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1. 发明授权

US6114497A Polybenzoxazole resin and precursor thereof 有权
标题翻译：聚苯并恶唑树脂及其前体
公开(公告)号：US6114497A
公开(公告)日：2000-09-05
申请号：US427024
申请日：1999-10-26
申请人： Masahiro Tada , Mitsumoto Murayama , Takuya Hatao , Takashi Yamaji
发明人： Masahiro Tada , Mitsumoto Murayama , Takuya Hatao , Takashi Yamaji
IPC分类号： C08G73/22 , G03F7/004 , G03F7/023 , H05K1/00 , H05K1/03 , H05K3/28 , C08G73/24
CPC分类号： C08G73/22 , G03F7/0046 , G03F7/0233 , H05K1/0346 , H05K3/285 , H05K3/4676
摘要： Polybenzoxazole precursors are used to prepare resins with good electrical characteristics and thermal characteristics as well as low water absorption.
摘要翻译：聚苯并恶唑前体用于制备具有良好的电特性和热特性以及低吸水性的树脂。

2. 发明授权

US07893542B2 Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board 失效
标题翻译：倒装芯片半导体封装，堆积层材料，密封树脂组合物和电路板的连接结构
公开(公告)号：US07893542B2
公开(公告)日：2011-02-22
申请号：US12309110
申请日：2008-03-28
申请人： Kenya Tachibana , Masahiro Wada , Takuya Hatao
发明人： Kenya Tachibana , Masahiro Wada , Takuya Hatao
IPC分类号： H01L23/29
CPC分类号： H05K1/0271 , H01L21/563 , H01L23/293 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L2224/16 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K3/305 , H05K3/4602 , H05K2201/068 , H05K2201/10674 , H05K2201/10977 , H01L2924/00
摘要： The invention provides a connecting structure for a flip-chip semiconductor package in which cracking and delamination are inhibited or reduced to improve reliability, and in which the potential range of designs is expanded for the inner circuitry of circuit boards and the inductance is reduced. The invention is a connecting structure for a flip-chip semiconductor package, including: a circuit board having a core layer and at least one build-up layer; a semiconductor element connected via metal bumps to the circuit board; and a sealing resin composition with which gaps between the semiconductor element and circuit board are filled, wherein a cured product of the sealing resin composition has a glass transition temperature between 60° C. and 150° C. and a coefficient of linear expansion from room temperature to the glass transition temperature being between 15 ppm/° C. and 35 ppm/° C., a cured product of the build-up layer has a the glass transition temperature of at least 170° C. and a coefficient of linear expansion in the in-plane direction up to the glass transition temperature being not more than 40 ppm/° C., and stacked vias are provided in the build-up layer on at least one side of the core layer.
摘要翻译：本发明提供了一种用于倒装芯片半导体封装的连接结构，其中抑制或减少裂纹和分层以提高可靠性，并且其中电路板的内部电路扩展了设计的电位范围并且电感被减小。本发明是用于倒装芯片半导体封装的连接结构，包括：具有芯层和至少一个堆积层的电路板; 通过金属凸块连接到电路板的半导体元件; 以及密封树脂组合物，其中填充有半导体元件和电路板之间的间隙，其中密封树脂组合物的固化产物的玻璃化转变温度为60℃至150℃，并且室内线性膨胀系数温度至玻璃化转变温度在15ppm /℃至35ppm /℃之间，积聚层的固化产物的玻璃化转变温度至少为170℃，线膨胀系数在面内方向直到玻璃化转变温度为40ppm /℃以下，堆积通孔设置在芯层的至少一侧上的堆积层中。

