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81. 发明申请

US20070146696A1 APPARATUS AND METHOD FOR TESTING DEFECTS 失效
标题翻译：测试缺陷的装置和方法
公开(公告)号：US20070146696A1
公开(公告)日：2007-06-28
申请号：US11681981
申请日：2007-03-05
申请人： Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
发明人： Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
IPC分类号： G01N21/88
CPC分类号： B82Y15/00 , G01N21/94 , G01N21/95623 , G01N21/95684 , G01N2021/8822 , G01R31/308 , H01J37/00 , H01J2237/022 , H01J2237/0225 , H01L21/67253 , H01L21/67288 , H01L21/681 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A method for detecting defects on a specimen includes mounting a specimen on a table with which is movable, obliquely projecting a laser as a line onto a surface of the specimen, detecting with an image sensor an image of light formed by light reflected from the specimen and passed through a filter which blocks scattered light resulting from repetitive patterns formed on the specimen, processing a signal outputted from the image sensor to extract defects of the specimen, and a displaying information of defects extracted by the signal processor.
摘要翻译：一种检测试样缺陷的方法，其特征在于，将试样安装在可移动的台面上，将作为线的激光线倾斜投射到试样的表面上，用图像传感器检测由试样反射的光形成的光的图像通过滤波器，该滤波器阻挡由样本上形成的重复图案产生的散射光，处理从图像传感器输出的信号，提取样本的缺陷，以及由信号处理器提取的缺陷的显示信息。

82. 发明申请

US20060243908A1 Method of inspecting a circuit pattern and inspecting instrument 失效
标题翻译：检查电路图案和检查仪器的方法
公开(公告)号：US20060243908A1
公开(公告)日：2006-11-02
申请号：US11452989
申请日：2006-06-15
申请人： Hiroyuki Shinada , Atsuko Takafuji , Takanori Ninomiya , Yuko Sasaki , Mari Nozoe , Hisaya Murakoshi , Taku Ninomiya , Yuji Kasai , Hiroshi Makino , Yutaka Kaneko , Kenji Tanimoto
发明人： Hiroyuki Shinada , Atsuko Takafuji , Takanori Ninomiya , Yuko Sasaki , Mari Nozoe , Hisaya Murakoshi , Taku Ninomiya , Yuji Kasai , Hiroshi Makino , Yutaka Kaneko , Kenji Tanimoto
IPC分类号： G21K7/00
CPC分类号： G01N23/225 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要： An apparatus for inspecting a sample using a scanning electron microscope includes a sample stage, a first electron-optical system to scan an electron beam of a first beam current on the sample, a second electron-optical system to scan an electron beam of a second beam current smaller than the first beam current on the sample, a mechanism to move the sample stage, a detector provided in each of the first and second electron-optical systems to detect a secondary electron. The first electron-optical system is operable in a first mode and the second electron-optical system is operable in a second mode with higher resolution than that of the first mode. In the first mode, the sample is observed while the sample stage is moved continuously, and in the second mode, the sample is observed by detecting a secondary electron using the detector while the sample stage is held stationary.
摘要翻译：使用扫描电子显微镜检查样品的装置包括样品台，用于扫描样品上的第一束电流的电子束的第一电子 - 光学系统，用于扫描第二电子束的电子束的第二电子 - 光学系统光束电流小于样品上的第一光束电流，移动样品台的机构，设置在每个第一和第二电子光学系统中的检测二次电子的检测器。第一电子 - 光学系统可在第一模式中操作，并且第二电子 - 光学系统可以以比第一模式更高的分辨率在第二模式中操作。在第一模式中，在样品台连续移动时观察样品，在第二模式中，通过在样品台保持静止时使用检测器检测二次电子来观察样品。

83. 发明授权

US07098055B2 Apparatus and method for testing defects 失效
公开(公告)号：US07098055B2
公开(公告)日：2006-08-29
申请号：US11244078
申请日：2005-10-06
申请人： Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
发明人： Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
IPC分类号： H01L21/66 , G01R31/26
CPC分类号： B82Y15/00 , G01N21/94 , G01N21/95623 , G01N21/95684 , G01N2021/8822 , G01R31/308 , H01J37/00 , H01J2237/022 , H01J2237/0225 , H01L21/67253 , H01L21/67288 , H01L21/681 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.

