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    • 83. 发明授权
    • Substrate assembly having a depression suitable for an integrated circuit configuration and method for its fabrication
    • 具有适于集成电路结构的凹陷的衬底组件及其制造方法
    • US06608340B1
    • 2003-08-19
    • US09821853
    • 2001-03-30
    • Franz HofmannTill SchlösserJosef Willer
    • Franz HofmannTill SchlösserJosef Willer
    • H01L2972
    • H01L27/10864
    • A depression extends from a main surface of the substrate to the inside of said substrate and has an upper area and an adjacent lower area. A cross-section of the upper area, parallel to the main surface, is provided with at least one corner. A cross-section of the lower area, parallel to the main surface, matches the cross-section of the upper area, particularly in the vicinity the upper area, with the following difference: each corner is rounded, whereby the cross section of the lower area is smaller than the cross-section of the upper area. In order to produce the indentation, the upper area is provided with an auxiliary spacer that is rounded by isotropic etching. The lower area is produced by selectively etching the substrate to form an auxiliary spacer.
    • 凹陷从基板的主表面延伸到所述基板的内部,并且具有上部区域和相邻的下部区域。 平行于主表面的上部区域的横截面设置有至少一个角部。 平行于主表面的下部区域的横截面与上部区域的横截面特别是在上部区域附近匹配,具有以下差异:每个角都是圆形的,由此下部区域的横截面 面积小于上部区域的横截面。 为了产生凹陷,上部区域设置有通过各向同性蚀刻而被圆化的辅助间隔件。 通过选择性地蚀刻基板以形成辅助间隔物来产生下部区域。
    • 84. 发明授权
    • SOI DRAM without floating body effect
    • SOI DRAM无浮体效应
    • US06599797B1
    • 2003-07-29
    • US09980811
    • 2002-03-11
    • Franz HofmannJosef Willer
    • Franz HofmannJosef Willer
    • H01L218242
    • H01L27/10873H01L27/10888H01L27/1203
    • The invention relates to an SOI substrate which is provided with a recess that cuts through the silicon layer and the SiO2 layer (O). An upper part of said recess (V) which is located in the range of the silicon layer (S) has cylindrical shape with a horizontal first cross-section. A lower part of the recess (V) which is located in the range of the SiO2 layer (O), compared with the upper part of the recess (V), is bulged to such an extent that it has a cylindrical shape with a horizontal second cross-section that is larger than the first cross-section. A cylinder (Z) of an insulating material is provided in the recess (V). The horizontal cross-section of said cylinder corresponds to the first cross-section and the lower part thereof is located in the lower part of the recess (V). The dent laterally surrounds the lower part of the cylinder (Z). A conducting structure (L) is located in the dent and adjoins the silicon layer (S) and the silicon substrate (1) so that the channel zone of the MOS transistors is electrically connected to the silicon substrate.
    • 本发明涉及一种SOI衬底,其具有穿过硅层和SiO 2层(O)的凹部。 位于硅层(S)的范围内的所述凹部(V)的上部具有水平的第一横截面的圆筒形状。 与凹部(V)的上部相比,位于SiO 2层(O)的范围内的凹部(V)的下部被凸出到具有水平的圆筒形状的程度 第二横截面大于第一横截面。 在凹部(V)中设置绝缘材料的圆筒(Z)。 所述气缸的水平截面对应于第一横截面,其下部位于凹部(V)的下部。 凹陷横向围绕气缸(Z)的下部。 导电结构(L)位于凹陷中并与硅层(S)和硅衬底(1)相邻,使得MOS晶体管的沟道区电连接到硅衬底。
    • 85. 发明授权
    • Integrated circuit configuration having at least one transistor and one capacitor, and method for fabricating it
    • 具有至少一个晶体管和一个电容器的集成电路配置及其制造方法
    • US06593614B1
    • 2003-07-15
    • US09716336
    • 2000-11-20
    • Franz HofmannWolfgang Krautschneider
    • Franz HofmannWolfgang Krautschneider
    • H01L27108
    • H01L27/10852H01L27/10808H01L27/10823H01L27/10876
    • A patterned conductive layer and a structure via which a transistor can be driven, e.g. a word line, are disposed one above the other. A vertical conductive structure, e.g. a spacer, connects a first source/drain region of the transistor to the conductive layer, with which it forms a first capacitor electrode which has a large effective area in conjunction with a high packing density. A capacitor dielectric is disposed over the vertical conductive structure and the conductive layer, and a second capacitor electrode is disposed over the capacitor dielectric. The vertical conductive structure may be disposed on a first sidewall of the first source/drain region and a gate electrode of the transistor may be disposed on an adjoining second sidewall of the first source/drain region. The circuit configuration may form a DRAM cell configuration.
    • 图案化的导电层和可以驱动晶体管的结构,例如, 一个字线,一个在另一个之上。 垂直导电结构,例如 间隔件将晶体管的第一源极/漏极区域连接到导电层,由此形成第一电容器电极,其具有大的有效面积并结合高的堆积密度。 电容器电介质设置在垂直导电结构和导电层之上,并且第二电容器电极设置在电容器电介质上。 垂直导电结构可以设置在第一源极/漏极区域的第一侧壁上,并且晶体管的栅电极可以设置在第一源极/漏极区域的相邻的第二侧壁上。 电路配置可以形成DRAM单元配置。