3. 发明申请

US20090273073A1 CONNECTING STRUCTURE FOR FLIP-CHIP SEMICONDUCTOR PACKAGE, BUILD-UP LAYER MATERIAL, SEALING RESIN COMPOSITION, AND CIRCUIT BOARD 失效
标题翻译：贴片半导体封装，建筑材料，密封树脂组合物和电路板的连接结构
公开(公告)号：US20090273073A1
公开(公告)日：2009-11-05
申请号：US12309110
申请日：2008-03-28
申请人： Kenya Tachibana , Masahiro Wada , Takuya Hatao
发明人： Kenya Tachibana , Masahiro Wada , Takuya Hatao
IPC分类号： H01L23/498 , H05K1/16 , C08G65/04 , C08G65/38 , C08G18/00 , C08G73/06 , C08G73/10 , C08G61/08 , C08G73/14
CPC分类号： H05K1/0271 , H01L21/563 , H01L23/293 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L2224/16 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K3/305 , H05K3/4602 , H05K2201/068 , H05K2201/10674 , H05K2201/10977 , H01L2924/00
摘要： The invention provides a connecting structure for a flip-chip semiconductor package in which cracking and delamination are inhibited or reduced to improve reliability, and in which the potential range of designs is expanded for the inner circuitry of circuit boards and the inductance is reduced. The invention is a connecting structure for a flip-chip semiconductor package, including: a circuit board having a core layer and at least one build-up layer; a semiconductor element connected via metal bumps to the circuit board; and a sealing resin composition with which gaps between the semiconductor element and circuit board are filled, wherein a cured product of the sealing resin composition has a glass transition temperature between 60° C. and 150° C. and a coefficient of linear expansion from room temperature to the glass transition temperature being between 15 ppm/° C. and 35 ppm/° C., a cured product of the build-up layer has a the glass transition temperature of at least 170° C. and a coefficient of linear expansion in the in-plane direction up to the glass transition temperature being not more than 40 ppm/° C., and stacked vias are provided in the build-up layer on at least one side of the core layer.
摘要翻译：本发明提供了一种用于倒装芯片半导体封装的连接结构，其中抑制或减少裂纹和分层以提高可靠性，并且其中电路板的内部电路扩展了设计的电位范围并且减小了电感。本发明是用于倒装芯片半导体封装的连接结构，包括：具有芯层和至少一个堆积层的电路板; 通过金属凸块连接到电路板的半导体元件; 以及密封树脂组合物，其中填充有半导体元件和电路板之间的间隙，其中密封树脂组合物的固化产物的玻璃化转变温度为60℃至150℃，并且室内线性膨胀系数温度至玻璃化转变温度在15ppm /℃至35ppm /℃之间，积聚层的固化产物的玻璃化转变温度至少为170℃，线膨胀系数在面内方向直到玻璃化转变温度为40ppm /℃以下，堆积通孔设置在芯层的至少一侧上的堆积层中。

4. 发明授权

US06297351B1 Polybenzoxazole resin and precursor thereof 有权
标题翻译：聚苯并恶唑树脂及其前体
公开(公告)号：US06297351B1
公开(公告)日：2001-10-02
申请号：US09465004
申请日：1999-12-16
申请人： Mitsumoto Murayama , Toshimasa Egucih , Takashi Yamaji , Takuya Hatao , Nobuhiro Higashida , Yoko Mizumoto
发明人： Mitsumoto Murayama , Toshimasa Egucih , Takashi Yamaji , Takuya Hatao , Nobuhiro Higashida , Yoko Mizumoto
IPC分类号： C08G7324
CPC分类号： C08G73/22
摘要： A polybenzoxazole precursor having recurring units represented by the following general formula (1) and a polybenzoxazole resin having a structure obtained by cyclizing the polybenzoxazole precursor: wherein n denotes an integer of 1-1000, and (i) when X is selected from bivalent aromatic groups represented by the general formulas (2)-(4) defined in the specification each having two OR groups (Rs each denotes H or a monovalent organic group and may be the same or different), and the amide group in the formula (1) and the OR group respectively bond to the adjacent carbon atoms of the aromatic group, Y denotes a bivalent organic group containing fluorine; and (ii) when Y is selected from bivalent aromatic groups represented by the general formulas (5)-(7) defined in the specification, X denotes a bivalent aromatic group containing fluorine and having two OR groups (Rs each denotes H or a monovalent organic group and may be the same or different), and the amide group in the formula (1) and the OR group respectively bond to the adjacent carbon atoms of the aromatic group.
摘要翻译：具有由以下通式（1）表示的重复单元的聚苯并恶唑前体和具有通过使聚苯并恶唑前体环化获得的结构的聚苯并恶唑树脂：其中n表示1-1000的整数，和（i）当X选自二价芳族在本说明书中定义的通式（2） - （4）表示的各自具有两个OR基团的基团（Rs各自表示H或一价有机基团，可以相同或不同），式（1）中的酰胺基）和OR基分别与芳族基团的相邻碳原子键合，Y表示含氟的二价有机基团; 和（ii）当Y选自由说明书中定义的通式（5） - （7）表示的二价芳族基团时，X表示含氟并具有两个OR基团的二价芳族基团（Rs各自表示H或一价有机基团可以相同或不同），式（1）中的酰胺基和OR基分别与芳族基团的相邻碳原子键合。

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