84. 发明授权

US06355570B1 Semiconductor manufacturing methods, plasma processing methods and plasma processing apparatuses 有权
公开(公告)号：US06355570B1
公开(公告)日：2002-03-12
申请号：US09260074
申请日：1999-03-02
申请人： Toshihiko Nakata , Takanori Ninomiya , Sachio Uto , Hiroyuki Nakano
发明人： Toshihiko Nakata , Takanori Ninomiya , Sachio Uto , Hiroyuki Nakano
IPC分类号： H01L21302
CPC分类号： G01N21/53 , G01N21/94 , G01N21/9501
摘要： The present invention provides a semiconductor manufacturing method, a plasma processing method and a plasma processing apparatus for generating a plasma in a processing chamber and carrying out processing on material to be processed by using the plasma, comprising a floating-foreign-particle measuring apparatus including: a light radiating optical system for radiating a light having a desired wavelength and completing intensity modulation at a desired frequency to the processing chamber; a scattered-light detecting optical system for separating a component with the desired wavelength from scattered lights obtained from the processing chamber as a result of radiation of the light by the light radiating optical system, for optically receiving the component and for converting the component into a first signal; and a foreign-particle-signal extracting unit which separates a second signal representing foreign particle floating in the plasma or in an area in proximity to the plasma from a third signal obtained by emission of the plasma for detection of the second signal by extraction of a component with the desired frequency used for the intensity modulation from the first signal obtained from the scattered-light detecting optical system.

85. 发明授权

US06236057B1 Method of inspecting pattern and apparatus thereof with a differential brightness image detection 有权
标题翻译：用差分亮度图像检测来检查图案及其装置的方法
公开(公告)号：US06236057B1
公开(公告)日：2001-05-22
申请号：US09610954
申请日：2000-07-06
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N2188
CPC分类号： G01N21/95607
摘要： A method and apparatus for inspecting a pattern, a first image of a first area on a sample is acquired by imaging the first area formed as a first pattern, and the first image is memorized. A second image of a second area on the sample is acquired by imaging the second area formed as a second pattern which is to be the same as the first pattern. A defect of the first pattern is detected by acquiring a differential image between the first image and the second image. The detection of the defect includes processing the differential image by using information of brightness corresponding to both of the first image and the second image.
摘要翻译：通过对形成为第一图案的第一区域进行成像，并记录第一图像来获取用于检查图案的样品的第一区域的第一图像的方法和装置。通过对形成为与第一图案相同的第二图案的第二区域成像来获取样品上的第二区域的第二图像。通过获取第一图像和第二图像之间的差分图像来检测第一图案的缺陷。缺陷的检测包括通过使用与第一图像和第二图像两者相对应的亮度的信息来处理差分图像。

