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    • 85. 发明申请
    • Self-aligned lateral heterojunction bipolar transistor
    • 自对准横向异质结双极晶体管
    • US20050196931A1
    • 2005-09-08
    • US11123748
    • 2005-05-04
    • Jian LiLap ChanPurakh VermaJia ZhengShao-fu Chu
    • Jian LiLap ChanPurakh VermaJia ZhengShao-fu Chu
    • H01L21/331H01L29/737
    • H01L29/66242H01L29/737
    • A lateral heterojunction bipolar transistor (HBT), comprising a semiconductor substrate having having a first insulating layer over the semiconductor substrate. A base trench is formed in a first silicon layer over the first insulating layer to form a collector layer over an exposed portion of the semiconductor substrate and an emitter layer over the first insulating layer. A semiconductive layer is formed on the sidewalls of the base trench to form a collector structure in contact with the collector layer and an emitter structure in contact with the emitter layer. A base structure is formed in the base trench. A plurality of connections is formed through an interlevel dielectric layer to the collector layer, the emitter layer, and the base structure. The base structure preferably is a compound semiconductive material of silicon and at least one of silicon-germanium, silicon-germanium-carbon, and combinations thereof.
    • 一种横向异质结双极晶体管(HBT),包括在半导体衬底上具有第一绝缘层的半导体衬底。 基底沟槽形成在第一绝缘层上的第一硅层中,以在半导体衬底的暴露部分和第一绝缘层上的发射极层之上形成集电极层。 半导体层形成在基底沟槽的侧壁上,以形成与集电极层接触的集电极结构和与发射极层接触的发射极结构。 基底结构形成在基底沟槽中。 通过层间电介质层到集电极层,发射极层和基底结构形成多个连接。 基底结构优选是硅的化合物半导体材料和硅 - 锗,硅 - 锗 - 碳及其组合中的至少一种。
    • 90. 发明申请
    • SELF-ALIGNED LATERAL HETEROJUNCTION BIPOLAR TRANSISTOR
    • 自对准侧向异相双极晶体管
    • US20050101096A1
    • 2005-05-12
    • US10703284
    • 2003-11-06
    • Jian LiLap ChanPurakh VermaJia ZhengShao-Fu Chu
    • Jian LiLap ChanPurakh VermaJia ZhengShao-Fu Chu
    • H01L21/331H01L29/737H01L21/8222
    • H01L29/66242H01L29/737
    • A method for manufacturing a lateral heterojunction bipolar transistor (HBT) is provided comprising a semiconductor substrate having a first insulating layer over the semiconductor substrate. A base trench is formed in a first silicon layer over the first insulating layer to form a collector layer over an exposed portion of the semiconductor substrate and an emitter layer over the first insulating layer. A semiconductive layer is formed on the sidewalls of the base trench to form a collector structure in contact with the collector layer and an emitter structure in contact with the emitter layer. A base structure is formed in the base trench. A plurality of connections is formed through an interlevel dielectric layer to the collector layer, the emitter layer, and the base structure. The base structure preferably is a compound semiconductive material of silicon and at least one of silicon-germanium, silicon-germanium-carbon, and combinations thereof.
    • 提供一种用于制造横向异质结双极晶体管(HBT)的方法,包括半导体衬底上的第一绝缘层的半导体衬底。 基底沟槽形成在第一绝缘层上的第一硅层中,以在半导体衬底的暴露部分和第一绝缘层上的发射极层之上形成集电极层。 半导体层形成在基底沟槽的侧壁上,以形成与集电极层接触的集电极结构和与发射极层接触的发射极结构。 基底结构形成在基底沟槽中。 通过层间电介质层到集电极层,发射极层和基底结构形成多个连接。 基底结构优选是硅的化合物半导体材料和硅 - 锗,硅 - 锗 - 碳及其组合中的至少一种。