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81. 发明申请

US20090057818A1 METHODS AND SYSTEMS INVOLVING ELECTRICALLY PROGRAMMABLE FUSES 有权
标题翻译：涉及电气可编程熔丝的方法和系统
公开(公告)号：US20090057818A1
公开(公告)日：2009-03-05
申请号：US11847379
申请日：2007-08-30
申请人： Deok-kee Kim , Keith Kwong Hon Wong , Chih-Chao Yang , Haining S. Yang
发明人： Deok-kee Kim , Keith Kwong Hon Wong , Chih-Chao Yang , Haining S. Yang
IPC分类号： H01L29/00
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： An electrically programmable fuse comprising a cathode member, an anode member, and a link member, wherein the cathode member, the anode member, and the link member each comprise one of a plurality of materials operative to localize induced electromigration in the programmable fuse.
摘要翻译：一种电可编程保险丝，包括阴极构件，阳极构件和连接构件，其中所述阴极构件，所述阳极构件和所述连接构件各自包括可操作地定位所述可编程熔丝中的感应电迁移的多种材料中的一种。

82. 发明申请

US20080308801A1 STRUCTURE FOR STOCHASTIC INTEGRATED CIRCUIT PERSONALIZATION 失效
标题翻译： STOCHASTIC集成电路个性化结构
公开(公告)号：US20080308801A1
公开(公告)日：2008-12-18
申请号：US12193288
申请日：2008-08-18
申请人： Lawrence A. Clevenger , Matthew E. Colburn , Timothy J. Dalton , Michael C. Gaidis , Louis L. C. Hsu , Carl Radens , Keith Kwong Hon Wong , Chih-Chao Yang
发明人： Lawrence A. Clevenger , Matthew E. Colburn , Timothy J. Dalton , Michael C. Gaidis , Louis L. C. Hsu , Carl Radens , Keith Kwong Hon Wong , Chih-Chao Yang
IPC分类号： H01L23/58
CPC分类号： H01L23/576 , H01L21/31144 , H01L23/544 , H01L28/20 , H01L28/40 , H01L2223/54433 , H01L2223/5444 , H01L2924/0002 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/00
摘要： A method of forming a stochastically based integrated circuit encryption structure includes forming a lower conductive layer over a substrate, forming a short prevention layer over the lower conductive layer, forming an intermediate layer over the short prevention layer, wherein the intermediate layer is characterized by randomly structured nanopore features. An upper conductive layer is formed over the random nanopore structured intermediate layer. The upper conductive layer is patterned into an array of individual cells, wherein a measurable electrical parameter of the individual cells has a random distribution from cell to cell with respect to a reference value of the electrical parameter.
摘要翻译：一种形成随机的集成电路加密结构的方法包括在衬底上形成下导电层，在下导电层上形成防短层，在短路防护层上形成中间层，其中中间层的特征是随机结构纳米孔特征。在无规纳米孔结构化中间层上形成上导电层。上导电层被图案化成单个单元的阵列，其中各个单元的可测量电参数相对于电参数的参考值具有从单元到单元的随机分布。

83. 发明授权

US07456420B2 Electrode for phase change memory device and method 有权
标题翻译：用于相变存储器件和方法的电极
公开(公告)号：US07456420B2
公开(公告)日：2008-11-25
申请号：US11308104
申请日：2006-03-07
申请人： Donna R. Cote , Ronald W. Mauthe , Keith Kwong Hon Wong
发明人： Donna R. Cote , Ronald W. Mauthe , Keith Kwong Hon Wong
IPC分类号： H01L47/00
CPC分类号： H01L45/06 , H01L27/2409 , H01L45/1233 , H01L45/1253 , H01L45/126 , H01L45/144 , H01L45/16 , H01L45/1641
摘要： An electrode for a memory material of a phase change memory device is disclosed. The electrode includes a first layer adhered to the memory material, the first layer including a nitride (ANx), where A is one of titanium (Ti) and tungsten (W) and x greater than zero, but is less than 1.0, and a second layer adhered to the first layer, the second layer including a nitride (ANy), where y is greater than or equal to 1.0. The multiple layer electrode allows the first layer to better adhere to chalcogenide based memory material, such as GST, than for example, stoichiometric TiN or WN, which prevents delamination. A phase change memory device and method are also disclosed.
摘要翻译：公开了一种用于相变存储器件的存储材料的电极。所述电极包括附着在所述记忆材料上的第一层，所述第一层包括氮化物（其中A是钛（Ti）和钨（W）中的一种，X大于零，但是小于1.0，第二层粘附到第一层，第二层包括氮化物（其中y大于或等于1.0）。多层电极允许第一层更好地粘附到基于硫族化物的记忆材料，例如GST，比例如化学计量的TiN或WN，其防止分层。还公开了相变存储器件和方法。