86. 发明授权

US6087673A Method of inspecting pattern and apparatus thereof 失效
标题翻译：检查图案及其装置的方法
公开(公告)号：US6087673A
公开(公告)日：2000-07-11
申请号：US81636
申请日：1998-05-20
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N23/20 , G01N21/88 , G01N21/956 , G01N23/225 , G06T1/00 , H01L21/66
CPC分类号： G01N21/95607
摘要： In a method of inspecting a defect and an apparatus thereof, an allowable range for a gradation value of a difference image is determined for each pixel from one pixel or less of position shift quantity between two images to be compared, a variation rate in a local gradation value of an image, and a representative value of the local gradation value. Then, by comparing the gradation value of the difference image with the allowable range determined for each pixel, a pixel, on which the gradation value of the difference image is within the allowable range, is judged to be an non-defective candidate and a pixel, on which the gradation value of the difference image is beyond the allowable range, is judged to be a defective candidate. This reduces the number of false information caused by mismatches attributed to an object to be inspected and an image detecting system, such as an infinitesimal difference in pattern configuration, a difference in the gradation value, a distortion of a pattern, and a position shift, thus making it possible to detect a more minute defect.
摘要翻译：在检查缺陷的方法和装置中，针对要比较的两个图像之间的位置偏移量的一个像素或更少的像素，针对每个像素确定差分图像的灰度值的允许范围，局部变化率图像的灰度值和局部灰度值的代表值。然后，通过将差分图像的灰度值与对于每个像素确定的容许范围进行比较，将差分图像的灰度值在允许范围内的像素判断为无缺陷候选和像素，其中差分图像的灰度值超出允许范围，被判断为缺陷候选。这减少了归因于待检查对象的失配和图像检测系统引起的错误信息的数量，例如图案配置中的无穷小差异，灰度值的差异，图案的失真和位置偏移，从而可以检测到更小的缺陷。

87. 发明授权

US5883437A Method and apparatus for inspection and correction of wiring of electronic circuit and for manufacture thereof 失效
标题翻译：电子电路接线检查和校正方法及装置及其制造方法
公开(公告)号：US5883437A
公开(公告)日：1999-03-16
申请号：US580531
申请日：1995-12-28
申请人： Shigenobu Maruyama , Mikio Hongo , Satoru Todoroki , Masaaki Okunaka , Hideo Matsuzaki , Takanori Ninomiya , Kazushi Yoshimura , Fumikazu Ito
发明人： Shigenobu Maruyama , Mikio Hongo , Satoru Todoroki , Masaaki Okunaka , Hideo Matsuzaki , Takanori Ninomiya , Kazushi Yoshimura , Fumikazu Ito
IPC分类号： G02F1/1362 , H01L21/48 , H01L23/48 , H01L29/40 , H01L29/52
CPC分类号： G02F1/136286 , H01L21/485 , G02F2001/136254 , H01L2924/0002
摘要： A method and apparatus for inspecting wirings of an electronic circuit substrate to detect a defect in the wiring and for enabling correction thereof. The inspection method and apparatus include electrostatically coupling at least one electrode to a wiring pattern, applying a time varying voltage between the electrode and wiring pattern at different locations so as to detect a current flow and determine a defect by a variation in the detected current flow at the different locations and a portion of the defect. A defect in the form of a disconnected or half-disconnected point of the wiring may be corrected by supplying a solution of a metal complex to the disconnected or half-disconnected point, heating the solution and end point areas of the disconnected or half-disconnected point by laser light and precipitating a metal thin film establishing a connection of the wiring.
摘要翻译：一种用于检查电子电路基板的布线以检测布线中的缺陷并使其能够进行校正的方法和装置。检查方法和装置包括将至少一个电极静电耦合到布线图案，在不同位置在电极和布线图案之间施加时变电压，以便检测电流，并通过检测电流的变化来确定缺陷在不同的位置和缺陷的一部分。可以通过将金属复合物的溶液提供给断开或半断开的点来加热接头的断开或半断开点的形式的缺陷，加热解决方案和终点区域的断开或半断开通过激光点并沉淀建立连线的金属薄膜。

