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    • 81. 发明授权
    • Semiconductor memory circuitry
    • 半导体存储器电路
    • US07057225B2
    • 2006-06-06
    • US10304804
    • 2002-11-26
    • Brent KeethPierre C Fazan
    • Brent KeethPierre C Fazan
    • H01L27/108H01L29/76H01L29/94H01L31/119
    • H01L27/105H01L27/108H01L27/10811Y10T29/49121
    • Processes are disclosed which facilitate improved high-density memory circuitry, most preferably dynamic random access memory (DRAM) circuitry. An integrated circuit includes a semiconductor die, a plurality of functional and operably addressable memory cells arranged in at least one array formed on the semiconductor die, and circuitry formed on the semiconductor die and coupled to the memory cells for permitting data to be written to and read from the memory cells. The memory cells are formed with a minimum capable photolithographic feature dimension. A single memory cell consumes an area of no more than eight times the square of the minimum capable photolithographic feature dimension.
    • 公开了促进改进的高密度存储器电路,最优选动态随机存取存储器(DRAM)电路的方法。 集成电路包括半导体管芯,布置在形成在半导体管芯上的至少一个阵列中的多个功能和可操作地寻址的存储器单元,以及形成在半导体管芯上并耦合到存储器单元的电路,用于允许数据被写入到 从内存单元读取。 存储单元由最小能力的光刻特征尺寸形成。 单个存储器单元消耗的面积不超过最小能力光刻特征尺寸的平方的八倍。
    • 82. 发明授权
    • Method and apparatus for data compression in memory devices
    • US06987702B2
    • 2006-01-17
    • US10879935
    • 2004-06-28
    • Brent Keeth
    • Brent Keeth
    • G11C11/00
    • G11C29/1201G11C29/40
    • A test circuit for a memory device having a pair of arrays each of which includes a plurality of memory cells arranged in rows and columns. A pair of complementary digit lines is provided for each column of each array. The digit lines are selectively coupled to a pair of I/O lines for each array which are, in turn, coupled to a pair of complementary data lines. The data lines are coupled to respective inputs of a DC sense amplifier, one of which is provided for each array. A multiplexer connects the pair of I/O lines for either one of the arrays to the data lines in a normal operating mode. Thus, in the normal operating mode, data are selectively coupled to the inputs of the DC sense amplifier from the complementary digit lines for an addressed column. In a test mode, the multiplexer connects the I/O lines for both arrays to the data lines to compress the data from the two arrays. Combinatorial logic then determines if both of the data lines have the same logical value, indicating disagreement between the data from the memory arrays that may indicate the presence of a defective memory cell in one or the other array. Thus, in the test mode, data are simultaneously coupled to the inputs of the DC sense amplifier from respective digit lines coupled to two different memory cells, thereby increasing the rate at which background data that has been written to the arrays can be read from the arrays.
    • 83. 发明申请
    • Method and apparatus for data compression in memory devices
    • US20050286326A1
    • 2005-12-29
    • US11218038
    • 2005-08-31
    • Brent Keeth
    • Brent Keeth
    • G11C29/00G11C29/40
    • G11C29/1201G11C29/40
    • A test circuit for a memory device having a pair of arrays each of which includes a plurality of memory cells arranged in rows and columns. A pair of complementary digit lines is provided for each column of each array. The digit lines are selectively coupled to a pair of I/O lines for each array which are, in turn, coupled to a pair of complementary data lines. The data lines are coupled to respective inputs of a DC sense amplifier, one of which is provided for each array. A multiplexer connects the pair of I/O lines for either one of the arrays to the data lines in a normal operating mode. Thus, in the normal operating mode, data are selectively coupled to the inputs of the DC sense amplifier from the complementary digit lines for an addressed column. In a test mode, the multiplexer connects the I/O lines for both arrays to the data lines to compress the data from the two arrays. Combinatorial logic then determines if both of the data lines have the same logical value, indicating disagreement between the data from the memory arrays that may indicate the presence of a defective memory cell in one or the other array. Thus, in the test mode, data are simultaneously coupled to the inputs of the DC sense amplifier from respective digit lines coupled to two different memory cells, thereby increasing the rate at which background data that has been written to the arrays can be read from the arrays.
    • 88. 发明授权
    • Method and apparatus for establishing and maintaining desired read latency in high-speed DRAM
    • 用于在高速DRAM中建立和维持期望的读延迟的方法和装置
    • US06762974B1
    • 2004-07-13
    • US10389807
    • 2003-03-18
    • Brian JohnsonBrent KeethFeng Lin
    • Brian JohnsonBrent KeethFeng Lin
    • G11C800
    • G11C7/222G11C7/1072G11C11/4076
    • A method and apparatus for managing the variable timing of internal clock signals derived from an external clock signal in order to compensate for uncertainty and variations in the amount of read clock back timing relative to data flow to achieve a specified read latency. A reset signal is generated at DRAM initialization and starts an first counter, which counts external clock cycles, and is also passed through the slave delay line of the delay lock loop to start a second counter. The counters run continuously once started and the difference in count values represent the internal delay as an external clock signal passes through the delay lock loop to produce an internal read clock signal. An internal read latency value is used to offset either counter to account for the internal read latency of the DRAM circuit. Once the non-offset counter is equivalent to the offset counter, read data is placed on an output line with a specified read latency and synchronized with the external read clock.