84. 发明申请

US20080243972A1 HIGH DENSITY PLANAR MAGNETIC DOMAIN WALL MEMORY APPARATUS AND METHOD OF FORMING THE SAME 有权
标题翻译：高密度平面磁畴壁记忆装置及其形成方法
公开(公告)号：US20080243972A1
公开(公告)日：2008-10-02
申请号：US11694183
申请日：2007-03-30
申请人： Michael C. Gaidis , Lawrence A. Clevenger , Timothy J. Dalton , John K. DeBrosse , Louis L.C. Hsu , Carl Radens , Keith Kwong Hon Wong , Chih-Chao Yang
发明人： Michael C. Gaidis , Lawrence A. Clevenger , Timothy J. Dalton , John K. DeBrosse , Louis L.C. Hsu , Carl Radens , Keith Kwong Hon Wong , Chih-Chao Yang
IPC分类号： G06F15/02
CPC分类号： G11C19/0841 , B82Y10/00 , G11C5/02 , G11C11/161 , G11C11/1675 , Y10T29/53165
摘要： A magnetic domain wall memory apparatus with write/read capability includes a plurality of coplanar shift register structures each comprising an elongated track formed from a ferromagnetic material having a plurality of magnetic domains therein, the shift register structures further having a plurality of discontinuities therein to facilitate domain wall location; a magnetic read element associated with each of the shift register structures; and a magnetic write element associated with each of the shift register structures, the magnetic write element further comprising a single write wire having a longitudinal axis substantially orthogonal to a longitudinal axis of each of the coplanar shift register structures.
摘要翻译：具有写入/读取功能的磁畴壁存储装置包括多个共面移位寄存器结构，每个包括由其中具有多个磁畴的铁磁材料形成的细长轨道，移位寄存器结构还具有多个不连续性，以便于域墙位置; 与每个移位寄存器结构相关联的磁读取元件; 以及与所述移位寄存器结构中的每一个相关联的磁写元件，所述磁写入元件还包括单个写入线，所述单个写入线的纵轴基本上与所述共面移位寄存器结构中的每一个的纵向轴线正交。

85. 发明申请

US20080220604A1 AIR BREAK FOR IMPROVED SILICIDE FORMATION WITH COMPOSITE CAPS 失效
标题翻译：用于改进硅酸盐形成与复合CAPS的空气破裂
公开(公告)号：US20080220604A1
公开(公告)日：2008-09-11
申请号：US12062592
申请日：2008-04-04
申请人： Robert J. Purtell , Keith Kwong Hon Wong
发明人： Robert J. Purtell , Keith Kwong Hon Wong
IPC分类号： H01L21/3205
CPC分类号： H01L21/28518 , H01L29/665 , H01L29/7833
摘要： Disclosed is a structure and method for tuning silicide stress and, particularly, for developing a tensile silicide region on a gate conductor of an n-FET in order to optimize n-FET performance. More particularly, a first metal layer-protective cap layer-second metal layer stack is formed on an n-FET structure. However, prior to the deposition of the second metal layer, the protective layer is exposed to air. This air break step alters the adhesion between the protective cap layer and the second metal layer and thereby, effects the stress imparted upon the first metal layer during silicide formation. The result is a more tensile silicide that is optimal for n-FET performance. Additionally, the method allows such a tensile silicide region to be formed using a relatively thin first metal layer-protective cap layer-second metal layer stack, and particularly, a relatively thin second metal layer, to minimize mechanical energy build up at the junctions between the gate conductor and the sidewall spacers to avoid silicon bridging.
摘要翻译：公开了一种用于调整硅化物应力的结构和方法，特别是用于在n-FET的栅极导体上形成拉伸硅化物区域，以优化n-FET性能。更具体地，在n-FET结构上形成第一金属层保护盖层 - 第二金属层堆叠。然而，在沉积第二金属层之前，保护层暴露于空气中。这种空气破碎步骤改变了保护盖层和第二金属层之间的粘附，从而在硅化物形成期间实现施加在第一金属层上的应力。结果是对于n-FET性能最佳的更强的硅化物。此外，该方法允许使用相对较薄的第一金属层 - 保护层 - 第二金属层堆叠形成这种拉伸硅化物区域，特别是相对较薄的第二金属层，以最小化在栅极导体和侧壁间隔件，以避免硅桥接。

