供应通道的中心轴线。气体输送管和液体供给管形成具有高同轴度的双重管结构，其产生沿预定方向喷射的稳定的离子流。

10. 发明授权

US09638132B2 Internal combustion engine 有权
公开(公告)号：US09638132B2
公开(公告)日：2017-05-02
申请号：US14423166
申请日：2013-08-28
申请人： Shinichi Kobayashi , Takahiro Harada
发明人： Shinichi Kobayashi , Takahiro Harada
IPC分类号： F02F1/36 , F01M11/02
CPC分类号： F02F1/36 , F01M11/02 , F01M2011/023
摘要： In an internal combustion engine, a first oil chamber includes a curved surface portion provided on the upstream side in an oil flow direction and an inclined surface portion provided on the downstream side. The engine is so constructed that oil drops from upper oil passages onto the curved surface portion on the upstream side of the first oil chamber and the inclined surface portion on the downstream side. The curved surface portion on the upstream side has a curved shape which is convex downward, and the inclined surface portion on the downstream side has a slope shape which is inclined downward with respect to the horizontal direction. The curved shape of the curved surface portion on the upstream side is connected to the inclined surface portion before a tangent line of the curved surface portion turns to the horizontal direction.

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