88. 发明授权

US5463667A Inspection method for soldered joints using x-ray imaging and apparatus therefor 失效
标题翻译：使用X射线成像的焊接接头的检查方法及其设备
公开(公告)号：US5463667A
公开(公告)日：1995-10-31
申请号：US53240
申请日：1993-04-28
申请人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
发明人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
IPC分类号： G01N23/04 , H01L21/66 , H01L23/50 , H05K3/34 , H05K13/08
CPC分类号： H05K13/08 , G01N23/04
摘要： A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detected X-ray, and determining a condition of the soldered joint based on the output signal of the detector. The apparatus may operate in the same fashion.
摘要翻译：一种用X射线检测焊接接头的方法和装置，所述焊接接头通过将引线焊接到基板的表面而形成。该方法可以包括移动基板以使基板的表面在XY平面中移动，以将焊接接头定位在XY平面中的期望位置，旋转基板以使基板的表面在XY平面中旋转将焊接接头定位在XY平面中所需的取向上，使X射线源和检测器围绕焊接接头在与XY平面垂直的两个相互垂直的平面中旋转，同时将X射线源和检测器保持在固定位置，以建立来自X射线源的X射线与衬底表面上的铅之间的期望的倾斜照射角度，用X射线源的X射线照射焊接接头所需的倾斜照射角度，使得X射线透射通过焊接接头和基板，通过检测器检测透过焊接接头和基板的X射线，检测器产品选择表示检测到的X射线的输出信号，以及基于检测器的输出信号确定焊接接头的状态。该装置可以以相同的方式操作。

89. 发明授权

US4953224A Pattern defects detection method and apparatus 失效
标题翻译：图案缺陷检测方法和装置
公开(公告)号：US4953224A
公开(公告)日：1990-08-28
申请号：US158125
申请日：1988-02-16
申请人： Toshiaki Ichinose , Takanori Ninomiya , Yasuo Nakagawa
发明人： Toshiaki Ichinose , Takanori Ninomiya , Yasuo Nakagawa
IPC分类号： G06T7/00 , G06K9/00
CPC分类号： G06T7/0006 , G06T2207/30141
摘要： A pattern defect detecting method and apparatus are disclosed on a connectivity processor to input a binary picture signal pattern and a pad position coordinate and outputting connectivity data between pads. Here, the connectivity processing refers to a processing for giving the identical number to one aggregation of connected or linked pads for the pads given to a serial pattern. In the connectivity processor wherein a plane on which the drawn pattern to be inspected is scanned by a linear sensor, the connectivity processing can be releazed almost concurrently with the scanning by driving a temporary memory.Also, a pattern defect detecting apparatus the above-mentioned connectivity. The invention processing coping with the difficulties of a required inspection level, and also represents a processing time of each embodiment theoretically. A moving time of the bed on which an inspecting object is placed and others are added to the real processing time.
摘要翻译：在连接性处理器上公开了一种图案缺陷检测方法和装置，用于输入二进制图像信号模式和焊盘位置坐标，并在焊盘之间输出连接数据。这里，连接处理是指给予给予串行模式的焊盘的连接或连接焊盘的一个聚合相同数量的处理。在其中通过线性传感器扫描要检查的绘制图案的平面的连接处理器中，可以通过驱动临时存储器几乎与扫描同时地进行连接处理。此外，图案缺陷检测装置具有上述连接性。本发明处理应对所需检查水平的困难，并且也表示理论上各实施例的处理时间。检查对象被放置的床的移动时间和其他被添加到实际处理时间。

90. 发明授权

US4641527A Inspection method and apparatus for joint junction states 失效
标题翻译：连接状态检查方法及装置
公开(公告)号：US4641527A
公开(公告)日：1987-02-10
申请号：US707501
申请日：1985-03-04
申请人： Takashi Hiroi , Takanori Ninomiya , Yasuo Nakagawa
发明人： Takashi Hiroi , Takanori Ninomiya , Yasuo Nakagawa
IPC分类号： G01N21/956 , G01R31/02 , G01N29/04
CPC分类号： G01R31/026 , G01N21/956 , G01N2021/479
摘要： An object to be inspected which is jointed to a circuit board is vibrated in a contactless manner by applying a gas jet or a magnetic force to the object, a laser beam is irradiated on the object, and a laser beam reflected from the object is detected by a linear sensor to observe a laser speckle pattern for the object. Quality of a joint junction state of the object is judged from the laser speckle pattern.
摘要翻译：通过对物体施加气体射流或磁力，将被检查物体接触电路板以非接触的方式振动，激光束被照射在物体上，检测从物体反射的激光束通过线性传感器观察物体的激光散斑图案。从激光斑纹图案判断物体的接合连接状态的质量。

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