86. 发明申请

US20080197499A1 STRUCTURE FOR METAL CAP APPLICATIONS 审中-公开
标题翻译：金属盖应用结构
公开(公告)号：US20080197499A1
公开(公告)日：2008-08-21
申请号：US11675296
申请日：2007-02-15
申请人： Chih-Chao Yang , Daniel C. Edelstein , Keith Kwong Hon Wong , Haining Yang
发明人： Chih-Chao Yang , Daniel C. Edelstein , Keith Kwong Hon Wong , Haining Yang
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L21/7684 , H01L21/76826 , H01L21/76834 , H01L21/76849 , H01L21/76885
摘要： An interconnect structure is provided in which the conductive features embedded within a dielectric material are capped with a metallic capping layer, yet no metallic residue is present on the surface of the dielectric material in the final structure. The inventive interconnect structure has improved dielectric breakdown strength as compared to prior art interconnect structures. Moreover, the inventive interconnect structure has better reliability and technology extendibility for the semiconductor industry. The inventive interconnect structure includes a dielectric material having at least one metallic capped conductive feature embedded therein, wherein a top portion of said at least one metallic capped conductive feature extends above an upper surface of the dielectric material. A dielectric capping layer is located on the dielectric material and it encapsulates the top portion of said at least one metallic capped conductive feature that extends above the upper surface of dielectric material.
摘要翻译：提供了一种互连结构，其中嵌入电介质材料内的导电特征被金属覆盖层封盖，但在最终结构中绝缘材料表面上没有金属残留物。与现有技术的互连结构相比，本发明的互连结构具有改善的介电击穿强度。此外，本发明的互连结构对于半导体工业具有更好的可靠性和技术可扩展性。本发明的互连结构包括具有嵌入其中的至少一个金属封盖的导电特征的电介质材料，其中所述至少一个金属封端的导电特征的顶部在电介质材料的上表面上方延伸。电介质覆盖层位于电介质材料上，并且封装在电介质材料的上表面上方延伸的所述至少一个金属封盖导电特征的顶部。