    • 一种用于管理从外部时钟信号导出的内部时钟信号的可变定时的方法和装置,以便补偿相对于数据流的读取时钟反馈时序的不确定性和变化,以实现指定的读取等待时间。 在DRAM初始化时产生复位信号,并启动计数外部时钟周期的第一计数器,并且还通过延迟锁定循环的从延迟线来启动第二个计数器。 一旦启动,计数器连续运行,当外部时钟信号通过延迟锁定环路以产生内部读取时钟信号时,计数值的差异代表内部延迟。 内部读延迟值用于抵消DRAM电路的内部读延迟。 一旦非偏移计数器等效于偏移计数器,读取数据将放置在具有指定读延迟并与外部读时钟同步的输出线上。
    • 89. 发明授权
    • Semiconductor memory circuitry including die sites sized for 256M to 275M memory cells in a 12″ wafer
    • 半导体存储器电路包括尺寸为12英寸晶圆中的256M至275M存储单元的模具位置
    • US06703656B2
    • 2004-03-09
    • US09917844
    • 2001-07-26
    • Brent KeethPierre C. Fazan
    • Brent KeethPierre C. Fazan
    • H01L2708
    • H01L27/105H01L27/108H01L27/10811Y10T29/49121
    • Processes are disclosed which facilitate improved high-density memory circuitry, most preferably dynamic random access memory (DRAM) circuitry. In accordance with aspects of the invention, considerably greater numbers of die sites per wafer are achieved for 6-inch, 8-inch and 12-inch wafers for 4M, 16M, 64M and 256M integration levels. Further, a semiconductor memory device includes i) a plurality of functional and operably addressable memory cells arranged in multiple memory arrays formed on a semiconductor die; and ii) circuitry formed on the semiconductor die permitting data to be written to and read from one or more of the memory cells, at least one of the memory arrays containing at least 100 square microns of continuous die surface area having at least 170 of the functional and operably addressable memory cells.
    • 公开了促进改进的高密度存储器电路,最优选动态随机存取存储器(DRAM)电路的方法。 根据本发明的方面,对于用于4M,16M,64M和256M积分级别的6英寸,8英寸和12英寸晶片,实现了相当大数量的每个晶片的晶片位置。 此外,半导体存储器件包括:i)布置在形成在半导体管芯上的多个存储器阵列中的多个功能和可操作地寻址的存储器单元; 以及ii)形成在所述半导体管芯上的电路,允许将数据写入到所述存储器单元中的一个或多个存储单元并从其读取,所述存储器阵列中的至少一个包含至少100平方微米的连续管芯表面区域,其具有至少170个 功能和可操作地寻址的存储单元。
    • 90. 发明授权
    • Voltage generator with stability indicator circuit
    • 电压发生器带稳定指示电路
    • US06696867B2
    • 2004-02-24
    • US09907565
    • 2001-07-18
    • Brent KeethLayne G. BunkerScott J. Derner
    • Brent KeethLayne G. BunkerScott J. Derner
    • G01R1900
    • G11C5/063G11C5/025G11C5/145G11C5/147G11C11/401G11C11/4074G11C11/4076G11C11/4097G11C11/4099G11C29/021G11C29/028G11C29/12G11C29/12005G11C29/46G11C29/787G11C2029/0407H01L27/10805H01L2224/4826H01L2224/73215H01L2924/1305H01L2924/13091H01L2924/00
    • A 256 Meg dynamic random access memory is comprised of a plurality of cells organized into individual arrays, with the arrays being organized into 32 Meg array blocks, which are organized into 64 Meg quadrants. Sense amplifiers are positioned between adjacent rows in the individual arrays while row decoders are positioned between adjacent columns in the individual arrays. In certain of the gap cells, multiplexers are provided to transfer signals from I/O lines to data lines. A datapath is provided which, in addition to the foregoing, includes array I/O blocks, responsive to the datalines from each quadrant to output data to a data read mux, data buffers, and data driver pads. The write data path includes a data in buffer and data write muxes for providing data to the array I/O blocks. A power bus is provided which minimizes routing of externally supplied voltages, completely rings each of the array blocks, and provides gridded power distribution within each of the array blocks. A plurality of voltage supplies provide the voltages needed in the array and in the peripheral circuits. The power supplies are organized to match their power output to the power demand and to maintain a desired ratio of power production capability and decoupling capacitance. A powerup sequence circuit is provided to control the powerup of the chip. Redundant rows and columns are provided as is the circuitry necessary to logically replace defective rows and columns with operational rows and columns. Circuitry is also provided on chip to support various types of test modes.
    • 一个256兆赫动态随机存取存储器由组成单独阵列的多个单元组成,阵列被组织成32兆赫阵列阵列,它们被组织成64兆象限。 感测放大器位于各个阵列中的相邻行之间,而行解码器位于各个阵列中的相邻列之间。 在某些间隙单元中,提供多路复用器以将信号从I / O线传送到数据线。 提供了一种数据路径,除了上述之外,还包括阵列I / O块,响应于每个象限的数据,将数据输出到数据读取多路复用器,数据缓冲器和数据驱动器焊盘。 写数据路径包括用于向阵列I / O块提供数据的缓冲器和数据写入多路复用器中的数据。 提供电源总线,其最小化外部提供的电压的路由,完全环绕每个阵列块,并且在每个阵列块内提供网格化的功率分配。 多个电压源提供阵列和外围电路中所需的电压。 电源组合以将其功率输出与功率需求相匹配,并保持所需的功率生产能力和去耦电容的比例。 提供上电序列电路以控制芯片的上电。 提供了冗余的行和列,就像使用操作行和列逻辑地替换有缺陷的行和列所需的电路一样。 芯片上还提供电路以支持各种类型的测试模式。