87. 发明申请

US20080157269A1 REVERSIBLE ELECTRIC FUSE AND ANTIFUSE STRUCTURES FOR SEMICONDUCTOR DEVICES 有权
标题翻译：用于半导体器件的可逆电源保险丝和抗反射结构
公开(公告)号：US20080157269A1
公开(公告)日：2008-07-03
申请号：US11619264
申请日：2007-01-03
申请人： Keith Kwong Hon Wong , Chih-Chao Yang , Haining S. Yang
发明人： Keith Kwong Hon Wong , Chih-Chao Yang , Haining S. Yang
IPC分类号： H01L29/00 , H01L21/02
CPC分类号： H01L23/5256 , H01L23/5252 , H01L28/24 , H01L2924/0002 , H01L2924/00
摘要： A structure and method of fabricating reversible fuse and antifuse structures for semiconductor devices is provided. In one embodiment, the method includes forming at least one line having a via opening for exposing a portion of a plurality of interconnect features; conformally depositing a first material layer over the via opening; depositing a second material layer over the first material layer, wherein the depositing overhangs a portion of the second material layer on a top portion of the via opening; and depositing a blanket layer of insulating material, where the depositing forms a plurality of fuse elements each having an airgap between the insulating material and the second material layer. The method further includes forming a plurality of electroplates in the insulator material connecting the fuse elements. In another embodiment, the method includes depositing a first and a second material layer on a semiconductor substrate, wherein the second material layer having a higher electrical conductivity than the first material layer; selectively etching the first and second material layer to create at least one constricted region to facilitate electromigration of the second material; wherein the electromigration creates a plurality of micro voids; and forming a plurality of electrical contacts on the second material layer.
摘要翻译：提供一种用于制造用于半导体器件的可逆熔丝和反熔丝结构的结构和方法。在一个实施例中，该方法包括形成至少一条线，其具有用于暴露多个互连特征的一部分的通孔; 在通孔开口上共形沉积第一材料层; 在所述第一材料层上沉积第二材料层，其中所述沉积在所述通孔开口的顶部部分上突出所述第二材料层的一部分; 以及沉积绝缘材料的覆盖层，其中所述沉积形成多个熔丝元件，每个熔丝元件在所述绝缘材料和所述第二材料层之间具有气隙。该方法还包括在连接熔丝元件的绝缘体材料中形成多个电镀层。在另一个实施例中，该方法包括在半导体衬底上沉积第一和第二材料层，其中第二材料层具有比第一材料层更高的导电性; 选择性地蚀刻第一和第二材料层以产生至少一个收缩区域以促进第二材料的电迁移; 其中所述电迁移产生多个微空隙; 以及在所述第二材料层上形成多个电接触。

88. 发明申请

US20080111162A1 STRUCTURE AND METHOD FOR DUAL SURFACE ORIENTATIONS FOR CMOS TRANSISTORS 失效
标题翻译： CMOS晶体管双面指向的结构与方法
公开(公告)号：US20080111162A1
公开(公告)日：2008-05-15
申请号：US11559571
申请日：2006-11-14
申请人： Haining Yang , Thomas W. Dyer , Keith Kwong Hon Wong , Chih-Chao Yang
发明人： Haining Yang , Thomas W. Dyer , Keith Kwong Hon Wong , Chih-Chao Yang
IPC分类号： H01L29/04 , H01L21/311
CPC分类号： H01L21/30608 , H01L21/02381 , H01L21/02433 , H01L21/02532 , H01L21/02609 , H01L21/02639 , H01L21/823821 , H01L27/11 , H01L27/1104 , H01L29/7853
摘要： The present invention provides structures and methods for providing facets with different crystallographic orientations than what a semiconductor substrate normally provides. By masking a portion of a semiconductor surface and exposing the rest to an anisotripic etch process that preferentially etches a set of crystallographic planes faster than others, new facets with different surface orientations than the substrate orientation are formed on the semiconductor substrate. Alternatively, selective epitaxy may be utilized to generate new facets. The facets thus formed are joined to form a lambda shaped profile in a cross-section. The electrical properties of the new facets, specifically, the enhanced carrier mobility, are utilized to enhance the performance of transistors. In a transistor with a channel on the facets that are joined to form a lambda shaped profile, the current flows in the direction of the ridge joining the facets avoiding any inflection in the direction of the current.
摘要翻译：本发明提供了提供具有不同于半导体衬底通常提供的不同晶体取向的刻面的结构和方法。通过掩蔽半导体表面的一部分并将其余部分暴露于比其它晶体学优化蚀刻一组结晶平面的各向异性蚀刻工艺，在半导体衬底上形成具有不同于衬底取向的不同表面取向的新面。或者，可以利用选择性外延生成新的面。如此形成的小面被连接以在横截面中形成λ形轮廓。新面的电特性，特别是增强的载流子迁移率被用于增强晶体管的性能。在具有接合形成λ形轮廓的小平面上的通道的晶体管中，电流沿连接小面的脊的方向流动，避免了在电流方向上的任何拐点。

89. 发明授权

US07365001B2 Interconnect structures and methods of making thereof 有权
标题翻译：互连结构及其制造方法
公开(公告)号：US07365001B2
公开(公告)日：2008-04-29
申请号：US10735845
申请日：2003-12-16
申请人： Chih-Chao Yang , Louis L. Hsu , Keith Kwong Hon Wong , Timothy Joseph Dalton , Carl Radens , Larry Clevenger
发明人： Chih-Chao Yang , Louis L. Hsu , Keith Kwong Hon Wong , Timothy Joseph Dalton , Carl Radens , Larry Clevenger
IPC分类号： H01L21/4763
CPC分类号： H01L21/76844 , H01L21/76802 , H01L21/76805 , H01L21/76807 , H01L21/76834 , H01L21/76849 , H01L21/76862 , H01L23/5226 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： A method of making a diffusion barrier for a interconnect structure. The method comprises: providing a conductive line in a bottom dielectric trench; depositing a sacrificial liner on the cap layer; depositing an interlayer dielectric; forming a trench and a via in the top interlayer dielectric; and removing a portion of the cap layer and the sacrificial layer proximate to the bottom surface of the via. The removed portions of the cap layer and sacrificial layer deposit predominantly along the lower sidewalls of the via. The conductive line is in contact with a cap layer, and the sacrificial layer is in contact with the cap layer. The invention is also directed to the interconnect structures resulting from the inventive process.
摘要翻译：制造互连结构的扩散阻挡层的方法。该方法包括：在底部电介质沟槽中提供导线; 在所述盖层上沉积牺牲衬垫; 沉积层间电介质; 在顶层间电介质中形成沟槽和通孔; 以及去除靠近通孔底表面的覆盖层和牺牲层的一部分。盖层和牺牲层的去除部分主要沿着通孔的下侧壁沉积。导线与盖层接触，牺牲层与盖层接触。本发明还涉及由本发明方法产生的互连结构。

90. 发明授权

US07179760B2 Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same 失效
标题翻译：双层盖结构，包括用于导电金属化的HDP / bHDP膜及其制造方法
公开(公告)号：US07179760B2
公开(公告)日：2007-02-20
申请号：US10908833
申请日：2005-05-27
申请人： Richard A. Conti , Thomas F. Houghton , Michael F. Lofaro , Jeffery B. Maxson , Ann H. McDonald , Yun-Yu Wang , Keith Kwong Hon Wong , Daewon Yang
发明人： Richard A. Conti , Thomas F. Houghton , Michael F. Lofaro , Jeffery B. Maxson , Ann H. McDonald , Yun-Yu Wang , Keith Kwong Hon Wong , Daewon Yang
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L23/53238 , H01L21/28556 , H01L21/76849 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a bilayer cap structure for interconnect structures that comprise copper metallization or other conductive metallization. Such bilayer cap structure includes a first cap layer formed by an unbiased high density plasma (HDP) chemical vapor deposition process, and a second cap layer over the first cap layer, where the second cap layer is formed by a biased high density plasma (bHDP) chemical vapor deposition process. During the bHDP chemical vapor deposition process, a low AC bias power is applied to the substrate to increase the ion bombardment on the substrate surface and to induce resputtering of the capping material, thereby forming a seamless second cap layer with excellent reactive ion etching (RIE) selectivity.
摘要翻译：本发明涉及一种用于互连结构的双层盖结构，其包括铜金属化或其它导电金属化。这种双层盖结构包括通过无偏高密度等离子体（HDP）化学气相沉积工艺形成的第一盖层和在第一盖层上的第二盖层，其中第二盖层由偏置的高密度等离子体（bHDP ）化学气相沉积工艺。在bHDP化学气相沉积工艺期间，将低AC偏置功率施加到衬底上以增加衬底表面上的离子轰击并引起封盖材料的再溅射，从而形成具有优异的反应离子蚀刻（RIE）的无缝第二帽层）选择性。

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